DIP package(Dual In-line Package), inozivikanwawo sembiri-mu-mutsara yekurongedza tekinoroji, inoreva akasanganiswa edunhu machipi akaiswa mune mbiri-mu-mutsara fomu.Nhamba yacho kazhinji haipfuuri 100. DIP yakaputirwa CPU chip ine mitsara miviri yemapini inoda kuiswa muchip socket ine DIP chimiro.Zvechokwadi, inogonawo kuiswa zvakananga mubhodhi redunhu nenhamba yakafanana yemakomba ekutengesa uye geometric urongwa hwekutengesa.DIP-yakaputirwa machipisi anofanirwa kuvharirwa uye kuburitswa kubva pachisoketi chechip netarisiro chaiyo kudzivirira kukanganisa kwepini.DIP mapakeji maumbirwo mafomu ndeaya: akawanda-layer ceramic DIP DIP, single-layer ceramic DIP DIP, lead frame DIP (inosanganisira girazi ceramic sealing type, epurasitiki yekurongedza chimiro mhando, ceramic yakaderera kunyungudika girazi repackaging mhando)

DIP package ine zvinotevera maitiro:

1. Inokodzera perforation welding paPCB (yakadhindwa redunhu bhodhi), iri nyore kushanda;

2. The reshiyo pakati chip nzvimbo uye pasuru nzvimbo yakakura, saka vhoriyamu yakakurawo;

DIP ndiyo inonyanya kufarirwa plug-in package, uye mashandisirwo ayo anosanganisira yakajairwa logic IC, memory uye microcomputer maseketi.Iwo ekutanga 4004, 8008, 8086, 8088 uye mamwe maCPU ese akashandiswa DIP mapakeji, uye mitsara miviri yemapini paari anogona kuiswa mukati meiyo slots pabhodhi reamai kana kutengeswa pabhodhi reamai.