Ke hilinaʻi nei nā mea kaapuni i nā conductors kiʻekiʻe a me nā mea dielectric e hoʻohui i nā mea paʻakikī o kēia wā i kekahi i kekahi no ka hana maikaʻi loa.Eia nō naʻe, ma ke ʻano he alakaʻi, pono kēia mau mea hoʻokele keleawe PCB, inā he DC a i ʻole mm Wave PCB papa, pono e pale i ka wā kahiko a me ka pale oxidation.Hiki ke hoʻokō ʻia kēia pale ma ke ʻano o ka electrolysis a me nā uhi immersion.Hāʻawi pinepine lākou i nā pae like ʻole o ka weld, no laila me nā ʻāpana liʻiliʻi loa, micro-surface mount (SMT), etc., hiki ke hoʻokumu ʻia kahi wahi weld piha loa.Loaʻa nā ʻano pale a me nā hoʻomaʻamaʻa ʻili i hiki ke hoʻohana ʻia ma ka PCB copper conductors i ka ʻoihana.ʻO ka hoʻomaopopo ʻana i nā hiʻohiʻona a me nā kumukūʻai pili o kēlā me kēia uhi a me ka mālama ʻana i luna e kōkua iā mākou e hana i ka koho kūpono e hoʻokō i ka hana kiʻekiʻe a me ka lōʻihi o ka lawelawe ʻana o nā papa PCB.

ʻAʻole maʻalahi ke koho ʻana i kahi PCB hope loa e pono ai e noʻonoʻo i ke kumu o ka PCB a me nā kūlana hana.ʻO ke ʻano o kēia manawa e pili ana i nā kaapuni PCB paʻa, haʻahaʻa haʻahaʻa, kiʻekiʻe-wikiwiki a me nā PCBS liʻiliʻi, ʻoi aku ka liʻiliʻi, kiʻekiʻe-frequency PCBS he mau luʻi no nā mea hana PCB he nui.Hana ʻia nā kaapuni PCB ma o nā laminates o nā mea kaupaona keleawe like ʻole a me nā mānoanoa i hāʻawi ʻia i nā mea hana PCB e nā mea hana waiwai, e like me Rogers, a laila e hana i kēia mau laminates i nā ʻano PCBS no ka hoʻohana ʻana i ka uila.Me ka ʻole o ke ʻano o ka pale ʻana i ka ʻili, e oxidize nā conductors ma ke kaapuni i ka wā e mālama ai.Hana ʻia ka lāʻau hoʻokele koʻikoʻi ma ke ʻano he mea pale e hoʻokaʻawale i ka conductor mai ke kaiapuni.ʻAʻole wale ia e pale i ka PCB conductor mai ka oxidation, akā hāʻawi pū kekahi i kahi interface no nā kaʻa kaʻa a me nā ʻāpana, me ka hoʻopili alakaʻi o nā kaʻa hoʻohui (ics).

E koho i ka ʻili PCB kūpono
Pono ka lapaʻau ʻāina kūpono e kōkua i ka hoʻokō ʻana i ka noi kaapuni PCB a me ke kaʻina hana.ʻOkoʻa ke kumukūʻai ma muli o nā kumukūʻai waiwai like ʻole, nā kaʻina hana like ʻole a me nā ʻano hoʻopau e pono ai.Hāʻawi kekahi mau lapaʻau ʻili i ka hilinaʻi kiʻekiʻe a me ka hoʻokaʻawale kiʻekiʻe o nā kaʻa kaʻa i holo ʻia, aʻo nā mea ʻē aʻe e hana i nā alahaka pono ʻole ma waena o nā alakaʻi.Hoʻokō kekahi mau lapaʻau ʻili i nā koi koa a me nā aerospace, e like me ka mahana, ka haʻalulu a me ka haʻalulu, aʻo nā mea ʻē aʻe ʻaʻole e hōʻoiaʻiʻo i ka hilinaʻi kiʻekiʻe e pono ai no kēia mau noi.Aia ma lalo iho kekahi mau lapaʻau ʻili PCB i hiki ke hoʻohana ʻia i nā kaapuni mai nā kaapuni DC a i nā pūna hawewe millimeter a me nā kaapuni kikohoʻe kiʻekiʻe (HSD).
●ENIG
●ENEPIG
●HASL
● Kālā Kaiapuni
●Pina Kaiapuni
●LF HASL
●OSP
●Electrolytic paʻakikī gula
●Electrolytically paʻa gula palupalu

