1. Isithuba phakathi kweepetshi
Isithuba phakathi kwamacandelo e-SMD yingxaki ekufuneka iinjineli zinike ingqwalasela ngexesha loyilo.Ukuba isithuba sincinci kakhulu, kunzima kakhulu ukuprinta i-solder paste kwaye ugweme ukudibanisa kunye ne-tinning.
Izindululo zomgama zezi zilandelayo
Iimfuno zomgama wesixhobo phakathi kweepetshi:
Uhlobo olufanayo lwezixhobo: ≥0.3mm
Izixhobo ezingafaniyo: ≥0.13*h+0.3mm (h ngowona mahluko aphezulu wobude bamacandelo angabamelwane)
Umgama phakathi kwamacandelo anokufakwa kuphela ngesandla: ≥1.5mm.
Ezi ngcebiso zingentla zezereferensi kuphela, kwaye zinokuhambelana nenkqubo yoyilo lwePCB kwiinkampani ezichaphazelekayo.
2. Umgama phakathi kwesixhobo somgca kunye nesiqwenga
Kufuneka kubekho umgama owaneleyo phakathi kwesixhobo sokumelana ne-in-line kunye ne-patch, kwaye kucetyiswa ukuba ibe phakathi kwe-1-3mm.Ngenxa yokulungiswa kwengxaki, ukusetyenziswa kweeplagi ezithe ngqo kunqabile ngoku.
3. Ukubekwa kwe-IC decoupling capacitors
I-decoupling capacitor kufuneka ibekwe kufuphi ne-port yamandla ye-IC nganye, kwaye indawo kufuneka isondele kangangoko kunokwenzeka kwi-port yamandla ye-IC.Xa itshiphu inamazibuko ombane amaninzi, i-decoupling capacitor kufuneka ibekwe kwizibuko ngalinye.
4. Nika ingqalelo ulwalathiso lokubekwa kunye nomgama wamacandelo emphethweni webhodi yePCB.
Ekubeni i-PCB yenziwe ngokubanzi ngejigsaw, izixhobo ezikufutshane nomphetho kufuneka zihlangabezane neemeko ezimbini.
Eyokuqala kufuneka ihambelane nesalathiso sokusika (ukwenza uxinzelelo lomatshini lweyunifomu yesixhobo. Umzekelo, ukuba isixhobo sibekwe ngendlela kwicala lasekhohlo lomzobo ongentla, ulwalathiso lwamandla ahlukeneyo eepadi ezimbini zesixhobo. isiziba sinokubangela ukuba idiskhi kunye ne-welding yahlulwe.
Okwesibini kukuba amacandelo akakwazi ukulungiswa kumgama othile (ukuthintela umonakalo kumacandelo xa ibhodi inqunyulwa)
5. Nika ingqalelo kwiimeko apho iipads ezikufutshane kufuneka zidityaniswe
Ukuba iipads ezikufutshane kufuneka zidibaniswe, okokuqala qinisekisa ukuba uxhulumaniso lwenziwa ngaphandle ukukhusela ibhuloho ebangelwa ukudibanisa, kwaye ubeke ingqalelo kububanzi bocingo lobhedu ngeli xesha.
6. Ukuba i-pad iwela kwindawo eqhelekileyo, ukutshatyalaliswa kobushushu kufuneka kuthathelwe ingqalelo
Ukuba i-pad iwela kwindawo ye-pavement, indlela efanelekileyo kufuneka isetyenziswe ukudibanisa i-pad kunye ne-pavement.Kwakhona, qaphela ukuba udibanise umgca we-1 okanye imigca emi-4 ngokwexesha langoku.
Ukuba indlela ngakwesobunxele yamkelwe, kunzima kakhulu ukuthunga okanye ukulungisa kunye nokuqhaqha amacandelo, kuba ubushushu buchithwa ngokupheleleyo ngobhedu olubekwe, okwenza ukuba i-welding ingenzeki.
7. Ukuba isikhokelo sincinci kuneplagi-in pad, i-teardrop iyafuneka
Ukuba ucingo luncinci kune-pad ye-in-line device, kufuneka udibanise i-teardrops njengoko kuboniswe kwicala lasekunene lomzobo.
Ukongeza i-teardrops kunezi nzuzo zilandelayo:
(1) Gwema ukuhla ngokukhawuleza kobubanzi bomgca wesignali kunye nokubangela ukubonakaliswa, okunokwenza uxhulumaniso phakathi komkhondo kunye necandelo lecandelo lithande ukuba ligudileyo kwaye litshintshile.
(2) Ingxaki yokuba uxhulumaniso phakathi kwepadi kunye nomkhondo luqhekeka ngokulula ngenxa yempembelelo isonjululwe.
(3) Ukusetwa kwee-teardrops kunokwenza ukuba ibhodi yesekethe yePCB ibonakale intle ngakumbi.