1. Puka

ʻO ka pinhole ma muli o ka adsorption o ke kinoea hydrogen ma ka ʻili o nā ʻāpana plated, ʻaʻole e hoʻokuʻu ʻia no ka manawa lōʻihi.ʻAʻole hiki ke hoʻomaʻemaʻe i ka ʻili o nā ʻāpana i hoʻopaʻa ʻia, no laila ʻaʻole hiki ke nānā ʻia ke ʻano electrolytic.I ka piʻi ʻana o ka mānoanoa o ka uhi ʻana i ka wahi a puni ke kiko hoʻololi hydrogen, ua hoʻokumu ʻia kahi pinhole ma ke kiko hoʻololi hydrogen.Hōʻike ʻia e ka puka poepoe ʻālohilohi a i kekahi manawa he huelo liʻiliʻi i luna.I ka nele o ka pulupulu wai i loko o ka plating solution a kiʻekiʻe ka nui o kēia manawa, maʻalahi ka hana ʻana i nā pinhole.

2. Ka lua

ʻO nā pockmarks ma muli o ka maʻemaʻe o ka ʻili i hoʻopaʻa ʻia, aia nā mea paʻa i hoʻopili ʻia, a i ʻole nā ​​mea paʻa i hoʻokuʻu ʻia i loko o ka solution plating.Ke hiki lākou i ka ʻili o ka mea hana ma lalo o ka hana o kahi māla uila, hoʻopili ʻia lākou ma luna o ia mea, e pili ana i ka electrolysis.Hoʻokomo ʻia kēia mau mea paʻa i loko o ka In the electroplating layer, small bumps (dumps) is formed.ʻO ka hiʻohiʻona he convex, ʻaʻohe mea ʻālohilohi, ʻaʻohe ʻano paʻa.I ka pōkole, kumu ia e ka mea hana lepo a me ka hoʻonā palaka lepo.

3. Nā kaha ea

ʻO ke kahe o ka ea ma muli o nā mea hoʻohui nui a i ʻole ka cathode kiʻekiʻe o kēia manawa a i ʻole ka mea paʻakikī, e hōʻemi ana i ka pono o ka cathode i kēia manawa a hopena i ka nui o ka hydrogen evolution.Inā holo mālie ka ʻoluʻolu o ka plating a neʻe mālie ka cathode, e hoʻopili ke kinoea hydrogen i ka hoʻonohonoho ʻana o nā kristal electrolytic i ka wā e piʻi ai i ka ʻili o ka mea hana, e hana ana i nā kaha ea mai lalo a luna.

4. Ka uhi uhi maka

No ka mea ʻaʻole i hoʻoneʻe ʻia ka uhi ʻana o ka mask ma muli o ke kukui palupalu ma ke kūlana pine ma ka ʻili o ka mea hana, a ʻaʻole hiki ke hana ʻia ka hoʻopili electrolytic deposition ma aneʻi.Hiki ke ʻike ʻia ka mea kumu ma hope o ka electroplating, no laila ua kapa ʻia ʻo ia ka lalo i hōʻike ʻia (no ka mea, ʻo ka uila palupalu he mea translucent a ʻikea paha).

5. Hoʻopili i ka brittleness

Ma hope o ka SMD electroplating a me ka ʻoki ʻana a me ka hoʻokumu ʻana, hiki ke ʻike ʻia aia ma ka piko o ka pine.Ke loaʻa kahi māwae ma waena o ka papa nickel a me ka substrate, ua manaʻo ʻia he brittle ka papa nickel.Ke loaʻa ka māwae ma waena o ka papa pīni a me ka papa nickel, ua hoʻoholo ʻia he palupalu ka papa tin.ʻO ka hapa nui o nā kumu o ka brittleness nā mea hoʻohui, nā mea hoʻomālamalama nui, a i ʻole ka nui o nā haumia inorganic a me nā mea kūlohelohe i loko o ka hopena plating.