Ukusuka kwi-PCB World
Kwizixhobo ze-elektroniki, umlinganiselo othile wokushisa uveliswa ngexesha lokusebenza, ukwenzela ukuba ukushisa kwangaphakathi kwezixhobo kukhuphuke ngokukhawuleza.Ukuba ubushushu abuchithwanga ngexesha, izixhobo ziya kuqhubeka zifudumala, kwaye isixhobo siya kusilela ngenxa yokushisa.Ukuthembeka kwezixhobo ze-elektroniki Ukusebenza kuya kuncipha.
Ngoko ke, kubaluleke kakhulu ukuqhuba unyango olufanelekileyo lokutshatyalaliswa kobushushu kwibhodi yesiphaluka.Ukutshatyalaliswa kobushushu bebhodi yesekethe ye-PCB likhonkco elibaluleke kakhulu, ngoko yintoni ubuchule bokutshatyalaliswa kobushushu bebhodi yesekethe ye-PCB, masiyixoxe kunye ngezantsi.
01
Ukutshatyalaliswa kobushushu ngebhodi ye-PCB ngokwayo Iibhodi ze-PCB ezisetyenziswa ngoku ngokubanzi zi-copper clad/epoxy glasscloth substrates okanye i-phenolic resin glass substrates zelaphu, kunye nenani elincinci leebhodi zobhedu ezisekelwe ephepheni ziyasetyenziswa.
Nangona ezi substrates zineempawu ezigqwesileyo zombane kunye nepropathi yokusetyenzwa, zinokuphelisa ubushushu.Njengendlela yokutshatyalaliswa kobushushu kumacandelo aphezulu okufudumeza, akunakwenzeka ukuba ulindele ukuba ubushushu buqhutywe yi-resin ye-PCB ngokwayo, kodwa ukutshabalalisa ubushushu ukusuka kumphezulu wecandelo ukuya kumoya ojikelezayo.
Nangona kunjalo, njengoko iimveliso ze-elektroniki ziye zangena kwixesha le-miniaturization yamacandelo, ukunyuka kwe-high-density mounting, kunye ne-high-heating assembly, akwanelanga ukuthembela kumphezulu wecandelo kunye nommandla omncinci kakhulu wokukhupha ukushisa.
Ngelo xesha, ngenxa yokusetyenziswa ngokubanzi kwezixhobo zokunyuka kwendawo ezifana ne-QFP kunye ne-BGA, ubushushu obuveliswa ngamacandelo budluliselwa kwibhodi ye-PCB kwisixa esikhulu.Ngoko ke, eyona ndlela ilungileyo yokusombulula ukutshatyalaliswa kobushushu kukuphucula amandla okutshatyalaliswa kobushushu bePCB ngokwayo edibana ngokuthe ngqo nento yokufudumeza.Yenziwa okanye isasazwe.
Uyilo lwePCB
Izixhobo ezibuthathaka zobushushu zibekwe kwindawo yomoya obandayo.
Isixhobo sokubona ubushushu sibekwe kwindawo eshushu kakhulu.
Izixhobo ezikwibhodi eprintiweyo efanayo kufuneka zicwangciswe ngokusemandleni ngokwexabiso le-calorific kunye neqondo lokutshatyalaliswa kobushushu.Izixhobo ezinexabiso elincinci le-calorific okanye ukunganyangeki kobushushu (ezifana ne-transistors encinci yesignali, iisekethe ezidibeneyo ezincinci, i-electrolytic capacitors, njl.) kufuneka zifakwe kwi-airflow yokupholisa.Ukuhamba okuphezulu (ekungeneni), izixhobo ezinokushisa okukhulu okanye ukumelana nobushushu (njengama-transistors amandla, iisekethe ezinkulu ezidibeneyo, njl.)
Kwicala elithe tye, izixhobo eziphezulu zamandla zibekwe ngokusondeleyo kumda webhodi eprintiweyo ngokusemandleni ukunciphisa indlela yokudlulisa ukushisa;kwicala elithe nkqo, izixhobo eziphezulu zamandla zibekwe ngokusondeleyo kumphezulu webhodi eprintiweyo ngokusemandleni ukunciphisa impembelelo yezi zixhobo kubushushu bezinye izixhobo xa zisebenza .
