1. No ke aha e hoʻohana ai i nā papa kaapuni seramika
ʻO ka PCB maʻamau ka mea maʻamau i hana ʻia me ka foil keleawe a me ka hoʻopaʻa ʻana i ka substrate, a ʻo ka mea substrate ka hapa nui o ke aniani fiber (FR-4), phenolic resin (FR-3) a me nā mea ʻē aʻe, adhesive ka mea maʻamau phenolic, epoxy, etc. ʻO ka hana PCB ma muli o ke koʻikoʻi wela, nā mea kemika, nā kaʻina hana kūpono ʻole a me nā kumu ʻē aʻe, a i ʻole ke kaʻina hana ma muli o nā ʻaoʻao ʻelua o ke keleawe asymmetry, maʻalahi ke alakaʻi i nā pae like ʻole o ka warping papa PCB.
PCB Twist
A ʻo kekahi PCB substrate - ceramic substrate, ma muli o ka hana hoʻoheheʻe wela, ka hiki ke halihali i kēia manawa, insulation, thermal expansion coefficient, a me nā mea ʻē aʻe, ʻoi aku ka maikaʻi ma mua o ka papa aniani fiber PCB maʻamau, no laila ua hoʻohana nui ʻia i nā modula uila uila mana kiʻekiʻe. , aerospace, uila uila a me nā huahana ʻē aʻe.
ʻO nā pani seramika
Me ka PCB maʻamau me ka hoʻohana ʻana i ka pahu keleawe adhesive a me ka hoʻopaʻa ʻana i ka substrate, aia ka PCB ceramic i ke kiʻekiʻe wela o ka mahana, ma ke ala o ka hoʻopaʻa ʻana i ke keleawe keleawe a me ka substrate seramika i hui pū ʻia, ikaika paʻa paʻa, ʻaʻole e hāʻule ke keleawe keleawe, hilinaʻi kiʻekiʻe, hana paʻa i ke kiʻekiʻe. ka mahana, ka haʻahaʻa kiʻekiʻe
2. Mea nui o ka substrate seramika
Alumina (Al2O3)
ʻO alumina ka mea hoʻohana maʻamau i hoʻohana ʻia i ka substrate seramika, no ka mea ma ka mechanical, thermal a me nā waiwai uila i hoʻohālikelike ʻia i ka hapa nui o nā seramika oxide, ikaika kiʻekiʻe a me ke kūpaʻa kemika, a me ke kumu waiwai o nā mea maka, kūpono no nā ʻano hana ʻenehana a me nā ʻano like ʻole. .E like me ka pakeneka o ka alumina (Al2O3) hiki ke maheleia i 75 porcelain, 96 porcelain, 99.5 porcelain.ʻAʻole pili ʻia nā waiwai uila o ka alumina e nā ʻokoʻa like ʻole o ka alumina, akā ua loli nui kona mau ʻano mechanical a me ka conductivity thermal.ʻO ka substrate me ka maʻemaʻe haʻahaʻa he ʻoi aku ka aniani a ʻoi aku ka nui o ka ʻili.ʻO ke kiʻekiʻe o ka maʻemaʻe o ka substrate, ʻoi aku ka maʻalahi, compact, medium loss ka haʻahaʻa, akā ʻoi aku ka kiʻekiʻe o ke kumukūʻai.
Beryllium oxide (BeO)
ʻOi aku ka nui o ka conductivity thermal ma mua o ka alumini metala, a hoʻohana ʻia i nā kūlana e pono ai ka conductivity thermal kiʻekiʻe.E emi koke ana ma hope o ka piʻi ʻana o ka mahana ma mua o 300 ℃, akā ua kaupalena ʻia kona hoʻomohala ʻana e kona ʻona.
Aluminum nitride (AlN)
ʻO nā seramika nitride alumini he mau seramika me nā pauka nitride aluminika e like me ke ʻano crystalline nui.Ke hoʻohālikelike ʻia me ka substrate seramika alumina, ka pale ʻana i ka insulation, ka insulation e kū i ka volta kiʻekiʻe, haʻahaʻa dielectric mau.He 7 ~ 10 ka nui o kona conductivity wela ma mua o Al2O3, a ua pili like kona thermal expansion coefficient (CTE) me ka chip silicon, he mea nui loa ia no nā chips semiconductor kiʻekiʻe.Ma ke kaʻina hana, hoʻopili nui ʻia ka conductivity thermal o AlN e ka ʻike o nā koena o ka oxygen impurities, a hiki ke hoʻonui nui ʻia ka conductivity thermal ma ka hōʻemi ʻana i ka ʻike oxygen.I kēia manawa, ka thermal conductivity o ke kaʻina hana
Ma muli o nā kumu i luna aʻe nei, hiki ke ʻike ʻia aia nā alumina ceramics i ke kūlana koʻikoʻi i nā kahua o ka microelectronics, ka uila uila, nā microelectronics hui pū ʻia a me nā modula mana ma muli o kā lākou hana piha piha.
Ke hoʻohālikelike ʻia me ka mākeke o ka nui like (100mm × 100mm × 1mm), nā mea like ʻole o ke kumukūʻai substrate seramika: 96% alumina 9.5 yuan, 99% alumina 18 yuan, alumini nitride 150 yuan, beryllium oxide 650 yuan, hiki ke ʻike ʻia. ʻano nui nō hoʻi ka ʻokoʻa kumu kūʻai ma waena o nā substrate like ʻole
3. ʻO nā pono a me nā pōʻino o ka PCB ceramic
Pono
- ʻO ka hiki ke halihali i kēia manawa, 100A mau manawa ma o 1mm 0.3mm kino keleawe mānoanoa, piʻi ka mahana ma kahi o 17 ℃
- ʻO ka piʻi ʻana o ka mahana ma kahi o 5 ℃ wale nō ke hele mau nei ka 100A i ke kino keleawe mānoanoa 2mm 0.3mm.
- ʻOi aku ka maikaʻi o ka hoʻoheheʻe ʻana i ka wela, ka mea hoʻonui haʻahaʻa wela, ke ʻano paʻa, ʻaʻole maʻalahi i ka warping.
- ʻO ka insulation maikaʻi, ke kūpaʻa kiʻekiʻe, e hōʻoia i ka palekana pilikino a me nā mea hana.
Nā pōʻino
ʻO ka palupalu kekahi o nā hemahema nui, e alakaʻi ana i ka hana ʻana i nā papa liʻiliʻi wale nō.
He pipiʻi ke kumukūʻai, ʻoi aku ka nui o nā koi o nā huahana uila, ka papa kaapuni seramika a i hoʻohana ʻia paha i kekahi o nā huahana kiʻekiʻe, ʻaʻole e hoʻohana ʻia nā huahana haʻahaʻa.
4. Ka hoʻohana ʻana i ka PCB keramika
a.Kiʻekiʻe mana uila module, solar panel module, etc
- Kiʻekiʻe alapine hoʻololi mana lako, solid state relay
- Mea uila uila, aerospace, uila uila
- Nā huahana kukui LED mana kiʻekiʻe
- Antenna kamaʻilio