Introduction to the advantages and disadvantages of BGA PCB board
A ball grid array (BGA) printed circuit board (PCB) is a surface mount package PCB designed specifically for integrated circuits. BGA boards are used in applications where surface mounting is permanent, for example, in devices such as microprocessors. These are disposable printed circuit boards and cannot be reused. BGA boards have more interconnect pins than regular PCBs. Each point on the BGA board can be soldered independently. The entire connections of these PCBs are spread out in the form of a uniform matrix or surface grid. These PCBs are designed so that the entire underside can be easily used instead of just utilizing the peripheral area.
The pins of a BGA package are much shorter than a regular PCB because it only has a perimeter type shape. Due to this reason, it provides better performance at higher speeds. BGA welding requires precise control and is more often guided by automated machines. This is why BGA devices are not suitable for socket mounting.
Soldering technology BGA packaging
A reflow oven is used to solder the BGA package to the printed circuit board. When the melting of the solder balls begins inside the oven, the tension on the surface of the molten balls keeps the package aligned in its actual position on the PCB. This process continues until the package is removed from the oven, cools and becomes solid. In order to have durable solder joints, a controlled soldering process for the BGA package is very necessary and must reach the required temperature. When proper soldering techniques are used, it also eliminates any possibility of short circuits.
Advantages of BGA packaging
There are many advantages to BGA packaging, but only the top pros are detailed below.
1. BGA packaging uses PCB space efficiently: The use of BGA packaging guides the use of smaller components and a smaller footprint. These packages also help save enough space for customization in the PCB, thereby increasing its efficacy.
2. Improved electrical and thermal performance: The size of BGA packages is very small, so these PCBs dissipate less heat and the dissipation process is easy to implement. Whenever a silicon wafer is mounted on top, most of the heat is transferred directly to the ball grid. However, with the silicon die mounted on the bottom, the silicon die connects to the top of the package. This is why it is considered the best choice for cooling technology. There are no bendable or fragile pins in the BGA package, so the durability of these PCBs is increased while also ensuring good electrical performance.
3. Improve manufacturing profits through improved soldering: The pads of BGA packages are large enough to make them easy to solder and easy to handle. Therefore, ease of welding and handling makes it very fast to manufacture. The larger pads of these PCBs can also be easily reworked if needed.
4. REDUCE THE RISK OF DAMAGE: The BGA package is solid-state soldered, thus providing strong durability and durability in any condition.
of 5. Reduce costs: The above advantages help reduce the cost of BGA packaging. The efficient use of printed circuit boards provides further opportunities to save materials and improve thermoelectric performance, helping to ensure high-quality electronics and reduce defects.
Disadvantages of BGA packaging
The following are some disadvantages of BGA packages, described in detail.
1. The inspection process is very difficult: It is very difficult to inspect the circuit during the process of soldering the components to the BGA package. It is very difficult to check for any potential faults in the BGA package. After each component is soldered, the package is difficult to read and inspect. Even if any error is found during the checking process, it will be difficult to fix it. Therefore, to facilitate inspection, very expensive CT scan and X-ray technologies are used.
2. Reliability issues: BGA packages are susceptible to stress. This fragility is due to bending stress. This bending stress causes reliability issues in these printed circuit boards. Although reliability issues are rare in BGA packages, the possibility is always present.
BGA packaged RayPCB technology
The most commonly used technology for BGA package size used by RayPCB is 0.3mm, and the minimum distance that must be between circuits is maintained at 0.2mm. Minimum spacing between two different BGA packages (if maintained at 0.2mm). However, if the requirements are different, please contact RAYPCB for changes to the required details. The distance of BGA package size is shown in the figure below.
Future BGA packaging
It is undeniable that BGA packaging will lead the electrical and electronic product market in the future. The future of BGA packaging is solid and it will be in the market for quite some time. However, the current rate of technological advancement is very fast, and it is expected that in the near future, there will be another type of printed circuit board that is more efficient than BGA packaging. However, advances in technology have also brought inflation and cost issues to the electronics world. Therefore, it is assumed that BGA packaging will go a long way in the electronics industry due to cost-effectiveness and durability reasons. In addition, there are many types of BGA packages, and the differences in their types increase the importance of BGA packages. For example, if some types of BGA packages are not suitable for electronic products, other types of BGA packages will be used.