Ukutshatyalaliswa kobushushu bebhodi eprintiweyo kwisixhobo ikakhulu kuxhomekeke ekuhambeni komoya, ngoko ke indlela yokuhamba komoya kufuneka ifundwe ngexesha loyilo, kwaye isixhobo okanye ibhodi yesekethe eprintiweyo kufuneka iqwalaselwe ngokufanelekileyo.
Ngokuqhelekileyo kunzima ukufezekisa ukusabalalisa okufanayo ngokungqongqo ngexesha lenkqubo yokuyila, kodwa iindawo ezinobunzima obukhulu kakhulu kufuneka zigwenywe ukukhusela iindawo ezishushu ezichaphazela ukusebenza okuqhelekileyo kwesekethe yonke.
Ukuba kunokwenzeka, kuyimfuneko ukuhlalutya ukusebenza kakuhle kwe-thermal yesekethe eprintiweyo.Umzekelo, imodyuli yokuhlalutya isalathiso sokusebenza kakuhle kwesoftware eyongeziweyo kwisoftware yoyilo lwePCB yobuchwephesha inokunceda abaqulunqi baphucule uyilo lwesekethe.
02
Amacandelo aphezulu avelisa ubushushu kunye neeradiyetha kunye neepleyiti zokuqhuba ubushushu.Xa inani elincinci lamacandelo kwi-PCB livelisa ubushushu obukhulu (ngaphantsi kwe-3), isitya sokufudumala okanye umbhobho wokushisa unokongezwa kumacandelo okuvelisa ukushisa.Xa iqondo lobushushu lingenakwehliswa, linokusetyenziswa Iradiyetha enefeni ukongeza isiphumo sokuphelisa ubushushu.
Xa inani lezixhobo zokufudumeza likhulu (ngaphezu kwe-3), isigqubuthelo esikhulu sokutshabalalisa ubushushu (ibhodi) singasetyenziswa, esisitshi esikhethekileyo sobushushu esilungiselelwe ngokwendawo kunye nokuphakama kwesixhobo sokufudumeza kwiPCB okanye iflethi enkulu. isinki yobushushu Sika iindawo ezahlukeneyo zobude becandelo.Isigqubuthelo sokutshatyalaliswa kobushushu sibotshwe ngokudibeneyo kumphezulu wecandelo, kwaye sidibanisa icandelo ngalinye ukutshabalalisa ubushushu.
Nangona kunjalo, umphumo wokutshatyalaliswa kobushushu awulungile ngenxa yokungahambi kakuhle kokuphakama ngexesha lokudibanisa kunye ne-welding yamacandelo.Ngokuqhelekileyo, isigaba esithambileyo sokutshintsha i-thermal pad yongezwa kumphezulu wecandelo ukuphucula umphumo wokutshatyalaliswa kobushushu.
03
Kwizixhobo ezithatha ukupholisa umoya we-convection simahla, kungcono ukulungiselela iisekethe ezidibeneyo (okanye ezinye izixhobo) ngokuthe nkqo okanye ngokuthe tye.
04
Yamkela uyilo locingo olufanelekileyo ukuqonda ukulahla ubushushu.Ngenxa yokuba i-resin kwipleyiti ine-conductivity ephantsi ye-thermal, kunye nemigca yefoyile yobhedu kunye nemingxuma yi-conductors yobushushu obuhle, ukwandisa izinga eliseleyo le-foil yobhedu kunye nokwandisa imingxuma yokuqhuba ubushushu zezona ndlela ziphambili zokutshatyalaliswa kobushushu.Ukuvavanya amandla okutshatyalaliswa kobushushu kwi-PCB, kuyimfuneko ukubala i-conductivity ye-thermal elinganayo (i-eq elithoba) yezinto ezidibeneyo ezenziwe ngezinto ezahlukeneyo kunye ne-thermal conductivity eyahlukileyo-i-substrate yokukhusela i-PCB.
