1. Layout according to circuit modules, and related circuits that realize the same function are called a module. The components in the circuit module should adopt the principle of nearby concentration, and the digital circuit and the analog circuit should be separated;
2. No components or devices shall be mounted within 1.27mm of non-mounting holes such as positioning holes, standard holes, and 3.5mm (for M2.5) and 4mm (for M3) of 3.5mm (for M2.5) and 4mm (for M3) shall not be allowed to mount components;
3. Avoid placing vias under the horizontally mounted resistors, inductors (plug-ins), electrolytic capacitors and other components to avoid short-circuiting the vias and the component housing after wave soldering;
4. The distance between the outside of the component and the edge of the board is 5mm;
5. The distance between the outside of the mounting component pad and the outside of the adjacent interposing component is greater than 2mm;
6. Metal shell components and metal parts (shielding boxes, etc.) can not touch other components, can not be close to printed lines, pads, and their spacing should be greater than 2mm. The size of the positioning holes, fastener installation holes, oval holes and other square holes in the board from the edge of the board is greater than 3mm;
7. The heating element should not be in close proximity to the wire and the heat-sensitive element; the high-heating device should be evenly distributed;
8. The power socket should be arranged around the printed board as far as possible, and the power socket and the bus bar terminal connected to it should be arranged on the same side. Particular care should be taken not to arrange power sockets and other welding connectors between the connectors to facilitate the welding of these sockets and connectors, as well as the design and tie-up of power cables. The arrangement spacing of power sockets and welding connectors should be considered to facilitate the plugging and unplugging of power plugs;
9. Arrangement of other components: All IC components are aligned on one side, and the polarity of polar components is clearly marked. The polarity of the same printed board cannot be marked more than two directions. When two directions appear, the two directions are perpendicular to each other ;
10. The wiring on the board surface should be dense and dense. When the density difference is too large, it should be filled with mesh copper foil, and the grid should be greater than 8mil (or 0.2mm);
11. There should be no through holes on the SMD pads to avoid solder paste loss and false soldering of components. Important signal lines are not allowed to pass between the socket pins;
12. The patch is aligned on one side, the character direction is the same, and the packaging direction is the same;
13. As far as possible, the polarized devices should be consistent with the polarity marking direction on the same board.
10. The wiring on the board surface should be dense and dense. When the density difference is too large, it should be filled with mesh copper foil, and the grid should be greater than 8mil (or 0.2mm);
11. There should be no through holes on the SMD pads to avoid solder paste loss and false soldering of components. Important signal lines are not allowed to pass between the socket pins;
12. The patch is aligned on one side, the character direction is the same, and the packaging direction is the same;
13. As far as possible, the polarized devices should be consistent with the polarity marking direction on the same board.