What development opportunities does the PCB industry have in the future?

 

From PCB World—-

 

01
The direction of production capacity is changing

The direction of production capacity is to expand production and increase capacity, and to upgrade products, from the low-end to the high-end. At the same time, downstream customers should not be too concentrated, and risks should be diversified.

02
The production model is changing
In the past, production equipment mostly relied on manual operation, but at present, many PCB companies have been improving production equipment, manufacturing processes, and advanced technology in the direction of intelligence, automation, and internationalization. Coupled with the current situation of labor shortage in the manufacturing industry, it is forcing companies to speed up the process of automation.

03
The level of technology is changing
PCB companies must integrate internationally, strive to obtain larger and more high-end orders, or enter the corresponding production supply chain, the technical level of the circuit board is particularly important. For example, there are many requirements for multi-layer boards at present, and indicators such as the number of layers, refinement, and flexibility are very important, which all depend on the level of the circuit board production process technology.

At the same time, only companies with strong technology can strive for more living space under the background of rising materials, and can even transform to the direction of replacing materials with technology to produce higher-quality circuit board products.

To improve the technology and craftsmanship, in addition to establishing your own scientific research team and doing a good job in the construction of talent reserves, you can also participate in the local government’s scientific research investment, share technology, coordinate development, accept advanced technology and craftsmanship with a mindset of inclusiveness, and make progress in the process. Innovative changes.

04
Circuit board types are broadening and refined
After decades of development, circuit boards have developed from low-end to high-end. At present, the industry attaches great importance to the development of mainstream circuit board types such as high-priced HDI, IC carrier boards, multilayer boards, FPC, SLP type carrier boards, and RF. Circuit boards are developing in the direction of high density, flexibility, and high integration.

High-density is mainly required for the size of the PCB aperture, the width of the wiring, and the number of layers. The HDI board is the representative. Compared with ordinary multi-layer boards, HDI boards are precisely equipped with blind holes and buried holes to reduce the number of through holes, save the PCB wiring area, and greatly increase the density of components.

Flexibility mainly refers to the improvement of PCB wiring density and flexibility through static bending, dynamic bending, crimping, folding, etc. of the substrate, thereby reducing the limitation of wiring space, represented by flexible boards and rigid-flex boards . High integration is mainly to combine multiple functional chips on a small PCB through assembly, represented by IC-like carrier boards (mSAP) and IC carrier boards.

In addition, the demand for circuit boards has soared, and the demand for upstream materials has also increased, such as copper clad laminates, copper foil, glass cloth, etc., and production capacity needs to be continuously expanded to meet the supply of the entire industry chain.

 

05
Industrial policy support
The “Industrial Structure Adjustment Guidance Catalogue (2019 Edition, Draft for Comment)” issued by the National Development and Reform Commission proposes to manufacture new electronic components (high-density printed circuit boards and flexible circuit boards, etc.), and new electronic components (high-frequency microwave printing). Materials used in electronic products such as printed circuit boards, high-speed communication circuit boards, flexible circuit boards, etc.) are included in the encouraged projects of the information industry.

06
Continuous promotion of downstream industries
Under the background of my country’s vigorous promotion of the “Internet +” development strategy, emerging fields such as cloud computing, big data, Internet of Everything, artificial intelligence, smart homes, and smart cities are booming. New technologies and new products continue to emerge, which vigorously promote the PCB industry. development of. The popularization of new-generation smart products such as wearable devices, mobile medical devices, and automotive electronics will greatly stimulate the market demand for high-end circuit boards such as HDI boards, flexible boards, and packaging substrates.

07
Extended mainstreaming of green manufacturing
Environmental protection is not only for the long-term development of the industry, but also can improve the recycling of resources in the circuit board production process, and increase the utilization rate and reuse rate. It is an important way to improve product quality.

“Carbon neutrality” is China’s main idea for the development of an industrial society in the future, and future production must conform to the direction of environmentally friendly production. Small and medium-sized enterprises can find industrial parks that join the electronic information industry cluster, and solve the high environmental protection cost problem through the conditions provided by the huge industrial chain and industrial parks. At the same time, they can also make up for their own shortcomings by relying on the advantages of centralized industries. Seek survival and development in the tide.

In the current industry encounter, any company can only continue to upgrade its production lines, increase high-end production equipment, and continuously improve the degree of automation. The company’s profit margin is expected to further increase, and it will be a “wide and deep moat” advantageous enterprise!