Unobangela PCB ukuwa ipleyiti solder

Unobangela PCB ukuwa ipleyiti solder

PCB ibhodi yesekethe kwinkqubo yemveliso, ngokufuthi ukuhlangabezana ezinye iziphene inkqubo, ezifana PCB ibhodi yesekethe ucingo lobhedu off embi (kwaye isoloko kuthiwa ukuphosa ubhedu), kuchaphazela umgangatho imveliso.Izizathu eziqhelekileyo zokuphosa ibhodi yesekethe yePCB zezi zilandelayo:

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Izinto zenkqubo yebhodi yesekethe yePCB

I-1, ifoyile yobhedu yobhedu igqithisekile, ifoyile yobhedu ye-electrolytic esetyenziswa kwimarike idla ngokuba yigalvanized ekwicala elinye (eyaziwa ngokuba yifoyile engwevu) kunye necala elinye lobhedu elinecwecwe (eliqhelekileyo elibizwa ngokuba yifoyile ebomvu), ubhedu oluqhelekileyo ludla ngokungaphezulu kwe70um. ifoyile yobhedu, ifoyile ebomvu kunye ne-18um ngezantsi kwefoyile yothuthu esisiseko ayizange ibe yibhetshi yobhedu.

2. Ukungqubuzana kwendawo kwenzeka kwinkqubo ye-PCB, kwaye ucingo lobhedu luhlukaniswe kwi-substrate ngamandla omatshini angaphandle.Esi siphene sibonakalisa ukungami kakuhle okanye ukuqhelaniswa kakuhle, ucingo lobhedu oluwayo luya kuba nokugqwetheka okucacileyo, okanye kwicala elinye lomkrwelo/uphawu lwempembelelo.Khubula inxalenye embi yocingo lobhedu ukuze ubone umphezulu wefoyile yobhedu, unokubona umbala oqhelekileyo wefoyile yobhedu, akuyi kubakho ukhukuliseko olubi lwecala, ukomelela kwefoyile yobhedu kuqhelekile.

3, uyilo lwesekethe yePCB alunangqiqo, ngoyilo lwefoyile yobhedu engqindilili yomgca obhityileyo kakhulu, kuya kubangela ukuchetywa komgca ogqithisileyo kunye nobhedu.

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Isizathu senkqubo yeLaminate

Phantsi kweemeko eziqhelekileyo, okoko nje icandelo lobushushu obuphezulu obucinezelayo lwe-laminate ngaphezu kwemizuzu engama-30, i-foil yobhedu kunye ne-semi-curred sheet idityaniswe ngokupheleleyo, ngoko ukucinezela ngokubanzi akuyi kuchaphazela amandla okubopha i-foil yobhedu kunye ne-substrate kwi-laminate.Nangona kunjalo, kwinkqubo yokupakishwa kwe-laminate kunye nokupakisha, ukuba ungcoliseko lwePP okanye umonakalo owenziwe nge-foil yobhedu, kuya kukhokelela kumandla anganeleyo okudibanisa phakathi kwe-foil yobhedu kunye ne-substrate emva kwe-laminate, okukhokelela ekubekweni (kuphela kwipleyiti enkulu) okanye ucingo lwe-sporadic copper. ilahleko, kodwa amandla okuhlutha ifoyile yobhedu kufuphi nomgca wokuhluba akayi kuba yinto engaqhelekanga.

 

Laminate isizathu sezinto ekrwada

1, ifoyile yobhedu eqhelekileyo ye-electrolytic yenziwe ngesinyithi okanye imveliso yobhedu, ukuba ixabiso lencopho yemveliso yoboya ayiqhelekanga, okanye igalvanized/copper plating, ifoyile yobhedu iyalekwa, okukhokelela kwifoyile yobhedu ngokwayo akwanelanga, ifoyile embi. ibhodi ecinezelweyo eyenziwe nge-PCB plug-in kumzi-mveliso we-elektroniki, ucingo lobhedu luya kuwa ngenxa yempembelelo yangaphandle.Olu hlobo olubi lokuhluthwa kocingo lobhedu lwefoyile yomphezulu (oko kukuthi, umphezulu woqhagamshelwano kunye ne-substrate) emva kokhukuliseko olucacileyo lwecala, kodwa wonke umphezulu wefoyile yobhedu yokuxobuka amandla uya kuba buthathaka.

2. Ukulungelelaniswa okungalunganga kwe-foil yobhedu kunye ne-resin: ezinye iilaminates ezineempawu ezizodwa zisetyenziswa ngoku, njengephepha le-HTg, ngenxa yeenkqubo ezahlukeneyo ze-resin, i-agent ephilisayo esetyenzisiweyo i-resin ye-resin ye-resin ye-molecular chain ilula, idigri ephantsi yokuwela xa ukunyanga, ukusebenzisa i-foil yobhedu ekhethekileyo kunye nomdlalo.Xa ukuveliswa kwe-laminate usebenzisa i-foil yobhedu kunye nenkqubo ye-resin ayihambelani, okubangela ukuba i-sheet metal foil ixobulwe amandla ayonelanga, iplagi-in iya kubonakala imbi yokuchitha ucingo lobhedu.

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Ukongeza, kusenokwenzeka ukuba i-welding engafanelekanga kumxhasi ikhokelela ekulahlekeni kwe-welding pad (ingakumbi iipaneli ezingatshatanga kunye neziphindwe kabini, iibhodi ze-multilayer zinendawo enkulu yomgangatho, ukutshatyalaliswa kobushushu okukhawulezayo, ubushushu be-welding buphezulu, akukho lula. ukubaleka):

Ukuwelda ngokuphindaphindiweyo indawo kuya kuyicima iphedi;

Ukushisa okuphezulu kwentsimbi ye-solder kulula ukuyifaka kwi-pad;

Uxinzelelo oluninzi oluvezwa yintloko yentsimbi yokuthambisa kwi-pad kunye nexesha elide kakhulu le-welding liya kuyicima iphedi.