The front and back sides of the pcb circuit are basically copper layers. In the manufacture of pcb circuits, no matter whether the copper layer is selected for variable cost rate or double-digit addition and subtraction, the final result is a smooth and maintenance-free surface. Although the physical properties of copper are not as cheerful as aluminum, iron, magnesium, etc., under the premise of ice, pure copper and oxygen are very susceptible to oxidation; considering the existence of co2 and water vapor in the air, the surface of all copper After contact with the gas, a redox reaction will occur quickly. Considering that the thickness of the copper layer in the PCB circuit is too thin, the copper after air oxidation will become a quasi-steady state of electricity, which will greatly harm the electrical equipment characteristics of all PCB circuits.
In order to better prevent the oxidation of copper, and to better separate the welding and non-welding welding parts of the pcb circuit during electric welding, and in order to better maintain the surface of the pcb circuit, technical engineers have created a unique Architectural Coatings. Such architectural coatings can be easily brushed on the surface of the PCB circuit, resulting in a thickness of the protective layer that must be thin and blocking the contact of copper and gas. This layer is called copper, and the raw material used is solder mask