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    • PCB process edge

      The PCB process edge is a long blank board edge set for the track transmission position and placement of imposition Mark points during SMT processing. The width of the process edge is generally about 5-8mm. In the PCB design process, due to some reasons, the distance between the edge of the compo...
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    • Global and China Automotive PCB (Printed Circuit Boards) Market Review

      Automotive PCB research: vehicle intelligence and electrification bring about demand for PCBs, and local manufacturers come to the fore. The COVID-19 epidemic in 2020 slashed the global vehicle sales and led to a big shrinkage of the industry scale to USD6,261 million. Yet the gradual epidemic co...
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    • Exposure

      Exposure means that under the irradiation of ultraviolet light, the photoinitiator absorbs the light energy and decomposes into free radicals, and the free radicals then initiate the photopolymerization monomer to carry out the polymerization and crosslinking reaction. Exposure is generally carri...
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    • What is the relationship between PCB wiring, through hole and current carrying capacity?

      The electrical connection between the components on the PCBA is achieved through copper foil wiring and through-holes on each layer.  The electrical connection between the components on the PCBA is achieved through copper foil wiring and through-holes on each layer.  Due to the different products...
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    • Function introduction of each layer of multi-layer PCB circuit board

      Multilayer circuit boards contain many types of working layers, such as: protective layer, silk screen layer, signal layer, internal layer, etc. How much do you know about these layers? The functions of each layer are different, let us Let’s take a look at what the functions of each level h...
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    • Introduction and advantages and disadvantages of ceramic PCB board

      Introduction and advantages and disadvantages of ceramic PCB board

      1. Why use ceramic circuit boards Ordinary PCB is usually made of copper foil and substrate bonding, and the substrate material is mostly glass fiber (FR-4), phenolic resin (FR-3) and other materials, adhesive is usually phenolic, epoxy, etc.  In the process of PCB processing due to thermal stres...
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    • Infrared + hot air reflow soldering

      Infrared + hot air reflow soldering

       In the mid-1990s, there was a trend to transfer to infrared + hot air heating in reflow soldering in Japan. It is heated by 30% infrared rays and 70% hot air as a heat carrier. The infrared hot air reflow oven effectively combines the advantages of infrared reflow and forced convection hot air r...
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    • What is PCBA processing?

      PCBA processing is a finished product of PCB bare board after SMT patch, DIP plug-in and PCBA test, quality inspection and assembly process, referred to as PCBA.  The entrusting party delivers the processing project to the professional PCBA processing factory, and then waits for the finished prod...
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    • Etching

      PCB board etching process, which uses traditional chemical etching processes to corrode unprotected areas. Kind of like digging a trench, a viable but inefficient method. In the etching process, it is also divided into a positive film process and a negative film process. The positive film process...
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    • Printed Circuit Board Global Market Report 2022

      Printed Circuit Board Global Market Report 2022

      Major players in the printed circuit board market are TTM Technologies, Nippon Mektron Ltd, Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, and Sumitomo Electric Industries. The globa...
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    • 1. DIP package

      1. DIP package

      DIP package (Dual In-line Package), also known as dual in-line packaging technology, refers to integrated circuit chips that are packaged in dual in-line form. The number generally does not exceed 100. A DIP packaged CPU chip has two rows of pins that need to be inserted into a chip socket with a...
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    • Difference Between FR-4 Material and Rogers Material

      Difference Between FR-4 Material and Rogers Material

      1. FR-4 material is cheaper than Rogers material 2. Rogers material has high frequency compared to FR-4 material. 3. The Df or dissipation factor of the FR-4 material is higher than that of the Rogers material, and the signal loss is greater. 4. In terms of impedance stability, the Dk value range...
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