Kwiminyaka yakutshanje, ukusetyenziswa kweteknoloji yoshicilelo lwe-inkjet ekushicileleni abalinganiswa kunye neelogo kwiibhodi zePCB kuqhubekile ukwandisa, kwaye kwangaxeshanye iye yaphakamisa imingeni ephezulu ekugqityweni kunye nokuqina koshicilelo lwe-inkjet.Ngenxa ye-viscosity ephantsi kakhulu, i-inki yokuprinta inkjet idla ngokuba neshumi elinesibini leesenti.Xa kuthelekiswa namashumi amawaka eesenti ze-inki zoshicilelo lwekhusi, inki yoshicilelo lwe-inkjet inovakalelo oluthe kratya kumphezulu we-substrate.Ukuba inkqubo ilawulwa Ayilunganga, ithanda ukuba neengxaki ezifana nokushwabana kwe-inki kunye nokuwa komlinganiswa.
Ukudibanisa ukuqokelelwa kobuchwephesha kwitekhnoloji yoshicilelo lwe-inkjet, iHanyin ibisebenzisana nabathengi ekuphuculeni inkqubo kunye nohlengahlengiso kunye nabavelisi be-inki ixesha elide kwindawo yabathengi, kwaye iqokelele amava athile asebenzayo ekusombululeni ingxaki yeempawu zoshicilelo lwe-inkjet.
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Impembelelo yoxinzelelo lomphezulu we-mask solder
Uxinzelelo oluphezulu lwemaski ye-solder luchaphazela ngokuthe ngqo ukunamathela kwabalinganiswa abaprintiweyo.Ungajonga kwaye uqinisekise ukuba uphawu oluwayo lunxulumene noxinzelelo lomphezulu ngokusebenzisa le theyibhile yothelekiso ilandelayo.
Ungasebenzisa ipeni ye-dyne ukujonga uxinzelelo lomphezulu lwemaski ye-solder phambi koshicilelo lweempawu.Ngokuqhelekileyo, ukuba ukunyanzeliswa komhlaba kufikelela kwi-36dyn / cm okanye ngaphezulu.Kuthetha ukuba imaski ye-solder ebhakwe ngaphambili ifaneleke ngakumbi inkqubo yoshicilelo lomlinganiswa.
Ukuba uvavanyo lufumanisa ukuba ukuxinezeleka komphezulu kwemaski ye-solder kuphantsi kakhulu, yeyona ndlela ilungileyo yokwazisa umenzi wemaski ye-solder ukuncedisa kuhlengahlengiso.
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Impembelelo yefilimu yokukhusela ifilimu ye-solder
Kwinqanaba lokuvezwa kwemaski ye-solder, ukuba ifilimu yokukhusela ifilimu esetyenzisiweyo iqulethe izinto zeoli ye-silicone, iya kudluliselwa kwindawo ye-mask ye-solder ngexesha lokuvezwa.Ngeli xesha, kuya kuthintela ukusabela phakathi kwe-inki ye-inki kunye ne-mask ye-solder kwaye ichaphazele amandla okudibanisa, ngakumbi Indawo apho kukho amanqaku efilimu ebhodini idla ngokuba yindawo apho abalinganiswa banokuthi bawele khona.Kule meko, kucetyiswa ukuba utshintshe ifilimu yokukhusela ngaphandle kweoli ye-silicone, okanye ungasebenzisi ifilimu yokukhusela ifilimu yokuvavanya ukuthelekisa.Xa ifilimu yokukhusela ifilimu ingasetyenziswanga, abanye abathengi baya kusebenzisa ulwelo oluthile olukhuselayo ukufaka isicelo kwifilimu ukukhusela ifilimu, ukwandisa amandla okukhululwa, kunye nokuchaphazela umgangatho we-mask solder.
