COB soft package

1. What is COB soft package
Careful netizens may find that there is a black thing on some circuit boards, so what is this thing? Why is it on the circuit board? What is the effect? In fact, this is a kind of package. We often call it “soft package”. It is said that soft package is actually “hard”, and its constituent material is epoxy resin. , We usually see that the receiving surface of the receiving head is also of this material, and the chip IC is inside it. This process is called “bonding”, and we usually call it “binding”.

 

This is a wire bonding process in the chip production process. Its English name is COB (Chip On Board), that is, chip on board packaging. This is one of the bare chip mounting technologies. The chip is attached with epoxy resin. Mounted on the PCB printed circuit board, then why some circuit boards do not have this kind of package, and what are the characteristics of this kind of package?

 

2. Features of COB soft package
This kind of soft packaging technology is often for cost. As the simplest bare chip mounting, in order to protect the internal IC from damage, this kind of packaging generally requires a one-time molding, which is generally placed on the copper foil surface of the circuit board. It is round and the color is black. This packaging technology has the advantages of low cost, space saving, light and thin, good heat dissipation effect, and simple packaging method. Many integrated circuits, especially most low-cost circuits, only need to be integrated in this method. The circuit chip is led out with more metal wires, and then handed over to the manufacturer to place the chip on the circuit board, solder it with a machine, and then apply glue to solidify and harden.

 

3. Application occasions
Because this kind of package has its own unique characteristics, it is also used in some electronic circuit circuits, such as MP3 players, electronic organs, digital cameras, game consoles, etc., in pursuit of low-cost circuits.
In fact, COB soft packaging is not only limited to chips, it is also widely used in LEDs, such as COB light source, which is an integrated surface light source technology that is directly attached to the mirror metal substrate on the LED chip.