Vim yog cov txheej txheem nyuaj ntawm PCB kev tsim khoom, nyob rau hauv kev npaj thiab kev tsim kho ntawm kev tsim khoom ntse, nws yog ib qho tsim nyog los txiav txim siab txog kev ua haujlwm ntawm cov txheej txheem thiab kev tswj hwm, thiab tom qab ntawd ua tiav cov txheej txheem automation, cov ntaub ntawv thiab cov txheej txheem ntse.
Txheej txheem kev faib tawm
Raws li tus naj npawb ntawm PCB txheej, nws tau muab faib ua ib sab, ob sab, thiab ntau txheej boards.Peb lub rooj tsavxwm txheej txheem tsis zoo ib yam.
Tsis muaj txheej txheem txheej txheej sab hauv rau ib sab thiab ob sab vaj huam sib luag, pib txiav-drilling-tom qab txheej txheem.
Multilayer boards yuav muaj cov txheej txheem sab hauv
1) Ib leeg vaj huam sib luag txheej txheem ntws
Txiav thiab edging → drilling → txheej txheej graphics → (tag nrho board kub plating) → etching → soj ntsuam → silk screen solder daim npog qhov ncauj → ( cua kub leveling) → silk screen cim → puab → kuaj → tshuaj xyuas
2) txheej txheem ntws ntawm ob sab tin spraying board
Txiav ntug sib tsoo → drilling → hnyav tooj liab thickening → txheej txheej duab → tin plating, etching tin tshem tawm → theem nrab drilling → tshuaj ntsuam → tshuaj ntsuam luam ntawv solder daim npog qhov ncauj → kub-plated plug → cua kub leveling → silk screen cim → puab ua → kuaj → xeem
3) txheej txheem ob-sided npib tsib xee-kub plating
Txiav ntug sib tsoo → drilling → hnyav tooj liab thickening → txheej txheej duab → npib tsib xee plating, kub tshem tawm thiab etching → theem nrab drilling → tshuaj ntsuam → tshuaj ntsuam luam ntawv solder daim npog qhov ncauj → tshuaj ntsuam luam ntawv cim → puab ua → kuaj → tshuaj xyuas
4) Multi-layer board tin spraying txheej txheem ntws
Txiav thiab sib tsoo → drilling positioning qhov → puab txheej graphics → puab txheej etching → soj ntsuam → blackening → lamination → drilling → hnyav tooj liab thickening → txheej txheej graphics → tin plating, etching tin tshem tawm → theem nrab drilling → tshuaj xyuas → Silk screen solder mask → Kub -plated plug → Cua kub leveling → Silk screen cim → Shape processing → Test → Inspection
5) Cov txheej txheem ntws ntawm npib tsib xee thiab kub plating ntawm cov laug cam multilayer
Txiav thiab sib tsoo → drilling positioning qhov → puab txheej graphics → puab txheej etching → soj ntsuam → blackening → lamination → drilling → hnyav tooj liab thickening → txheej txheej graphics → kub plating, zaj duab xis tshem tawm thiab etching → theem nrab drilling → tshuaj xyuas → Screen printing solder daim npog qhov ncauj → npo luam ntawv cim → zoo li ua → kuaj → tshuaj xyuas
6) Cov txheej txheem ntws ntawm ntau txheej phaj immersion npib tsib xee kub phaj
Txiav thiab sib tsoo → drilling positioning qhov → puab txheej graphics → puab txheej etching → soj ntsuam → blackening → lamination → drilling → hnyav tooj liab thickening → txheej txheej graphics → tin plating, etching tin tshem tawm → theem nrab drilling → tshuaj xyuas → Silk screen solder mask → Tshuaj Immersion Nickel Kub → Silk screen cim → Cov duab ua haujlwm → Test → Inspection
Inner layer production (graphic transfer)
Sab hauv txheej: txiav board, txheej txheej ua ntej, laminating, raug, DES kev twb kev txuas
Txiav (Board Cut)
1) Txiav board
Lub Hom Phiaj: Txiav cov ntaub ntawv loj rau hauv qhov loj me uas tau teev tseg los ntawm MI raws li qhov yuav tsum tau ua ntawm kev txiav txim (txiav cov khoom siv substrate rau qhov loj me uas yuav tsum tau ua los ntawm kev ua haujlwm raws li kev npaj yuav tsum tau ua ua ntej tsim khoom)
Cov ntaub ntawv tseem ceeb: puag phaj, saw hniav
Lub substrate yog ua los ntawm tooj liab ntawv thiab insulating laminate.Muaj qhov sib txawv thickness specifications raws li qhov yuav tsum tau muaj.Raws li cov tooj liab tuab, nws tuaj yeem muab faib ua H / H, 1OZ / 1OZ, 2OZ / 2OZ, thiab lwm yam.
