Flexible Printed Circuit
Flexible Printed Circuit，Inogona kukotama, ronda uye kupetwa zvakasununguka.Iyo inochinjika yedunhu bhodhi inogadziriswa nekushandisa polyimide firimu seyakadzika zvinhu.Inonzi zvakare bhodhi rakapfava kana FPC muindasitiri.Iyo nzira yekuyerera yeinochinjika yedunhu bhodhi yakakamurwa kuita Double-sided inoshanduka redunhu bhodhi process, yakawanda-layer inoshanduka redunhu bhodhi process.Iyo FPC yakapfava bhodhi inogona kumira mamirioni ekukotama kwesimba pasina kukuvadza waya.Inogona kurongeka zvisina tsarukano maererano nezvinodiwa zvemagadzirirwo enzvimbo, uye inogona kufambiswa uye kutambanudzwa zvisina tsarukano munzvimbo ine mativi matatu, kuitira kuti iwane kubatanidzwa kwechikamu musangano uye waya yekubatanidza;iyo flexible circuit board inogona kuva Ukuru uye uremu hwezvigadzirwa zvemagetsi zvakaderedzwa zvakanyanya, uye zvakakodzera kugadzirwa kwezvigadzirwa zvemagetsi mukutungamira kwehupamhi hwepamusoro, miniaturization uye yakakwirira kuvimbika.
Chimiro chemapuranga anochinjika: zvichienderana nenhamba yezvikamu zvemhangura inofambisa foil, inogona kukamurwa kuita imwechete-layer mapuranga, maviri-layer mapuranga, akawanda-layer mapuranga, maviri-mativi mapuranga, nezvimwe.
Material properties uye nzira dzekusarudza:
(1) Substrate: Iyo zvinhu ndeye polyimide (POLYMIDE), inova yakanyanya kupisa tembiricha, yakakwirira simba polymer zvinhu.Inogona kumira tembiricha ye400 madhigirii celsius kwemasekonzi gumi, uye simba rekusimba iri 15,000-30,000PSI.25μm gobvu substrates ndiyo yakachipa uye inonyanya kushandiswa.Kana bhodhi redunhu rinodiwa kuti rive rakaoma, substrate ye50 μm inofanira kushandiswa.Zvakasiyana, kana bhodhi redunhu richida kuve rakapfava, shandisa 13μm substrate
(2) Transparent glue yehwaro zvinhu: Yakakamurwa kuita mhando mbiri: epoxy resin uye polyethylene, ese ari thermosetting glue.Simba re polyethylene rakaderera.Kana iwe uchida kuti bhodhi redunhu rive rakapfava, sarudza polyethylene.Iyo yakakura iyo substrate uye yakajeka glue pairi, iyo yakaoma bhodhi.Kana bhodhi redunhu rine nzvimbo yakakura yekukotama, iwe unofanirwa kuedza kushandisa yakaonda substrate uye läpinäkyvä glue kuderedza kushushikana pamusoro pechiso chemhangura foil, kuitira kuti mukana we micro-cracks mufoil yemhangura ishoma.Zvechokwadi, kune nzvimbo dzakadaro, mapuranga e-single-layer anofanira kushandiswa zvakanyanya sezvinobvira.
(3) Copper foil: yakakamurwa kuita mhangura yakakungurutswa uye electrolytic mhangura.Mhangura yakakungurutswa ine simba rakawanda uye inoshingirira kukotama, asi inodhura.Electrolytic mhangura yakachipa zvakanyanya, asi simba rayo rakashata uye iri nyore kutyora.Inowanzoshandiswa muzviitiko apo pane zvishoma kukotama.Sarudzo yemhangura foil ukobvu kunoenderana nehupamhi hudiki uye diki spacing yema lead.Iyo yakaonda iyo foil yemhangura, idiki iyo inogoneka hupamhi uye nzvimbo.Paunosarudza mhangura yakakungurutswa, teerera kune inotenderera nzira yemhangura foil.Iyo inotenderedza nzira yefoiri yemhangura inofanirwa kuenderana neiyo huru yekubhenda kutungamira kwebhodhi redunhu.
(4) Firimu yekudzivirira uye glue yayo yakajeka: Firimu yekudzivirira ye25 μm ichaita kuti bhodhi redunhu rive rakaoma, asi mutengo unodhura.Kune mapuranga edunhu ane mabhendi akakura, zviri nani kushandisa 13μm inodzivirira firimu.Transparent glue yakakamurwawo kuita marudzi maviri: epoxy resin uye polyethylene.Iyo yedunhu bhodhi inoshandisa epoxy resin yakaoma.Mushure mokunge kupisa kunopisa kwapera, imwe glue yakajeka ichabudiswa kubva kumucheto wefirimu inodzivirira.Kana hukuru hwepadhi hukuru kudarika hukuru hwekuvhura kwefirimu yekudzivirira, glue yakawedzera inoderedza hukuru hwepadhi uye inokonzera kuti muganhu wayo urege kugadzikana.Panguva ino, edza kushandisa glue rakajeka nehupamhi hwe 13 μm.
(5) Pad plating: Pamabhodhi edunhu ane mabhendi akakura uye mamwe mapedhi akafumurwa, electroplating nickel + kemikari yegoridhe plating inofanirwa kushandiswa, uye nickel layer inofanirwa kuve yakatetepa sezvinobvira: 0.5-2μm, kemikari yegoridhe layer 0.05-0.1 μm .