Paunenge uchigadzira PCB, imwe yemibvunzo yakakosha yekufunga ndeyekushandisa zvinodiwa zvemasevhisi mabasa anoda kuti yakawanda sei wiring layer, ndege yepasi uye ndege yemagetsi, uye yakadhindwa redunhu bhodhi wiring layer, ndege yepasi uye simba. Kutemerwa kwendege yehuwandu hwezvikamu uye basa redunhu, chiratidzo chekuvimbika, EMI, EMC, mutengo wekugadzira uye zvimwe zvinodiwa.
Kune akawanda magadzirirwo, pane zvakawanda zvinopokana zvinodiwa paPCB kuita zvinodiwa, mutengo wakatarwa, tekinoroji yekugadzira, uye kuoma kwehurongwa.Iyo laminated dhizaini yePCB inowanzoita sarudzo yekukanganisa mushure mekufunga kwakasiyana zvinhu.High-speed digital circuits uye whisker circuits inowanzogadzirwa nemapuranga akawanda.
Heano maitiro masere ekugadzira cascading:
1. Delamination
Mune multilayer PCB, kazhinji pane chiratidzo chechiratidzo (S), simba rekupa (P) ndege uye pasi (GND) ndege.Iyo ndege yemagetsi uye ndege yeGROUND inowanzove isina kupatsanurwa ndege dzakasimba izvo zvinopa yakanaka yakaderera-impedance ikozvino nzira yekudzoka kune yazvino yemitsetse yezviratidzo zviri pedyo.
Mazhinji ematanho ezviratidzo ari pakati peaya masosi emagetsi kana pasi rengedzo ndege maseru, achigadzira symmetric kana asymmetric banded mitsetse.Iyo yepamusoro uye yakadzika mitsara yePCB yakawanda inowanzoshandiswa kuisa zvikamu uye shoma shoma ye wiring.Iyo wiring yezviratidzo izvi haifanirwe kureba kuti ideredze mwaranzi yakananga inokonzerwa newaya.
2. Sarudza simba rimwechete rereferensi ndege
Kushandiswa kwe decoupling capacitors chiyero chakakosha chekugadzirisa simba rekupa kuvimbika.Decoupling capacitors inogona kuiswa chete kumusoro uye pasi pePCB.Iyo nzira ye decoupling capacitor, solder pad, uye gomba pass ichakanganisa zvakanyanya mhedzisiro ye decoupling capacitor, iyo inoda kuti dhizaini ifunge kuti nzira ye decoupling capacitor inofanira kunge ipfupi uye yakafara sezvinobvira, uye waya yakabatana negomba inofanira. ivawo pfupi sezvinobvira.Semuenzaniso, mune yakakwirira-yekumhanya dhijitari yedunhu, zvinokwanisika kuisa iyo decoupling capacitor pamusoro wepamusoro wePCB, govera layer 2 kune yakakwirira-yekumhanya dhijitari wedunhu (senge processor) seye simba layer, layer 3. sedhizaini yechiratidzo, uye 4 seyepamusoro-inomhanya yedhijitari redunhu pasi.
Pamusoro pezvo, zvinodikanwa kuve nechokwadi chekuti chiratidzo chekufambisa chinofambiswa neicho chepamusoro-chinomhanya chidhijitari chinotora simba rakafanana nendege yereferensi, uye iyi dhizaini yemagetsi ndiyo dhizaini yekupa magetsi yedhijitari inomhanya kwazvo.
3. Sarudza iyo yakawanda-simba rengedzo ndege
Iyo yakawanda-simba rengedzo ndege ichakamurwa kuita akati wandei akasimba matunhu ane akasiyana voltages.Kana chiratidzo chechiratidzo chiri pedyo ne-multi-power layer, chiratidzo chemazuva ano pane chigadziro chechiratidzo chiri pedyo chichasangana nenzira isingafadzi yekudzoka, iyo inotungamirira kumapundu munzira yekudzoka.
Nekumhanya-mhanya kwedhijitari masaini, iyi isinganzwisisike nzira yekudzoka nzira inogona kukonzera matambudziko akakomba, saka zvinodikanwa kuti yakakwirira-yekumhanya yedhijitari chiratidzo wiring inofanira kunge iri kure neakawanda-simba rereferenzi ndege.
4.Sarudza ndege dzakawanda dzepasi
Multiple ground reference ndege (grounding planes) inogona kupa yakanaka yakaderera-impedance ikozvino nzira yekudzoka, iyo inogona kuderedza common-mode EMl.Iyo ndege yepasi uye ndege yemagetsi inofanira kubatanidzwa zvakasimba, uye chiratidzo chechiratidzo chinofanira kubatanidzwa zvakasimba kune iyo iri pedyo inotaridzirwa ndege.Izvi zvinogona kuwanikwa nekudzikisa ukobvu hwepakati pakati pematanho.
5. Dhizaina wiring musanganiswa zvine musoro
Iwo maviri akaturikidzana nenzira yechiratidzo anonzi "wiring musanganiswa".Iyo yakanakisa wiring musanganiswa wakagadzirirwa kudzivirira kudzoka ikozvino kuyerera kubva kune imwe referensi ndege kuenda kune imwe, asi pachinzvimbo ichiyerera kubva pane imwe nzvimbo (kumeso) kweimwe referensi ndege kuenda kune imwe.Kuti upedze iyo yakaoma wiring, iyo interlayer kutendeuka kweiyo wiring haidzivisiki.Kana iyo chiratidzo ichishandurwa pakati pematanho, iyo yekudzoka ikozvino inofanirwa kuve nechokwadi kuti inoyerera zvakanaka kubva kune imwe referensi ndege kuenda kune imwe.Muchigadziro, zvinonzwisisika kufunga nezvematanho ari pedyo sekubatanidza wiring.
