Hōʻike ʻia ka 5G&6G antenna soft board ma ka hiki ke lawe i ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ka hiki ke pale aku i ka hōʻailona maikaʻi e hōʻoia i ka hōʻailona o loko o ka antenna i emi iho ka pollution electromagnetic i ka ʻenehana electromagnetic waho, a hiki iā ia ke hōʻoiaʻiʻo i ka waho o waho. He haʻahaʻa haʻahaʻa ka pollution electromagnetic i ka hōʻailona kūloko o ka papa antena.liʻiliʻi.

I kēia manawa, ʻo nā pilikia nui i ka hana ʻana o nā papa kaapuni kiʻekiʻe kiʻekiʻe 5G maʻamau, ʻo ia ka hana laser a me ka lamination.ʻO ka hana laser ka mea nui i ka hana ʻana o ka papa pale electromagnetic (laser through hole production), inter-layer interconnection (laser blind hole production), a me ka antenna i hoʻopau ʻia Ua māhele ʻia ke ʻano o ka papa i nā papa (laser clean clean cutting).

Ua puka mai ka papa kaapuni 5G i nā makahiki ʻelua i hala iho nei.Ma nā ʻōlelo o ka ʻenehana hoʻoponopono laser, me ka hoʻoheheʻe ʻana i ka lua ma waena o ka laser / laser blind hole drilling o nā papa kaapuni kiʻekiʻe, a me ka ʻoki anuanu maʻemaʻe laser, ke kumu hoʻomaka no nā hui laser honua Ma ka manawa like, ua kau ʻo Wuhan Iridium Technology i kahi pūʻulu o nā hoʻonā ma ke kahua o nā papa kaapuni 5G a loaʻa iā ia ka hoʻokūkū koʻikoʻi.

ʻO ka hopena hoʻoheheʻe laser no ka papa palupalu 5G
Hoʻohana ʻia ka hui ʻelua-beam e hana i kahi hiʻona laser composite, i hoʻohana ʻia no ka hoʻoheheʻe ʻana i nā puka makapō.Ke hoʻohālikelike ʻia me ke ʻano hana hoʻoili lua makapō, ma muli o ka nānā ʻana i ka laser composite, ʻoi aku ka maikaʻi o ka hoʻohaʻahaʻa ʻana o ka puka makapō i loko o ka plastic.

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Nā hiʻohiʻona o ka ʻeli puka makapō no ka papa palupalu 5G kaapuni
1) He kūpono loa ka hoʻoheheʻe ʻana i ka puka makapō laser composite no ka ʻeli ʻana o ka puka makapō me ke kāpili;
2) Hoʻokahi manawa kaʻina hana ma o ka lua a me ka puka makapō;
3) Hiki i ka wili lele;
4) ʻO ka wehe ʻana i ka puka makapō ma o ka ʻeli ʻana o ka lua;
5) Ua haki ka loina wili hou i ka bottleneck o ke koho ʻana i ka laser ultraviolet a hoʻemi nui i ka hana a me ka mālama ʻana i nā mea hana wili;
6) Ka palekana o ka ʻohana patent invention.

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ʻO nā hiʻohiʻona o ka hoʻoheheʻe ʻana i loko o ka lua no 5G circuit soft board
Hoʻohana ʻia ka ʻenehana hoʻoheheʻe laser i hoʻopaʻa ʻia no ka loaʻa ʻana o ka haʻahaʻa haʻahaʻa a me ka haʻahaʻa haʻahaʻa o ka ikehu composite material ma o ka lua wili, haʻahaʻa shrinkage, ʻaʻole maʻalahi i ka papa, pili kiʻekiʻe ma waena o nā papa pale o luna a me lalo, a ʻoi aku ka maikaʻi ma mua o ka mākeke e kū nei. mīkini wili laser.