Zeziphi iingenelo zokutyabeka ngegolide kunye nesilivere kwiibhodi zePCB?

Abadlali abaninzi be-DIY baya kufumanisa ukuba imibala yePCB esetyenziswa ziimveliso ezahlukeneyo zebhodi kwimarike iyakhazimla.Eyona mibala ixhaphakileyo yePCB imnyama, eluhlaza, eluhlaza, emthubi, emfusa, ebomvu namdaka.Abanye abavelisi baphuhlise ngobuchule iiPCB zemibala eyahlukeneyo enjemhlophe kunye nepinki.

 

Kwimbonakalo yemveli, i-PCB emnyama ibonakala ibekwe kwindawo ephezulu, ngelixa ibomvu kunye netyheli zinikezelwe kwisiphelo esiphantsi.Ngaba akunjalo?

 

Umaleko wobhedu we-PCB ongagqunywanga ngemaski ye-solder ufakwa ioksijini ngokulula xa utyhilekile emoyeni

Siyazi ukuba amacala omabini ePCB ngamaleko obhedu.Kwimveliso ye-PCB, umaleko wobhedu uya kufumana indawo egudileyo kwaye engakhuselekanga kungakhathaliseki ukuba yenziwe ngeendlela ezongezelelweyo okanye ezikhuphayo.

Nangona iipropathi zeekhemikhali zobhedu zingasebenzi njenge-aluminium, isinyithi, i-magnesium, njl., phambi kwamanzi, ubhedu olusulungekileyo luxutywe lula ngokudibana ne-oxygen;ngenxa yokuba ioksijini kunye nomphunga wamanzi zikhona emoyeni, umphezulu wobhedu olusulungekileyo utyhilekile emoyeni Ukusabela kwe-Oxidation kuya kwenzeka kungekudala.

Ngenxa yokuba ubukhulu bomgangatho wobhedu kwi-PCB bubhityile kakhulu, ubhedu oluxutywe ne-oxidized luya kuba ngumqhubi ombi wombane, oya kuwonakalisa kakhulu ukusebenza kombane we-PCB yonke.

Ukuze kuthintelwe i-oxidation yobhedu, ukwahlula iindawo ezithengiswayo nezingathengiswanga kwi-PCB ngexesha le-soldering, kunye nokukhusela umphezulu we-PCB, iinjineli zaqulunqa i-coating ekhethekileyo.Olu hlobo lwepeyinti lunokusetyenziswa ngokulula kumphezulu we-PCB ukwenza umaleko okhuselayo kunye nobukhulu obuthile kwaye uthintele uqhagamshelwano phakathi kobhedu nomoya.Lo maleko wokugquma ubizwa ngokuba yi-solder mask, kwaye izinto ezisetyenzisiweyo yimaski ye-solder.

Ekubeni ibizwa ngokuba yi-lacquer, kufuneka ibe nemibala eyahlukeneyo.Ewe, i-mask ye-solder yasekuqaleni inokwenziwa ingabi mbala kwaye ibonakale, kodwa ukwenzela ukuba kube lula ukugcinwa kunye nokuveliswa, ii-PCB zihlala zifuna ukuprintwa ngombhalo omncinci ebhodini.

Imaski ye-solder ecacileyo inokutyhila kuphela umbala ongasemva we-PCB, ke inkangeleko ayilunganga ngokwaneleyo nokuba iyavelisa, iyalungisa okanye iyathengisa.Ke ngoko, iinjineli zongeza imibala eyahlukeneyo kwimaski yesolder ukwenza iPCB emnyama okanye ebomvu, eluhlaza okwesibhakabhaka.

 

I-PCB emnyama kunzima ukubona umkhondo, okuzisa ubunzima ekugcinweni

Ukusuka kule mbono, umbala wePCB awunanto yakwenza nomgangatho wePCB.Umahluko phakathi kwe-PCB emnyama kunye neminye i-PCB yemibala efana ne-PCB eluhlaza kunye ne-PCB etyheli ilele kumbala wemaski ye-solder.

Ukuba uyilo lwe-PCB kunye nenkqubo yokuvelisa ziyafana ncakasana, umbala awusayi kuba nasiphumo ekusebenzeni, kwaye awusayi kuba nefuthe ekususeni ubushushu.

Ngokubhekiselele kwi-PCB emnyama, umkhondo wayo womphezulu uphantse ugutyungelwe ngokupheleleyo, obangela ubunzima obukhulu ekugcinweni kwexesha elizayo, ngoko ngumbala ongalungele ukwenziwa kunye nokusetyenziswa.

Ke, kwiminyaka yakutshanje, abantu baye batshintsha ngokuthe ngcembe, beyeka ukusebenzisa imaski emnyama ye-solder, kwaye endaweni yoko basebenzise iimaski ezimnyama, ezintsundu, eziluhlaza okwesibhakabhaka kunye nezinye iimaski ezithengiswayo, injongo kukwenza lula ukwenziwa kunye nokugcinwa.