Ukongezelela, impembelelo yefilimu yokukhusela ifilimu ingaphinda ihluke ngokwezinga lokuchasana nefilimu.Ipeni ye-dyne ayinakukwazi ukuyilinganisa ngokuchanekileyo, kodwa ingabonisa i-ink shrinkage, okubangelwa ukungalingani okanye iingxaki ze-pinhole, eziza kuchaphazela ukubambelela.Yenza impembelelo.
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Impembelelo yokuphuhlisa i-defoamer
Ekubeni intsalela ye-defoamer ephuhlisayo iya kuchaphazela ukubambelela kwi-inki ye-inki, kucetyiswa ukuba akukho defoamer eyongezwa phakathi komphuhlisi wokuvavanya ukuthelekisa xa ufumana isizathu.
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Impembelelo ye-solder mask solvent intsalela
Ukuba ubushushu bokubhaka kwangaphambili bemaski ye-solder buphantsi, izinyibilikisi ezininzi ezishiyekileyo kwimaski ye-solder ziyakuchaphazela ibhondi kunye ne-inki yomlinganiswa.Ngeli xesha, kucetyiswa ngokufanelekileyo ukunyusa ukushisa kwangaphambili kunye nexesha lemaski ye-solder yokuvavanya ukuthelekisa.
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Iimfuno zenkqubo yoshicilelo lwe-inki enobumba
Iimpawu kufuneka ziprintwe kwimaski ye-solder engakhange ibhakwe kwiqondo lokushisa eliphezulu:
Qaphela ukuba iimpawu kufuneka ziprintwe kwibhodi yokuvelisa imaski ye-solder engazange ibhakwe kwiqondo lokushisa eliphezulu emva kophuhliso.Ukuba uprinta oonobumba kwimaski yokuguga ye-solder, awukwazi ukufumana ukunamathela okulungileyo.Nika ingqalelo kwiinguqu eziyimfuneko kwinkqubo yokuvelisa.Kufuneka usebenzise ibhodi ephuhlisiwe ukuprinta abalinganiswa kuqala, kwaye emva koko imaski ye-solder kunye neempawu zibhaka kwiqondo lokushisa eliphezulu.
Seta iiparamitha zokunyanga ubushushu ngokuchanekileyo:
I-Jet yoshicilelo lwe-inki yi-inki ephilisa kabini.Ukunyangwa okupheleleyo kwahlulwe ngamanyathelo amabini.Inyathelo lokuqala yi-UV yokunyanga kwangaphambili, kwaye inyathelo lesibini kukunyanga kwe-thermal, emisela ukusebenza kokugqibela kwe-inki.Ngoko ke, iiparamitha zokunyanga i-thermal kufuneka zibekwe ngokuhambelana neeparitha ezifunekayo kwincwadana yezobugcisa enikezwe ngumenzi we-inki.Ukuba kukho utshintsho kwimveliso yokwenyani, kufuneka uqale udibane nomenzi we-inki ukuba iyenzeka na.
Ngaphambi kokunyanga ubushushu, iibhodi akufanele zibekwe:
I-inkjet yoshicilelo lwe-inki lunyangelwe kuphela ngaphambi kokunyanga kwe-thermal, kwaye ukunamathela kumbi, kwaye iipleyiti ezilayitiweyo zizisa ukungqubana koomatshini, okunokubangela lula iziphene zomlinganiswa.Kwimveliso yangempela, amanyathelo afanelekileyo kufuneka athathwe ukunciphisa ukungqubuzana ngokuthe ngqo kunye nokukrazula phakathi kwamacwecwe.
Abasebenzisi kufuneka balinganise imisebenzi:
Abanini-zithuthi kufuneka banxibe iiglavu ngexesha lomsebenzi ukuthintela ukungcoliseka kwe-oyile ekungcoliseni ibhodi yokuvelisa.
Ukuba ibhodi ifunyenwe ibala, ukuprinta kufuneka kushiywe.
