Kev kho mob ua ntej tooj liab tog
1. Deburring: Lub substrate mus dhau txheej txheem drilling ua ntej tooj liab tog.Txawm hais tias cov txheej txheem no yog qhov ua rau burrs, nws yog qhov tseem ceeb tshaj plaws zais kev phom sij uas ua rau metallization ntawm cov qhov tsis zoo.Yuav tsum tau txais kev siv thev naus laus zis deburring los daws.Feem ntau siv tshuab txhais tau tias yog siv los ua lub qhov ntug thiab sab hauv lub qhov phab ntsa tsis muaj barbs lossis ntsaws.
2. Degreasing
3. Roughening kev kho mob: feem ntau yog ua kom muaj kev sib raug zoo ntawm cov hlau txheej thiab cov substrate.
4. Kev kho kom ua haujlwm: feem ntau yog tsim "chaw pib" ua kom cov tooj liab deposition uniform.
Ua rau voids nyob rau hauv lub qhov phab ntsa plating:
Qhov phab ntsa plating kab noj hniav tshwm sim los ntawm 1PTH
(1) Cov ntsiab lus tooj liab, sodium hydroxide thiab formaldehyde concentration hauv tooj liab dab dej
(2) Qhov kub ntawm lub da dej
(3) Tswj kev ua kom muaj kev daws teeb meem
(4) Qhov kub thiab txias
(5) Kev siv qhov kub thiab txias, concentration thiab lub sijhawm ntawm lub pore modifier
(6) Siv qhov kub thiab txias, concentration thiab lub sijhawm txo tus neeg sawv cev
(7) Oscillator thiab viav vias
2 Qhov phab ntsa plating voids tshwm sim los ntawm cov qauv hloov
(1) Pre-kev kho mob txhuam phaj
(2) Residual kua nplaum ntawm lub qhov ncauj
(3) Pretreatment micro-etching
3 Qhov phab ntsa plating voids tshwm sim los ntawm cov qauv plating
(1) Micro-etching ntawm cov qauv plating
(2) Tinning (cov hmoov txhuas) muaj qhov tsis zoo
Muaj ntau ntau yam uas ua rau cov voids txheej, feem ntau yog PTH txheej voids, uas tuaj yeem txo cov tiam ntawm PTH txheej voids los ntawm kev tswj cov txheej txheem cuam tshuam ntawm potion.Txawm li cas los xij, lwm yam tsis tuaj yeem tsis quav ntsej.Tsuas yog los ntawm kev ua tib zoo saib thiab nkag siab txog qhov ua rau ntawm cov voids txheej thiab cov yam ntxwv ntawm qhov tsis xws luag tuaj yeem daws cov teeb meem raws sijhawm thiab ua tau zoo thiab cov khoom zoo tuaj yeem tswj tau.