Kenyelletso le melemo le bofokoli ba boto ea ceramic PCB

1. Ke hobane'ng ha u sebelisa mapolanka a potoloho ea ceramic

PCB e tloaelehileng hangata e entsoe ka foil ea koporo le bonding ba substrate, 'me thepa ea substrate hangata e na le fiber ea khalase (FR-4), phenolic resin (FR-3) le lisebelisoa tse ling, sekhomaretsi hangata se phenolic, epoxy, joalo-joalo. Ts'ebetso ea PCB ka lebaka la khatello ea mocheso, lintlha tsa lik'hemik'hale, ts'ebetso e sa nepahalang ea tlhahiso le mabaka a mang, kapa ts'ebetsong ea moralo ka lebaka la mahlakoreng a mabeli a koporo ea asymmetry, ho bonolo ho lebisa ho likhato tse fapaneng tsa warping PCB board.

PCB Twist

'Me karolo e' ngoe ea PCB - substrate ea ceramic, ka lebaka la ts'ebetso ea ho senya mocheso, matla a hona joale a ho jara, ho kenya letsoho, mocheso oa ho atolosa mocheso, joalo-joalo, li molemo haholo ho feta boto e tloaelehileng ea khalase ea PCB, kahoo e sebelisoa haholo ho li-modules tsa matla a phahameng a motlakase. , sepakapaka, lisebelisoa tsa elektronike tsa sesole le lihlahisoa tse ling.

Li-substrates tsa ceramic

Ka PCB e tloaelehileng e sebelisang foil ea koporo le substrate bonding, ceramic PCB e sebakeng se phahameng sa mocheso, ka tsela ea ho kopanya foil ea koporo le substrate ea ceramic e kopantsoeng hammoho, matla a matla a tlamang, foil ea koporo e ke ke ea oa, ho tšepahala ho phahameng, ts'ebetso e tsitsitseng ka holimo. mocheso, mongobo o phahameng tikoloho

 

2. Lintho tse ka sehloohong tsa substrate ea ceramic

Alumina (Al2O3)

Alumina ke thepa e sebelisoang ka ho fetesisa ea substrate ka har'a substrate ea ceramic, hobane ka thepa ea mochini, ea mocheso le ea motlakase ha e bapisoa le lirafshoa tse ling tse ngata tsa oxide, matla a phahameng le botsitso ba lik'hemik'hale, le mohloli o ruileng oa lisebelisoa tse tala, tse loketseng tlhahiso ea theknoloji le libopeho tse fapaneng. .Ho ea ka peresente ea alumina (Al2O3) ka aroloa ka 75 porcelain, 96 porcelain, 99,5 porcelain.Thepa ea motlakase ea alumina e batla e sa amehe ke litaba tse fapaneng tsa alumina, empa thepa ea eona ea mochini le conductivity ea mocheso e fetoha haholo.Substrate e nang le bohloeki bo tlase e na le likhalase tse ngata le bokhopo bo boholoanyane.Ho phahama ha bohloeki ba substrate, ho theola ho feta, compact, tahlehelo e bohareng e tlaase, empa theko e boetse e phahame

Beryllium oxide (BeO)

E na le conductivity e phahameng ea mocheso ho feta aluminium ea tšepe, 'me e sebelisoa maemong ao ho hlokahalang hore ho be le mocheso o phahameng oa mocheso.E fokotseha ka potlako ka mor'a hore mocheso o fete 300 ℃, empa tsoelo-pele ea eona e lekanyelitsoe ke chefo ea eona.

Aluminium nitride (AlN) 

Aluminium nitride ceramics ke lirafshoa tse nang le aluminium nitride powders e le karolo ea mantlha ea kristale.Ha ho bapisoa le alumina ceramic substrate, insulation resistance, insulation e mamella voltage e phahameng, dielectric kamehla.Thermal conductivity ea eona ke 7 ~ 10 makhetlo a Al2O3, 'me mocheso oa eona oa ho atolosa mocheso (CTE) o batla o tšoana le silicon chip, e leng ea bohlokoa haholo bakeng sa lisebelisoa tse phahameng tsa semiconductor.Ts'ebetsong ea tlhahiso, mocheso oa mocheso oa AlN o ameha haholo ke litaba tsa litšila tse setseng tsa oksijene, 'me mocheso oa mocheso o ka eketseha haholo ka ho fokotsa oksijene.Hona joale, conductivity ea mocheso oa mokhoa ona

Ho itšetlehile ka mabaka a ka holimo, ho ka tsejoa hore li-ceramics tsa alumina li boemong bo ka sehloohong lefapheng la microelectronics, motlakase oa motlakase, li-microelectronics tse tsoakiloeng le li-module tsa matla ka lebaka la ts'ebetso ea tsona e phahameng ka ho fetisisa.

Ha ho bapisoa le 'maraka oa boholo bo lekanang (100mm×100mm×1mm), lisebelisoa tse fapaneng tsa theko ea ceramic substrate: 96% alumina 9.5 yuan, 99% alumina 18 yuan, aluminium nitride 150 yuan, beryllium oxide 650 yuan, ho ka bonoa hore lekhalo la theko pakeng tsa li-substrates tse fapaneng le tsona li batla li le khōlō

3. Melemo le go tlhoka mesola ea ceramic PCB

Melemo

  1. Bophahamo bo boholo ba hona joale, 100A hajoale e ntse e tsoela pele ka 'mele oa koporo o teteaneng oa 1mm 0.3mm, ho phahama ha mocheso ho ka bang 17 ℃
  2. Ho phahama ha mocheso ho ka ba 5 ℃ feela ha 100A hajoale e ntse e feta 'meleng oa koporo o motenya oa 2mm 0.3mm.
  3. Ts'ebetso e betere ea ho senya mocheso, coefficient e tlase ea katoloso ea mocheso, sebopeho se tsitsitseng, ha ho bonolo ho sotha.
  4. Insulation e ntle, khanyetso e phahameng ea motlakase, ho netefatsa polokeho ea motho le lisebelisoa.

 

Mefokolo

Fragility ke e 'ngoe ea mefokolo e ka sehloohong, e lebisang ho etsa mapolanka a manyenyane feela.

Theko e theko e boima, litlhoko tsa lihlahisoa tsa elektronike li na le melao e mengata, boto ea potoloho ea ceramic kapa e sebelisoang ho tse ling tsa lihlahisoa tse phahameng haholo, lihlahisoa tse tlaase li ke ke tsa sebelisoa ho hang.

4. Tšebeliso ea PCB ea ceramic

a.Mojule oa matla a phahameng a elektroniki, mojule oa solar panel, joalo-joalo

  1. Phepelo ea matla a phahameng a maqhubu, phepelo ea motlakase e tiileng
  2. Lisebelisoa tsa elektronike tsa likoloi, sefofane, lisebelisoa tsa elektroniki tsa sesole
  3. Lihlahisoa tse phahameng tsa mabone a LED
  4. Antenna ea puisano