Izindaba
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Umbiko weMakethe Yomhlaba Wonke Ophrintiwe we-Circuit Board 2022
Abadlali abakhulu emakethe yebhodi lesifunda ephrintiwe yiTTM Technologies, Nippon Mektron Ltd., Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, kanye neSumitomo Electric Industries. .Igloba...Funda kabanzi -
1. Iphakheji ye-DIP
Iphakheji le-DIP (Iphakheji Eliphakathi Kwe-Dual In-line), eyaziwa nangokuthi ubuchwepheshe bokupakisha okukabili emgqeni, isho ama-chips esekethe ahlanganisiwe apakishwa ngendlela ekabili emgqeni.Inombolo ngokuvamile ayidluli ku-100. I-chip ye-CPU ehlanganisiwe ye-DIP inemigqa emibili yamaphini adinga ukufakwa kusokhethi ye-chip nge...Funda kabanzi -
Umehluko Phakathi kwe-FR-4 Material kanye ne-Rogers Material
1. Okubalulekile kwe-FR-4 ishibhile kunempahla ye-Rogers 2. Okubalulekile kwe-Rogers kunemvamisa ephezulu uma kuqhathaniswa nokokusebenza kwe-FR-4.3. I-Df noma i-disipation factor ye-FR-4 iphakeme kunaleyo yezinto ze-Rogers, futhi ukulahlekelwa kwesignali kukhulu.4. Mayelana nokuzinza kwe-impedance, inani le- Dk...Funda kabanzi -
Kungani udinga ikhava ngegolide le-PCB?
1. I-Surface ye-PCB: I-OSP, i-HASL, i-HASL engenamthofu, i-Immersion Tin, i-ENIG, i-Immersion Silver, i-hard gold plating, Ukucwenga igolide lebhodi lonke, umunwe wegolide, i-ENEPIG... OSP: izindleko eziphansi, ukudayiswa okuhle, izimo ezinzima zokugcina, isikhathi esifushane, ubuchwepheshe bezemvelo, ukushisela okuhle, bushelelezi… HASL: imvamisa kuba m...Funda kabanzi -
I-Organic Antioxidant (OSP)
Izikhathi ezisebenzayo: Kulinganiselwa ukuthi cishe ama-25% -30% ama-PCB asebenzisa inqubo ye-OSP njengamanje, futhi ingxenye ibilokhu ikhuphuka (kungenzeka ukuthi inqubo ye-OSP manje seyedlule ithini lokufutha futhi ibeka kuqala).Inqubo ye-OSP ingasetshenziswa kuma-PCB anobuchwepheshe obuphansi noma ama-PCB zobuchwepheshe obuphezulu, njenge-single-si...Funda kabanzi -
KUYINI UKUPHUMA KWEBHOLA LASODELA?
KUYINI UKUPHUMA KWEBHOLA LASODELA?Ibhola le-solder lingenye yeziphambeko ezivame kakhulu zokugeleza kabusha ezitholakala lapho kusetshenziswa ubuchwepheshe bokukhweza phezulu ebhodini lesekethe eliphrintiwe.Ngokuvumelana negama lazo, ayibhola le-solder elihlukanisiwe nomzimba oyinhloko elakha izingxenye zokukhweza ezihlangene ukuze...Funda kabanzi -
INDLELA YOKUVIMBELA UKUPHUMA KWEBHOLA
May 18, 2022Blog, Industry News Soldering kuyisinyathelo esibalulekile ekudalweni kwamabhodi esekethe aphrintiwe, ikakhulukazi uma kusetshenziswa ubuchwepheshe bokukhweza phezulu.I-Solder isebenza njengeglue ebamba lezi zingxenye ezibalulekile ziqine phezu kwebhodi.Kodwa uma izinqubo ezifanele zingekho...Funda kabanzi -
Amaphutha Endleleni yase-US Ekwenziweni Kwezogesi Adinga Izinguquko Eziphuthumayo, noma Isizwe Sizokhula Sithembele Kubahlinzeki Bangaphandle, kusho umbiko omusha.
Umkhakha webhodi lesifunda lase-US usenkingeni embi kakhulu kunama-semiconductors, okunemiphumela engase ibe yimbi Jan 24, 2022 I-United States ilahlekelwe ukubusa kwayo okungokomlando endaweni eyisisekelo yobuchwepheshe be-elekthronikhi - amabhodi esekethe aphrintiwe (PCBs) - kanye nokuntuleka kwanoma yimuphi uHulumeni wase-US obalulekile. s...Funda kabanzi -
Izidingo zokudizayina ze-PCB Structures:
I-Multilayer PCB yakhiwe kakhulu nge-copper foil, prepreg, kanye nebhodi eliwumgogodla.Kunezinhlobo ezimbili zezinhlaka ze-lamination, okungukuthi, isakhiwo se-lamination se-foil yethusi kanye nebhodi eliyinhloko kanye nesakhiwo se-lamination sebhodi eliwumgogodla kanye nebhodi eliwumgogodla.I-copper foil kanye ne-core board lamination structure yi...Funda kabanzi -
Yiziphi izinkinga okufanele zinakwe lapho uklama ibhodi le-FPC eliguquguqukayo?
Ibhodi eguquguqukayo ye-FPC iwuhlobo lwesekethe olwakhiwe endaweni yokugcina eguquguqukayo, enesendlalelo sekhava noma esingenaso (esivame ukusetshenziselwa ukuvikela amasekhethi e-FPC).Ngoba ibhodi elithambile le-FPC lingagotshwa, ligoqwe noma liphindaphindwe ukunyakaza ngezindlela ezihlukahlukene, uma kuqhathaniswa nebhodi eliqinile elivamile (PCB), linezinzuzo...Funda kabanzi -
I-Global Flexible Printed Circuit Boards Report Report 2021: Imakethe Izodlula I- $ 20 Bilion ngo-2026 - 'Ukukhanya Njengophaphe' Kuthatha Izifunda Eziguqukayo Ziyise Kuzinga Elisha
Dublin, Feb. 07, 2022 (GLOBE NEWSWIRE) — Umbiko othi “Flexible Printed Circuit Boards – Global Market Trajectory & Analytics” ungeziwe emnikelweni weResearchAndMarkets.com.I-Global Flexible Printed Circuit Boards Market izofinyelela ku-US$20.3 Billion ngonyaka wama-20...Funda kabanzi -
Izinzuzo ze-BGA Soldering:
Amabhodi esekethe aphrintiwe asetshenziswa kuma-electronics namadivayisi wanamuhla anezingxenye eziningi ze-elekthronikhi ezigxunyekwe ngokuhlangene.Lokhu kuyiqiniso elibalulekile, njengoba inani lezingxenye ze-elekthronikhi ebhodini lesekethe eliphrintiwe likhula, kanjalo nosayizi webhodi lesifunda.Nokho, i-extrusion ephrintiwe cir...Funda kabanzi
