With the continuous development and progress of modern electronic product technology, electronic products are gradually developing towards the direction of light, thin, small, personalized, high reliability and multi-function. Aluminum PCB was born in accordance with this trend. Aluminum PCB has been widely used in hybrid integrated circuits, automobiles, office automation, high-power electrical equipment, power supply equipment and other fields with excellent heat dissipation, good machinability, dimensional stability and electrical performance.
Process Flow of Aluminum PCB
Cutting → drilling hole → dry film light imaging → inspection plate → etching → corrosion inspection → green soldermask → silkscreen → green inspection → tin spraying → aluminum base surface treatment → punching plate → final inspection → packaging → shipment
Notes for aluminum pcb:
1. Due to the high price of raw materials, we must pay attention to the standardization of operation in the production process to prevent the loss and waste caused by production operation errors.
2. The wear resistance of the surface of the aluminum pcb is poor. The operators of each process must wear gloves when operating, and take them gently to avoid scratching the surface of the plate and the aluminum base surface.
3. Each manual operation link should wear gloves to avoid touching the effective area of the aluminum pcb with hands to ensure the stability of the later construction operation.
Specific process flow of aluminum substrate (part):
1. Cutting
l 1). Strengthen incoming material inspection (must use aluminum surface with protective film sheet) to ensure the reliability of incoming materials.
l 2). No baking plate is required after opening.
l 3). Handle gently and pay attention to the protection of aluminum base surface (protective film). Do a good job of protection after opening material.
2. Drilling hole
l Drilling parameters are the same as those of FR-4 sheet.
l Aperture tolerance is very strict, 4OZ Cu pay attention to control the generation of the front.
l Drill holes with copper skin up.
3. Dry film
1) Incoming material inspection: The protective film of aluminum base surface shall be checked before grinding plate. If any damage is found, it must be firmly pasted with blue glue before pre-treatment. After the processing is finished, check again before grinding plate.
2) Grinding plate: only the copper surface is processed.
3) Film: film shall be applied to both copper and aluminum base surfaces. Control the interval between the grinding plate and the film less than 1 minute to ensure the film temperature is stable.
4) Clapping: Pay attention to the accuracy of clapping.
5) Exposure: Exposure ruler: 7~9 cases of residual glue.
6) Developing: pressure: 20~35psi speed: 2.0~2.6m/min, each operator must wear gloves to operate carefully, to avoid scratching the protective film and aluminum base surface.
4. Inspection plate
1) The line surface must check all contents in accordance with MI requirements, and it is very important to do the inspection board work strictly.
2) The aluminum base surface shall also be inspected, and the dry film of the aluminum base surface shall not have film falling and damage.
Notes related to aluminum substrate:
A. Plate member plate connection must pay attention to inspection, for no good can be taken to grind again, for the rub can be picked out with sandpaper (2000#) sand and then taken to grind the plate, manual participation in the link of the plate are related to the inspection work, for the aluminum substrate qualified rate has significantly improved!
B. In the case of discontinuous production, it is necessary to strengthen maintenance to ensure clean conveying and water tank, so as to ensure later operation stability and production speed
