According to the number of PCB layers, it is divided into single-sided, double-sided, and multi-layer boards. The three board processes are not the same.

There is no inner layer process for single-sided and double-sided panels, basically cutting-drilling-follow-up process.
Multilayer boards will have internal processes

1) Single panel process flow
Cutting and edging → drilling → outer layer graphics → (full board gold plating) → etching → inspection → silk screen solder mask → (hot air leveling) → silk screen characters → shape processing → testing → inspection

2) Process flow of double-sided tin spraying board
Cutting edge grinding → drilling → heavy copper thickening → outer layer graphics → tin plating, etching tin removal → secondary drilling → inspection → screen printing solder mask → gold-plated plug → hot air leveling → silk screen characters → shape processing → testing → test

3) Double-sided nickel-gold plating process
Cutting edge grinding → drilling → heavy copper thickening → outer layer graphics → nickel plating, gold removal and etching → secondary drilling → inspection → silk screen solder mask → silk screen characters → shape processing → test → inspection

4) Process flow of multi-layer board tin spraying board
Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer graphics → tin plating, etching tin removal → secondary drilling → inspection →Silk screen solder mask→Gold-plated plug→Hot air leveling→Silk screen characters→Shape processing→Test→Inspection

5) Process flow of nickel-gold plating on multilayer boards
Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer graphics → gold plating, film removal and etching → secondary drilling → inspection → Screen printing solder mask→screen printing characters→shape processing→testing→inspection

6) Process flow of multi-layer plate immersion nickel-gold plate
Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer graphics → tin plating, etching tin removal → secondary drilling → inspection →Silk screen solder mask→Chemical Immersion Nickel Gold→Silk screen characters→Shape processing→Test→Inspection.