Kana nzira yechiratidzo ichida kutenderera akati wandei, kazhinji haisi dhizaini inonzwisisika kuti uishandise semusanganiswa wewaya, nekuti nzira kuburikidza neakawanda akaturikidzana haina chigamba chekudzoka mafungu.Kunyangwe chitubu chinogona kuderedzwa nekuisa decoupling capacitor padhuze neburi-gomba kana kuderedza ukobvu hwepakati pakati pemareferenzi ndege, haisi dhizaini yakanaka.
6.Kuseta wiring direction
Kana iyo nzira yewaya yaiswa pane imwechete chiratidzo dhizaini, inofanirwa kuve nechokwadi chekuti nzira dzakawanda dzewaya dzinoenderana, uye dzinofanira kunge dziri orthogonal kune wiring nzira dzemasaini ari pedyo.Semuyenzaniso, iyo wiring inotungamira yeimwe chiratidzo chiratidzo inogona kusetwa kune iyo "Y-axis" kutungamira, uye iyo wiring nzira yeimwe iri padyo yechiratidzo layer inogona kusetwa kune "X-axis" kutungamira.
7. Ayakadonhedza iyo even layer structure
Inogona kuwanikwa kubva kune yakagadzirwa PCB lamination kuti classical lamination dhizaini inenge yese kunyange maseru, pane zvisinganzwisisike zvidimbu, chiitiko ichi chinokonzerwa nezvakasiyana siyana.
Kubva pakugadzirwa kweakadhindwa redunhu bhodhi, isu tinogona kuziva kuti ese conductive layer mune redunhu bhodhi inochengetwa pamusimboti layer, iyo yepakati layer inogara yakapetwa kaviri-mativi ekuvhara bhodhi, kana kushandiswa kuzere kweiyo core layer. , iyo conductive layer yeakadhindwa redunhu bhodhi yakaenzana
Kunyange layer akadhindwa redunhu mapuranga ane mari zvakanakira.Nekuda kwekushaikwa kwechikamu chemedia uye copper cladding, mutengo wezvisinganzwisisike-zviverengero zvikamu zvePCB mbishi zvinhu wakadzikira zvishoma pane mutengo wechero zvidimbu zvePCB.Nekudaro, mutengo wekugadzirisa weODd-layer PCB uripachena wakakwira kupfuura weiyo-layer PCB nekuti ODd-layer PCB inoda kuwedzera nonstandard laminated core layer bonding process pahwaro hweiyo core layer structure process.Kuenzaniswa neyakajairwa musimboti dhizaini chimiro, kuwedzera mhangura kupfekedzwa kunze kweiyo musimboti layer chimiro kunotungamira kuderera kwekugadzira kushanda uye kureba kutenderera kwekugadzira.Isati yaita laminating, iyo yekunze core layer inoda kumwe kugadziridzwa, izvo zvinowedzera njodzi yekukwenya uye misetching yekunze layer.Kuwedzerwa kwekubata kwekunze kuchawedzera zvakanyanya mari yekugadzira.
Kana mukati uye kunze akaturikidzana akadhindwa redunhu bhodhi akatonhodzwa pashure multi-layer redunhu bonding muitiro, akasiyana lamination makakatanwa achabudisa siyana madhigirii kukotama pamusoro akadhindwa redunhu bhodhi.Uye sezvo ukobvu hwebhodhi hunowedzera, njodzi yekupeta yakadhindwa yedunhu bhodhi ine maviri akasiyana maumbirwo inowedzera.Odd-layer redunhu mabhodhi ari nyore kukotama, nepo kunyange-layer akadhindwa edunhu mabhodhi anogona kudzivirira kukotama.
Kana iyo yakadhindwa bhodhi bhodhi rakagadzirwa nenhamba isinganzwisisike yemagetsi maseru uye kunyange nhamba yezviratidzo zvechiratidzo, nzira yekuwedzera masimba emagetsi inogona kugamuchirwa.Imwe nzira iri nyore ndeyekuwedzera yepasi pasi pakati peiyo stack pasina kushandura mamwe maSettings.Ndiko kuti, iyo PCB ine waya mune isinganzwisisike nhamba yezvikamu, uyezve pasi pasi rinodzokororwa pakati.
8. Kufunga Kwemari
Panyaya yemutengo wekugadzira, multilayer circuit boards zvechokwadi inodhura kupfuura imwechete uye kaviri layer redunhu mabhodhi ane yakafanana PCB nharaunda, uye iwo akawanda akaturikidzana, anowedzera mutengo.Nekudaro, kana uchifunga nezvekuzadzikiswa kwemabasa edunhu uye redunhu bhodhi miniaturization, kuve nechokwadi chekuvimbika kwechiratidzo, EMl, EMC uye zvimwe zviratidzo zvekuita, akawanda-layer redunhu mabhodhi anofanirwa kushandiswa zvakanyanya sezvinobvira.Pakazere, musiyano wemutengo pakati peakawanda-layer redunhu mabhodhi uye imwechete-layer uye maviri-layer redunhu mabhodhi haana kukwira zvakanyanya kupfuura zvinotarisirwa.