Cov kev ceev faj:
ib.Txhawm rau kom tsis txhob muaj kev cuam tshuam ntawm board ntug barry ntawm qhov zoo, tom qab txiav, ntug yuav polished thiab sib npaug.
b.Xav txog qhov cuam tshuam ntawm kev nthuav dav thiab kev cog lus, lub rooj txiav txiav yog ci ua ntej xa mus rau cov txheej txheem
c.Txiav yuav tsum tau them sai sai rau lub hauv paus ntsiab lus ntawm kev coj ua zoo ib yam
Edging / rounding: mechanical polishing yog siv los tshem tawm cov iav fibers sab laug los ntawm txoj cai kaum ntawm plaub sab ntawm lub rooj tsavxwm thaum txiav, kom txo tau khawb / khawb ntawm lub rooj tsavxwm nto hauv cov txheej txheem tsim khoom, ua rau muaj teeb meem tsis zoo.
Baking phaj: tshem tawm cov dej vapor thiab cov organic volatiles los ntawm ci, tso cov kev ntxhov siab sab hauv, txhawb kev sib txuas cov tshuaj tiv thaiv, thiab ua rau kom muaj kev ruaj ntseg, tshuaj lom neeg ruaj khov thiab lub zog ntawm lub phaj.
Tswj cov ntsiab lus:
Sheet khoom: vaj huam sib luag loj, thickness, daim ntawv hom, tooj liab thickness
Kev khiav hauj lwm: ci lub sij hawm / kub, stacking qhov siab
(2) Ntau lawm txheej txheej tom qab txiav board
Muaj nuj nqi thiab lub hauv paus ntsiab lus:
Lub phaj tooj liab sab hauv roughened los ntawm kev sib tsoo phaj yog qhuav los ntawm kev sib tsoo phaj, thiab tom qab cov zaj duab xis qhuav IW txuas, nws yog irradiated nrog UV teeb (ultraviolet rays), thiab cov zaj duab xis raug qhuav yuav nyuaj.Nws tsis tuaj yeem yaj hauv cov alkali tsis muaj zog, tab sis tuaj yeem yaj hauv cov alkali muaj zog.Qhov tsis pom kev tuaj yeem yaj nyob rau hauv tsis muaj zog alkali, thiab sab hauv Circuit Court yog siv cov yam ntxwv ntawm cov khoom siv los hloov cov duab mus rau qhov chaw tooj liab, uas yog, hloov duab.
Paub meej
Lub photosensitive pib nyob rau hauv lub resist nyob rau hauv cov cheeb tsam raug absorbs photons thiab decomposes rau hauv dawb radicals.Cov dawb radicals pib ib qho kev sib txuas ntawm cov tshuaj tiv thaiv ntawm cov monomers los tsim cov qauv spatial network macromolecular uas yog insoluble hauv dilute alkali.Nws yog soluble hauv dilute alkali tom qab cov tshuaj tiv thaiv.
Siv ob qho kom muaj qhov sib txawv ntawm cov khoom sib txawv hauv tib txoj kev daws kom hloov cov qauv tsim ntawm qhov tsis zoo rau lub substrate kom tiav cov duab hloov chaw).