Sele ndiyithethile loo nto, wonke umntu uyiqondile ingxaki yombala wePCB.Ngokuphathelele "ukumelwa kombala okanye isiphelo esisezantsi", kungenxa yokuba abavelisi bakhetha ukusebenzisa iiPCB ezimnyama ukwenza iimveliso eziphezulu, kunye nobomvu, oluhlaza okwesibhakabhaka, oluhlaza, kunye nophuzi ukwenza iimveliso eziphantsi.

Isishwankathelo sithi: imveliso inika intsingiselo yombala, hayi umbala onika imveliso intsingiselo.
3.Ziziphi iingenelo zokusebenzisa iintsimbi ezixabisekileyo ezifana negolide nesilivere kwiPCB?

Umbala ucacile, masithethe ngeentsimbi ezixabisekileyo kwiPCB!Xa abanye abavelisi bekhuthaza iimveliso zabo, baya kukhankanya ngokuthe ngqo ukuba iimveliso zabo zisebenzisa iinkqubo ezikhethekileyo ezifana nokufakwa kwegolide kunye nokufakwa kwesilivere.Ngoko ke yintoni ukusetyenziswa kwale nkqubo?

Umphezulu we-PCB ufuna amacandelo e-soldering, ngoko ke inxalenye yomaleko wobhedu iyafuneka ukuba ibonakale ukuze ifakwe.Ezi maleko zobhedu eziveziweyo zibizwa ngokuba ziipads.Iipads ngokubanzi zixande okanye zingqukuva kunye nendawo encinci.

 

Kule ngasentla, siyazi ukuba ubhedu olusetyenziswe kwi-PCB luxutywe lula, ngoko emva kokuba imaski ye-solder isetyenziswe, ubhedu kwi-pad lubonakaliswe emoyeni.

Ukuba i-copper kwi-pad i-oxidized, akunzima nje ukuyithengisa, kodwa kunye ne-resistivity yanda kakhulu, echaphazela kakhulu ukusebenza kwemveliso yokugqibela.Ke ngoko, iinjineli zeza neendlela ezahlukeneyo zokukhusela iipads.Ngokomzekelo, ifakwe ngegolide yensimbi ye-inert, okanye umphezulu ugutyungelwe ngoluhlu lwesilivere ngenkqubo yeekhemikhali, okanye ifilimu ekhethekileyo yeekhemikhali isetyenziselwa ukugubungela ubhedu olunqanda ukudibanisa phakathi kwepadi kunye nomoya.

Kwiipads eziveziweyo kwi-PCB, umaleko wobhedu utyhileka ngokuthe ngqo.Le nxalenye ifuna ukukhuselwa ukuyikhusela ekubeni i-oxidized.

Ukusuka kulo mbono, nokuba igolide okanye isilivere, injongo yenkqubo ngokwayo kukuthintela i-oxidation, ukukhusela i-pad, kunye nokuqinisekisa isivuno kwinkqubo ye-soldering elandelayo.

Nangona kunjalo, ukusetyenziswa kweentsimbi ezahlukeneyo kuya kubeka iimfuno kwixesha lokugcina kunye neemeko zokugcina zePCB ezisetyenziswa kwisityalo sokuvelisa.Ke ngoko, iifektri zePCB zihlala zisebenzisa oomatshini bokupakisha beplastiki bevacuum ukupakisha iiPCBs emva kokuba imveliso yePCB igqityiwe kwaye phambi kokuba ihanjiswe kubathengi ukuqinisekisa ukuba iiPCB azifakwanga oxidized ukuya kumda.

Phambi kokuba amacandelo adityaniswe kumatshini, umenzi wekhadi lebhodi kufuneka kwakhona ajonge idigri ye-oxidation ye-PCB, aphelise i-PCB ye-oxidation, kwaye uqinisekise isivuno.Ibhodi efunyanwa ngumthengi wokugqibela iphumelele iimvavanyo ezahlukeneyo.Nangona emva kokusetyenziswa kwexesha elide, i-oxidation iya kwenzeka kuphela kwindawo yokudibanisa i-plug-in, kwaye ayiyi kuba nefuthe kwi-pad kunye nezixhobo esele zithengisiwe.

Ekubeni ukuchasana kwesilivere kunye negolide kuphantsi, emva kokusebenzisa isinyithi esikhethekileyo njengesilivere negolide, ngaba isizukulwana sobushushu sePCB siya kuncitshiswa?

Siyazi ukuba into echaphazela ubungakanani bobushushu kukuxhathisa.Ukuchasana kuhambelana nezinto eziphathekayo zomqhubi ngokwawo, indawo enqamlezileyo kunye nobude bomqhubi.Ubunzima bezinto zetsimbi kumphezulu wepadi bungaphantsi kwe-0.01 mm.Ukuba i-pad icutshungulwa yi-OST (ifilimu ekhuselayo ye-organic), akuyi kubakho ubuninzi obugqithisileyo.Ukuchasana okubonakaliswe bubunzima obuncinci buphantse bulingane no-0, nokuba akunakwenzeka ukubala, kwaye ngokuqinisekileyo akuyi kuchaphazela isizukulwana sobushushu.