Wore Bonding ndi njira yolumikizira zitsulo imatsogolera ku pedi, ndiko kuti, njira yolumikizira tchipisi tamkati ndi kunja.

Mwachindunji, zitsulo zotsogola zimakhala ngati mlatho pakati pa chip pad (primary bonding) ndi chonyamulira pad (secondary bonding). M'masiku oyambirira, mafelemu otsogolera ankagwiritsidwa ntchito ngati magawo onyamulira, koma ndi chitukuko chofulumira cha luso lamakono, PCBS tsopano ikugwiritsidwa ntchito kwambiri ngati magawo. Kulumikizana kwa waya kulumikiza mapadi awiri odziyimira pawokha, zinthu zotsogola, zomangira, malo omangirira (kuphatikiza kulumikiza chip ndi gawo lapansi, komanso kulumikizidwa ndi tchipisi ziwiri, kapena magawo awiri) ndizosiyana kwambiri.

1.Kugwirizanitsa Waya: Thermo-Compression/Ultrasonic/Thermosonic
Pali njira zitatu zomangira chitsulo chotsogolera ku pedi:

① Njira yopondereza ya Thermo, pad yowotcherera ndi capillary splitter (yofanana ndi chida chokhala ngati capillary chosuntha zitsulo) potenthetsa ndi njira yopondereza;
②Njira ya Ultrasonic, popanda kutentha, mafunde akupanga amagwiritsidwa ntchito pa capillary splitter kuti agwirizane.
③Thermosonic ndi njira yophatikizira yomwe imagwiritsa ntchito kutentha ndi ultrasound.
Yoyamba ndi njira yolumikizirana yotentha, yomwe imatenthetsa kutentha kwa chip pad mpaka 200 ° C pasadakhale, kenako kumawonjezera kutentha kwa nsonga ya capillary splicer kuti ipange mpira, ndikuyika kukakamiza pa pedi kudzera mu capillary splicer, kuti mulumikizane ndi chitsulo chotsogolera ku pedi.
Njira yachiwiri ya Ultrasonic ndiyo kugwiritsa ntchito mafunde akupanga ku Wedge (yofanana ndi capillary Wedge, yomwe ndi chida choyendetsa zitsulo, koma sichimapanga mpira) kuti mukwaniritse kugwirizana kwazitsulo kumatsogolera ku pedi. Ubwino wa njirayi ndi otsika ndondomeko ndi chuma mtengo; Komabe, chifukwa akupanga njira m'malo Kutentha ndi pressurization ndondomeko ndi mosavuta ntchito akupanga mafunde, ndi bonded kumakoka mphamvu (kukhoza kukoka ndi kukoka waya pambuyo kugwirizana) ndi ofooka.
2. Zinthu zopangira zitsulo zomangira: Golide (Au) / Aluminium (Al) / Copper (Cu)
Zinthu zachitsulo zotsogola zimatsimikiziridwa molingana ndi kuganiziridwa mozama kwa magawo osiyanasiyana owotcherera komanso kuphatikiza njira yoyenera kwambiri. Zida zotsogola zachitsulo ndi golide (Au), aluminiyamu (Al) ndi mkuwa (Cu).
Gold Wire ili ndi mphamvu zamagetsi zamagetsi, kukhazikika kwamankhwala komanso kukana kwamphamvu kwa dzimbiri. Komabe, kuipa kwakukulu kogwiritsa ntchito koyambirira kwa waya wa aluminiyamu ndikosavuta kuwononga. Ndipo kuuma kwa waya wa golidi kumakhala kolimba, kotero kungathe kupanga mpira bwino mu mgwirizano woyamba, ndipo akhoza kupanga semicircular lead Loop (mawonekedwe opangidwa kuchokera ku mgwirizano woyamba kupita ku mgwirizano wachiwiri) basi mu mgwirizano wachiwiri.
Waya wa Aluminium ndi waukulu m'mimba mwake kuposa waya wagolide, ndipo phula lake ndi lalikulu. Choncho, ngakhale waya wa golide woyenga kwambiri atagwiritsidwa ntchito popanga mphete yotsogolera, siidzathyoka, koma waya wa aluminiyamu ndi wosavuta kuthyoka, choncho idzasakanizidwa ndi silicon kapena magnesium ndi ma alloys ena. Waya wa aluminiyamu amagwiritsidwa ntchito makamaka pakuyika kutentha kwambiri (monga Hermetic) kapena njira za ultrasonic komwe waya wagolide sungagwiritsidwe ntchito.
Waya wa Copper ndi wotsika mtengo, koma wolimba kwambiri. Ngati kuuma kuli kwakukulu, sikophweka kupanga mpira, ndipo pali zolephera zambiri popanga mphete yotsogolera. Komanso, kupanikizika kuyenera kugwiritsidwa ntchito pa chip pad panthawi yogwirizanitsa mpira, ndipo ngati kuuma kuli kwakukulu, filimu yomwe ili pansi pa pediyo idzasweka. Kuphatikiza apo, patha kukhala "Peeling" ya gawo lolumikizidwa bwino la pad.

Komabe, chifukwa mawaya achitsulo a chip amapangidwa ndi mkuwa, pali chizolowezi chowonjezeka chogwiritsa ntchito waya wamkuwa. Pofuna kuthana ndi zofooka za waya wamkuwa, nthawi zambiri amasakanizidwa ndi zinthu zina zazing'ono kuti apange alloy.