Cov qauv Circuit Court yuav tsum muaj qhov kub thiab txias, feem ntau xav tau qhov kub ntawm 22 +/-3 ℃ thiab av noo ntawm 55 +/-10% los tiv thaiv zaj duab xis los ntawm deforming.Cov plua plav hauv huab cua yuav tsum tau siab.Raws li qhov ceev ntawm cov kab nce thiab cov kab ua me me, cov hmoov av cov ntsiab lus tsawg dua los yog sib npaug rau 10,000 lossis ntau dua.
Khoom Taw Qhia:
Zaj duab xis qhuav: Zaj duab xis qhuav photoresist luv luv yog cov dej-soluble resist film.Lub thickness feem ntau yog 1.2mil, 1.5mil thiab 2mil.Nws muab faib ua peb txheej: polyester tiv thaiv zaj duab xis, polyethylene diaphragm thiab photosensitive zaj duab xis.Lub luag hauj lwm ntawm polyethylene diaphragm yog los tiv thaiv cov mos mos zaj duab xis barrier tus neeg saib xyuas los ntawm lo rau saum npoo ntawm polyethylene tiv thaiv zaj duab xis thaum lub sij hawm kev thauj mus los thiab cia lub sij hawm ntawm dov qhuav zaj duab xis.Cov yeeb yaj kiab tiv thaiv tuaj yeem tiv thaiv cov pa oxygen los ntawm kev nkag mus rau hauv txheej txheej thaiv thiab cuam tshuam nrog cov dawb radicals hauv nws ua rau photopolymerization.Cov zaj duab xis qhuav uas tsis tau polymerized yog yooj yim ntxuav los ntawm sodium carbonate tov.
Cov yeeb yaj kiab ntub dej: Cov yeeb yaj kiab ntub dej yog ib qho ua kua photosensitive zaj duab xis, feem ntau yog tsim los ntawm high-rhiab heev resin, sensitizer, pigment, muab tub lim thiab ib qho me me ntawm cov kuab tshuaj.viscosity ntau lawm yog 10-15dpa.s, thiab nws muaj corrosion kuj thiab electroplating kuj., ntub zaj duab xis txheej txheej muaj xws li tshuaj ntsuam luam ntawv thiab tshuaj tsuag.
Txheej txheem qhia:
Qhuav zaj duab xis imaging txoj kev, cov txheej txheem ntau lawm yog raws li nram no:
Pre-kho-lamination-exposure-development-etching-film tshem tawm
Ua ntej
Lub Hom Phiaj: Tshem tawm cov kab mob ntawm qhov chaw tooj liab, xws li roj oxide txheej thiab lwm yam impurities, thiab ua kom cov roughness ntawm tooj liab nto los pab txhawb cov txheej txheem lamination tom ntej
Main raw khoom: txhuam log
Txoj kev ua ntej ua ntej:
(1) Sandblasting thiab sib tsoo txoj kev
(2) Txoj kev kho tshuaj
(3) Mechanical sib tsoo txoj kev
Lub hauv paus ntsiab lus ntawm txoj kev kho tshuaj: Siv cov khoom siv tshuaj xws li SPS thiab lwm yam tshuaj acidic kom tsis tu ncua tom cov tooj liab kom tshem tawm cov impurities xws li roj thiab oxides ntawm tooj liab.
Tshuaj ntxuav:
Siv cov tshuaj alkaline kom tshem tawm cov roj stains, cov ntiv tes thiab lwm cov organic av ntawm qhov chaw tooj liab, tom qab ntawd siv cov kua qaub kom tshem tawm cov oxide txheej thiab cov txheej tiv thaiv ntawm tus thawj tooj liab substrate uas tsis tiv thaiv tooj liab los ntawm oxidized, thiab thaum kawg ua micro- etching kev kho kom tau ib tug qhuav zaj duab xis Tag nrho roughened nto nrog zoo heev adhesion zog.
Tswj cov ntsiab lus:
ib.Sib tsoo ceev (2.5-3.2mm / min)
b.Hnav caws pliav dav (500 # koob txhuam hnav caws pliav dav: 8-14mm, 800 # non-woven npuag hnav caws pliav dav: 8-16mm), ntsuas dej zeb, ziab kub (80-90 ℃)
Lamination
Lub Hom Phiaj: Muab cov yeeb yaj kiab los tiv thaiv corrosive rau ntawm tooj liab ntawm cov txheej txheem substrate los ntawm kev kub nias.
