1. Kutheni usebenzisa iibhodi zeesekethe ze-ceramic

I-PCB eqhelekileyo idla ngokwenziwa ngefoyile yobhedu kunye ne-substrate bonding, kwaye i-substrate material ininzi i-glass fiber (FR-4), i-phenolic resin (FR-3) kunye nezinye izinto, i-adhesive idla ngokuba yi-phenolic, epoxy, njl. PCB processing ngenxa yoxinzelelo thermal, imiba yemichiza, inkqubo yemveliso engafanelekanga kunye nezinye izizathu, okanye kwinkqubo yoyilo ngenxa kumacala amabini asymmetry yobhedu, kulula ukukhokelela izidanga ezahlukeneyo ibhodi PCB warping.

PCB Twist

Kwaye enye i-substrate ye-PCB - i-substrate ye-ceramic, ngenxa yentsebenzo yokutshatyalaliswa kobushushu, umthamo okhoyo ngoku, ukugquma, i-coefficient yokwandisa i-thermal, njl., ingcono kakhulu kunebhodi ye-PCB yeglasi eqhelekileyo, ngoko isetyenziswa ngokubanzi kwiimodyuli zamandla aphezulu ombane. , i-aerospace, izixhobo zombane zomkhosi kunye nezinye iimveliso.

Iinxalenye zeCeramic

Nge-PCB eqhelekileyo esebenzisa i-adhesive copper foil kunye ne-substrate bonding, i-ceramic PCB ikwimekobume yobushushu obuphezulu, ngendlela yokudibanisa i-foil yobhedu kunye ne-ceramic substrate edityanisiweyo, amandla okubopha aqinile, i-foil yobhedu ayiyi kuwa, ukuthembeka okuphezulu, ukusebenza okuzinzileyo kwindawo ephezulu. ubushushu, ubume obuphezulu bokufuma

2. Izinto eziphambili ze-ceramic substrate

IAlumina (Al2O3)

I-alumina yeyona nto isetyenziswa kakhulu kwi-substrate substrate kwi-ceramic substrate, kuba kwi-mechanical, thermal kunye neempawu zombane xa kuthelekiswa nezinye iikeramics ze-oxide, amandla aphezulu kunye nokuzinza kweekhemikhali, kunye nomthombo ocebileyo wezinto eziluhlaza, ezifanelekileyo kwimveliso yobugcisa eyahlukeneyo kunye neemilo ezahlukeneyo. .Ngokwepesenti ye-alumina (Al2O3) inokwahlulwa ibe yi-75 porcelain, i-96 porcelain, i-99.5 porcelain.Iimpawu zombane ze-alumina phantse azichatshazelwa ngumxholo ohlukeneyo we-alumina, kodwa iimpawu zayo zomatshini kunye ne-thermal conductivity zitshintsha kakhulu.I-substrate enobunyulu obuphantsi ineglasi eninzi kunye noburhabaxa obukhulu bomphezulu.Ukuphakama kokucoceka kwe-substrate, ilula ngakumbi, i-compact, ilahleko ephakathi iphantsi, kodwa ixabiso liphezulu.

I-Beryllium oxide (BeO)

Ine-conductivity ephezulu ye-thermal kune-aluminium yensimbi, kwaye isetyenziswe kwiimeko apho kufuneka i-thermal conductivity ephezulu.Yehla ngokukhawuleza emva kokuba iqondo lobushushu lidlule kwi-300℃, kodwa uphuhliso lwayo luthintelwa bubutyhefu bayo.

IAluminiyam nitride (AlN) 

Iiseramikhi ze-aluminiyam ze-nitride ziiseramikhi ezine-aluminiyam nitride powders njengesona sigaba sekristale esingundoqo.Xa kuthelekiswa ne-alumina ye-ceramic substrate, ukumelana nokufakwa kwe-insulation, ukugquma ukumelana nombane ophezulu, ukuguquguquka kwe-dielectric ephantsi.I-thermal conductivity yayo yi-7 ~ 10 amaxesha e-Al2O3, kunye ne-thermal expansion coefficient (CTE) iphantse ifaniswe ne-silicon chip, ebaluleke kakhulu kwi-chips semiconductor yamandla aphezulu.Kwinkqubo yokuvelisa, i-thermal conductivity ye-AlN ichaphazeleka kakhulu ngumxholo wokungcola kwe-oksijini eseleyo, kwaye i-thermal conductivity inokunyuswa kakhulu ngokunciphisa umxholo we-oksijeni.Okwangoku, i-thermal conductivity yenkqubo

Ngokusekelwe kwezi zizathu zingasentla, kuyaziwa ukuba i-alumina ceramics ikwindawo ehamba phambili kwimimandla ye-microelectronics, i-electronics yamandla, i-microelectronics exutywe kunye neemodyuli zamandla ngenxa yokusebenza kwazo okuphezulu.

Xa kuthelekiswa nemarike yobukhulu obufanayo (100mm×100mm×1mm), izixhobo ezahlukeneyo zexabiso le-ceramic substrate: 96% alumina 9.5 yuan, 99% alumina 18 yuan, i-aluminium nitride 150 yuan, beryllium oxide 650 yuan, kunokubonwa ukuba umsantsa wamaxabiso phakathi kwee-substrates ezahlukeneyo nawo mkhulu ngokwentelekiso

3. Izinto eziluncedo kunye nezingeloncedo kwi-ceramic PCB

Iingenelo

1. Umthamo omkhulu wangoku wokuthwala, i-100A yangoku ngokuqhubekayo nge-1mm 0.3mm umzimba wobhedu obunzima, ukunyuka kobushushu malunga ne-17 ℃
2. Ukunyuka kobushushu kumalunga ne-5℃ kuphela xa i-100A yangoku idlula ngokuqhubekayo kwi-2mm 0.3mm yomzimba wobhedu obunzima.
3. Ukusebenza ngcono kokuchitha ubushushu, i-coefficient yokwandisa i-thermal ephantsi, imilo ezinzileyo, akukho lula ukulwa.
4. Ukugquma okulungileyo, ukumelana nombane ophezulu, ukuqinisekisa ukhuseleko lomntu kunye nezixhobo.

Iingxaki

I-Fragility yenye yezona zinto zingalunganga, ezikhokelela ekwenzeni iibhodi ezincinci kuphela.

Ixabiso libiza kakhulu, iimfuno zeemveliso ze-elektroniki ngakumbi nangakumbi imithetho, ibhodi yesekethe ye-ceramic okanye isetyenziswe kwezinye zeemveliso eziphezulu, iimveliso eziphantsi aziyi kusetyenziswa kwaphela.

4. Ukusetyenziswa kwe-ceramic PCB

a.Imodyuli yamandla aphezulu e-elektroniki, imodyuli yephaneli yelanga, njl

1. Unikezelo lwamandla okutshintsha rhoqo rhoqo, unikezelo lombane oluqinileyo
2. Iimoto ze-elektroniki, i-aerospace, i-electronics yasemkhosini
3. Iimveliso zokukhanyisa ze-LED zamandla aphezulu
4. I-eriyali yonxibelelwano