| Annus | Milestones |
| July MMIII | Fastline circuitus eriges |
| Mar MMIV | Shenzhen Bao officium satus ad agunt |
| Mar MMIV | Shenzhen environmental tutela provectus unitas |
| May-IV | ISO9001: MM |
| May-IV | ISO14001: MMIV |
| May-IV | Ts16949: MMII |
| Augustinus MMIV | Area D expansion |
| May-V | Ul certifiaction |
| Sep.2005 | Onus productio |
| Feb.2006 | Fastline metallum Core PCB division statutum |
| May.2007 | Productio patet |
| July.2007 | CQC |
| Sep.2007 | Join Shenzhen PCB industria assiciation |
| Sep.2007 | Aeris PCB PCB manufacturing Capability |
| Oct.2007 | XXVI layers PCB facultatem |
| Mar.2008 | Aaa Consuetudines High Credit Enterprise |
| Iun-VIII | Ts16949: MMIX |
| Mar.2010 | A major breakthrough de HDI Board, import laser terebro machinis |
| Apr.2011 | Fastine PCB conventus institutum |
| May-XI | PCB CXX (VIIIV PCB Capability |
| Iun XII | Iso13485 |
| Mar XII | Patria summus tech inceptum |