Cov ntaub ntawv tseem ceeb: zaj duab xis qhuav, hom kev daws teeb meem, hom duab duab semi-aqueous, dej-soluble qhuav zaj duab xis yog tsim los ntawm cov organic acid radicals, uas yuav ua rau muaj zog alkali ua rau nws cov organic acid radicals.Qhuav.
Lub hauv paus ntsiab lus: Yob zaj duab xis qhuav (zaj duab xis): ua ntej tev tawm cov yeeb yaj kiab polyethylene los ntawm cov yeeb yaj kiab qhuav, thiab tom qab ntawd muab cov yeeb yaj kiab qhuav tiv thaiv rau ntawm cov tooj liab clad board nyob rau hauv cov cua kub thiab cov cua kub, qhov kev tiv thaiv nyob rau hauv qhuav zaj duab xis txheej yuav softened los ntawm cua sov thiab nws fluidity nce.Cov zaj duab xis yog ua tiav los ntawm lub siab ntawm cov kub pressing roller thiab qhov kev txiav txim ntawm cov nplaum nyob rau hauv lub resist.
Peb lub ntsiab ntawm reel qhuav zaj duab xis: siab, kub, kis ceev
Tswj cov ntsiab lus:
ib.Filming ceev (1.5+/-0.5m/min), filming siab (5+/-1kg/cm2), filming kub (110+/——10 ℃), tawm kub (40-60 ℃)
b.Cov zaj duab xis ntub dej: number case viscosity, txheej ceev, txheej thickness, pre-ci lub sij hawm / kub (5-10 feeb rau thawj sab, 10-20 feeb rau sab thib ob)
Nphav
Lub hom phiaj: Siv lub teeb ci los hloov cov duab ntawm thawj zaj duab xis mus rau photosensitive substrate.
Cov ntaub ntawv tseem ceeb: Cov yeeb yaj kiab uas siv rau hauv txheej sab hauv ntawm cov yeeb yaj kiab yog cov yeeb yaj kiab tsis zoo, uas yog, qhov chaw xa xov dawb yog polymerized, thiab qhov dub yog opaque thiab tsis hnov mob.Cov zaj duab xis siv nyob rau hauv txheej txheej yog ib tug zoo zaj duab xis, uas yog lub opposite ntawm cov zaj duab xis siv nyob rau hauv lub puab txheej.
Lub hauv paus ntsiab lus ntawm qhuav zaj duab xis raug: Lub photosensitive pib nyob rau hauv lub resist nyob rau hauv lub cheeb tsam absorbs photons thiab decomposes rau hauv dawb radicals.Cov dawb radicals pib hla kev sib txuas cov tshuaj tiv thaiv ntawm monomers los tsim ib lub network spatial macromolecular qauv insoluble hauv dilute alkali.
Cov ntsiab lus tswj: kev sib raug zoo, lub zog raug, raug lub teeb pom kev zoo (6-8 qib npog zaj duab xis), lub sijhawm nyob.
Kev tsim kho
Lub Hom Phiaj: Siv cov lye los ntxuav qhov chaw ntawm cov yeeb yaj kiab qhuav uas tsis muaj tshuaj lom neeg.
Cov khoom tseem ceeb: Na2CO3
Cov zaj duab xis qhuav uas tsis tau dhau los ua polymerization yog ntxuav tawm, thiab cov zaj duab xis qhuav uas tau dhau los ua polymerization yog khaws cia rau saum npoo ntawm lub rooj tsavxwm raws li kev tiv thaiv txheej thaum etching.
Txoj hauv kev loj hlob: Cov pab pawg nquag nyob rau hauv qhov tsis raug ntawm cov yeeb yaj kiab photosensitive hnov mob nrog cov tshuaj alkali dilute los tsim cov tshuaj soluble thiab yaj, yog li soluble qhov tsis raug, thaum cov yeeb yaj kiab qhuav ntawm qhov chaw raug tsis yaj.