1.ENIG
ʻO ENIG, i ʻike ʻia ʻo ke kaʻina hana nickel-gula kemika, ua hoʻohana nui ʻia i ka mālama ʻana o nā alakaʻi papa PCB.He kaʻina hana haʻahaʻa haʻahaʻa maʻalahi kēia e hana ana i kahi ʻāpana lahilahi o ke gula weldable ma luna o kahi papa nickel ma ka ʻili o kahi conductor, e hopena i kahi ʻili palahalaha me ka hiki ke weld maikaʻi ma nā kaʻa puni paʻa.ʻOiai ʻo ke kaʻina hana ENIG e hōʻoia i ka pono o ka electroplating through-hole (PTH), hoʻonui ia i ka nalowale o ka conductor ma ke alapine kiʻekiʻe.He lōʻihi ka mālama ʻana o kēia kaʻina, e like me nā kūlana RoHS, mai ke kaʻina hana kaʻapuni, a i ke kaʻina hui ʻāpana, a me ka huahana hope loa, hiki iā ia ke hāʻawi i ka pale lōʻihi no nā conductors PCB, no laila he nui nā mea hoʻomohala PCB e koho i kahi. lapaʻau maʻamau.

2.ENEPIG
ʻO ENEPIG kahi hoʻomaikaʻi o ke kaʻina hana ENIG ma o ka hoʻohui ʻana i kahi papa palladium lahilahi ma waena o ka papa nickel kemikal a me ka papa gula.Mālama ka papa palladium i ka papa nickel (e pale ana i ka conductor keleawe), aʻo ka papa gula e pale i ka palladium a me ka nickel.He kūpono kēia ʻano lapaʻau no ka hoʻopaʻa ʻana i nā polokalamu i nā alakaʻi PCB a hiki ke mālama i nā kaʻina hana reflow.E like me ENIG, ʻo ENEPIG ka hoʻokō RoHS.

3. Kālā Kaiapuni
ʻO ka sedimentation kālā kemika he hana kemika non-electrolytic kahi i hoʻokomo piha ʻia ai ka PCB i loko o kahi hopena o nā ion kālā e hoʻopaʻa i ke kālā i ka ʻili o ke keleawe.ʻOi aku ka paʻa a me ka like o ka hopena o ka uhi ma mua o ENIG, akā nele i ka pale a me ka lōʻihi i hāʻawi ʻia e ka nickel layer ma ENIG.ʻOiai ʻoi aku ka maʻalahi o kāna kaʻina hana lapaʻau ma mua o ENIG, ʻaʻole kūpono ia no ka mālama lōʻihi me nā mea hana kaapuni.

4.Pina Immersion
Hoʻokumu ʻia nā kaʻina hana hoʻoheheʻe kemika i ka uhi ʻili ʻili ma ka ʻili o ka conductor ma o ke kaʻina hana he nui e pili ana i ka hoʻomaʻemaʻe, micro-etching, acid solution prepreg, ka hoʻomaʻemaʻe hope ʻana.Hiki i ka lāʻau lapaʻau ke hāʻawi i ka pale maikaʻi no ke keleawe a me nā mea hoʻokele, e hāʻawi ana i ka hana haʻahaʻa haʻahaʻa o nā kaapuni HSD.ʻO ka mea pōʻino, ʻaʻole ia kekahi o nā lāʻau lapaʻau i hoʻopaʻa ʻia no ka lōʻihi loa ma muli o ka hopena o ke keleawe i ke keleawe i ka manawa (ʻo ia hoʻi, ʻo ka hoʻopuehu ʻana o kekahi metala i kekahi e hōʻemi ana i ka hana lōʻihi o kahi alakaʻi kaapuni).E like me ke kala kemika, ʻo ka pahu kemika he kaʻina alakaʻi ʻole, hoʻokō RoHs.

5.OSP
ʻO ke kiʻi ʻoniʻoni hoʻoheheʻe kūlohelohe (OSP) he pale pale non-metallic i uhi ʻia me kahi hopena wai.Hoʻopili ʻia kēia hoʻopau iā RoHS.Eia nō naʻe, ʻaʻohe lōʻihi o ka mālama ʻana o kēia ʻili a hoʻohana maikaʻi ʻia ma mua o ka hoʻopili ʻia ʻana o ke kaapuni a me nā ʻāpana i ka PCB.I kēia mau lā, ua ʻike ʻia nā membrane OSP hou ma ka mākeke, i manaʻo ʻia e hiki ke hāʻawi i ka pale mau loa no nā conductors.

6.Electrolytic gula paakiki
ʻO ka mālama gula paʻakikī he kaʻina electrolytic e pili ana i ke kaʻina hana RoHS, hiki ke pale i ka PCB a me ka conductor keleawe mai ka oxidation no ka manawa lōʻihi.Eia nō naʻe, ma muli o ke kumukūʻai kiʻekiʻe o nā mea waiwai, ʻo ia kekahi o nā mea hoʻonaninani nui loa.Loaʻa iā ia ka weldability maikaʻi ʻole, ka weldability maikaʻi ʻole no ka hoʻopaʻa ʻana i ka mālama gula palupalu, a ʻo ia ka RoHS compliant a hiki ke hāʻawi i kahi ʻili maikaʻi no ka mea e hoʻopaʻa ai i nā alakaʻi o ka PCB.