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Izixhobo ezikwibhodi eprintiweyo efanayo kufuneka zicwangciswe ngokusemandleni ngokwexabiso le-calorific kunye neqondo lokutshatyalaliswa kobushushu.Izixhobo ezinexabiso eliphantsi le-calorific okanye ukunganyangeki kobushushu (ezifana ne-transistors encinci yesignali, iisekethe ezidibeneyo ezincinci, i-electrolytic capacitors, njl.) kufuneka zifakwe kwi-airflow yokupholisa.Ukuhamba okuphezulu (ekungeneni), izixhobo ezinokushisa okukhulu okanye ukumelana nobushushu (njengama-transistors amandla, iisekethe ezinkulu ezidibeneyo, njl.)
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Kwisalathiso esithe tye, izixhobo eziphezulu zamandla zilungiselelwe ngokusondeleyo kumda webhodi eprintiweyo ngokunokwenzeka ukunciphisa indlela yokudlulisa ukushisa;kwicala elithe nkqo, izixhobo eziphezulu zamandla zicwangciswe ngokusondeleyo kangangoko kunokwenzeka kumphezulu webhodi eprintiweyo ukunciphisa impembelelo yezi zixhobo kubushushu bezinye izixhobo..
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Ukutshatyalaliswa kobushushu bebhodi eprintiweyo kwisixhobo ikakhulu kuxhomekeke ekuhambeni komoya, ngoko ke indlela yokuhamba komoya kufuneka ifundwe ngexesha loyilo, kwaye isixhobo okanye ibhodi yesekethe eprintiweyo kufuneka iqwalaselwe ngokufanelekileyo.
Xa umoya uhamba, uhlala uhamba kwiindawo ezinokuxhatshazwa okuphantsi, ngoko xa ulungiselela izixhobo kwibhodi yesekethe eprintiweyo, gwema ukushiya indawo enkulu yomoya kwindawo ethile.
Ukucwangciswa kweebhodi zeesekethe ezininzi eziprintiweyo kuwo wonke umatshini kufuneka kwakhona ingqalelo ingxaki efanayo.
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Isixhobo esingeva ngamaqondo obushushu sibekwe ngcono kweyona ndawo isezantsi yobushushu (njengamazantsi esixhobo).Ungaze uyibeke ngqo phezu kwesixhobo sokufudumeza.Kungcono ukugxadazela izixhobo ezininzi kwinqwelomoya ethe tye.
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Beka izixhobo ezinowona mandla aphezulu kunye nokuveliswa kobushushu kufutshane neyona ndawo ilungileyo yokulahla ubushushu.Musa ukubeka izixhobo zokufudumeza okuphezulu kwiikona kunye nemida ye-peripheral yebhodi eprintiweyo, ngaphandle kokuba i-heat sink ilungiselelwe kufuphi nayo.Xa uyila i-resistor yamandla, khetha isixhobo esikhulu kangangoko kunokwenzeka, kwaye usenze sibe nesithuba esaneleyo sokutshatyalaliswa kobushushu xa uhlengahlengisa ukwakheka kwebhodi eprintiweyo.
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Kuphephe ukuxinana kweendawo ezishushu kwi-PCB, usasaze amandla ngokulinganayo kwibhodi ye-PCB kangangoko kunokwenzeka, kwaye ugcine i-PCB yomphezulu wobushushu bokusebenza iyunifomu kwaye ingaguquguquki.
Ngokuqhelekileyo kunzima ukufezekisa ukusabalalisa okufanayo ngokungqongqo ngexesha lenkqubo yokuyila, kodwa iindawo ezinobunzima obukhulu kakhulu kufuneka zigwenywe ukukhusela iindawo ezishushu ezichaphazela ukusebenza okuqhelekileyo kwesekethe yonke.
Ukuba kunokwenzeka, kuyimfuneko ukuhlalutya ukusebenza kakuhle kwe-thermal yesekethe eprintiweyo.Umzekelo, imodyuli yokuhlalutya isalathiso sokusebenza kakuhle kwesoftware eyongeziweyo kwisoftware yoyilo lwePCB yobuchwephesha inokunceda abaqulunqi baphucule uyilo lwesekethe.