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Ukulungelelaniswa kobunzima bokunyanga inki
Kwimveliso eyiyo, uninzi loonobumba bayawa ngenxa yokukhuhlana, ukukrwempa okanye impembelelo yesitaki, ngoko ke ukunciphisa ngokufanelekileyo ukushibilika kwe-inki kunokunceda abalinganiswa bawe.Ngokuqhelekileyo unokuzama ukulungisa oku xa abalinganiswa bewa kwaye ubone ukuba kukho uphuculo.
Ukutshintsha ubungqingqwa bokunyanga kuphela kohlengahlengiso olunokwenziwa ngumenzi wesixhobo kwisixhobo sokushicilela.
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Impembelelo yokupakisha kunye nokucubungula emva kokushicilela abalinganiswa
Kwinkqubo elandelayo yokugqiba inkqubo yomlinganiswa, ibhodi iya kuba neenkqubo ezifana nokucofa okutshisayo, ukucandwa, i-gongs, kunye ne-V-cut.Ezi ziphatha ezifana ne-stacking extrusion, i-friction kunye noxinzelelo lwe-mechanical processing inefuthe elibalulekileyo kwi-character dropout, ehlala isenzeka Isizathu esiphezulu sokuwa komlingiswa.
Kuphando lokwenyani, isenzeko sokwehla komlinganiswa sihlala sibona kumhlaba obhityileyo wemaski enobhedu emazantsi ePCB, kuba le ndawo yesolder imaski incinci kwaye ubushushu bugqithisela ngokukhawuleza.Le nxalenye iya kufudunyezwa ngokukhawuleza, kwaye le nxalenye inokuthi yenze uxinzelelo loxinzelelo.Kwangaxeshanye, le nxalenye yeyona convexity iphezulu kuyo yonke ibhodi PCB.Xa iibhodi ezilandelayo zihlanganiswe ndawonye ukucofa okushushu okanye ukusika, Kulula ukubangela ukuba abanye abalinganiswa baphuke kwaye bawe.
Ngexesha lokucinezela okutshisayo, ukucandwa kunye nokwenza, i-pad spacer ephakathi inokunciphisa ukuhla kweempawu ezibangelwa ukukhuhlana kwe-squeeze, kodwa le ndlela inzima ukuyikhuthaza kwinkqubo eyiyo, kwaye isetyenziselwa ngokubanzi iimvavanyo zokuthelekisa xa ufumana iingxaki.
Ukuba ekugqibeleni kugqitywe ukuba esona sizathu siphambili ngumlinganiswa owela phantsi okubangelwa ukukhuhlana kanzima, ukukrwela kunye noxinzelelo kwinqanaba lokuqulunqa, kunye ne-brand kunye nenkqubo ye-inki ye-mask ye-solder ayinakuguqulwa, umenzi we-inki unokusombulula ngokupheleleyo kuphela. ukubuyisela okanye ukuphucula i-inki yomlinganiswa.Ingxaki yabalinganiswa abangekhoyo.
Lilonke, ukusuka kwiziphumo kunye namava abavelisi bethu bezixhobo kunye nabavelisi be-inki kuphando kunye nohlalutyo oludlulileyo, iimpawu eziwisiweyo zihlala zihambelana nenkqubo yemveliso ngaphambi nasemva kwenkqubo yokubhaliweyo, kwaye banovakalelo oluthile kwii-inki zomlinganiswa.Nje ukuba ingxaki yokuwa komlinganiswa yenzeke kwimveliso, unobangela wokungaqhelekanga kufuneka ufunyanwe inyathelo nenyathelo ngokuhambelana nokuhamba kwenkqubo yemveliso.Ukujonga kwidatha yesicelo soshishino iminyaka emininzi, ukuba ii-inki zomlinganiswa ezifanelekileyo kunye nolawulo olululo lweenkqubo ezifanelekileyo zemveliso ngaphambi nangemva kokusetyenziswa, ingxaki yokulahleka komlinganiswa inokulawulwa kakuhle kwaye ihlangabezane ngokupheleleyo nemveliso kunye neemfuno zomgangatho woshishino.