I-Wore Bonding yindlela yokudibanisa isinyithi ikhokelela kwi-pad, oko kukuthi, ubuchule bokudibanisa i-chips zangaphakathi nangaphandle.

Ngokwesakhiwo, iintambo zentsimbi zisebenza njengebhulorho phakathi kwe-chip's pad (i-primary bonding) kunye ne-carrier pad (i-secondary bonding). Kwiintsuku zokuqala, iifreyimu ezikhokelayo zazisetyenziswa njengezinto ezincinci zokuthwala, kodwa ngophuhliso olukhawulezayo lwetekhnoloji, i-PCBS ngoku isetyenziswa kakhulu njengama-substrates. Intambo yocingo edibanisa iipads ezimbini ezizimeleyo, izinto ezikhokelayo, iimeko zokubambisana, indawo yokudibanisa (ngaphezu kokudibanisa i-chip kunye ne-substrate, kodwa idibene ne-chips ezimbini, okanye i-substrates ezimbini) zihluke kakhulu.

1.I-Wire Bonding: I-Thermo-Compression/Ultrasonic/Thermosonic
Kukho iindlela ezintathu zokuncamathisela intsimbi ekhokelela kwipadi:

①Indlela ye-Thermo-compression, i-welding pad kunye ne-capillary splitter (efana nesixhobo se-capillary-shaped to move metal lead) ngokufudumeza kunye nendlela yoxinzelelo;
②Indlela ye-Ultrasonic, ngaphandle kokufudumeza, i-wave ye-ultrasonic isetyenziswe kwi-capillary splitter yokudibanisa.
③I-Thermosonic yindlela edibeneyo esebenzisa ubushushu kunye ne-ultrasound.
Eyokuqala yindlela yokudibanisa eshushu, efudumeza ubushushu be-chip pad ukuya kwi-200 ° C kwangaphambili, kwaye yandisa iqondo lobushushu le-capillary splicer tip ukuyenza ibhola, kwaye ibeka uxinzelelo kwi-pad ngokusebenzisa i-capillary splicer, ukwenzela ukuba udibanise intambo yentsimbi kwi-pad.
Indlela yesibini ye-Ultrasonic kukusebenzisa amaza e-ultrasonic kwi-Wedge (efana ne-capillary Wedge, eyisixhobo sokuhambisa isinyithi esikhokelela, kodwa asikwenzi ibhola) ukufezekisa ukudibanisa kwentsimbi kukhokelela kwi-pad. Inzuzo yale ndlela yinkqubo ephantsi kunye neendleko eziphathekayo; Nangona kunjalo, ngenxa yokuba indlela ye-ultrasonic ithatha indawo yokufudumala kunye nenkqubo yoxinzelelo kunye namaza e-ultrasonic asebenza ngokulula, amandla adibeneyo adibeneyo (amandla okutsala kunye nokutsala ucingo emva kokudibanisa) abuthathaka.
I-2.Izinto eziphathekayo zokudibanisa isinyithi zikhokelela: Igolide (Au) / iAluminium (Al) / iCopper (Cu)
Izinto eziphathekayo zentsimbi zichongwa ngokuqwalasela ngokubanzi iiparitha ezahlukeneyo ze-welding kunye nokudibanisa eyona ndlela ifanelekileyo. Izinto eziqhelekileyo zentsimbi yokukhokela ziyigolide (Au), i-aluminium (Al) kunye nobhedu (Cu).
I-Gold Wire ine-conductivity elungileyo yombane, ukuzinza kweekhemikhali kunye nokuxhathisa okuqinileyo kwe-corrosion. Nangona kunjalo, eyona nto ingalunganga yokusetyenziswa kwangoko kocingo lwe-aluminium kulula ukugrumba. Kwaye ukuqina kocingo lwegolide lunamandla, ngoko lunokwenza ibhola kakuhle kwibhondi yokuqala, kwaye inokwenza i-loop semicircular lead Loop (imilo eyenziwe ukusuka kwibhondi yokuqala ukuya kwibhondi yesibini) kanye kanye kwibhondi yesibini.
I-Aluminiyam yocingo inkulu kunocingo lwegolide ngobukhulu, kwaye inowuthi inkulu. Ngoko ke, nangona ucingo lwegolide olucocekileyo lusetyenziselwa ukwenza ikhonkco elikhokelayo, aluyi kuphuka, kodwa ucingo olucocekileyo lwe-aluminium kulula ukuphuka, ngoko luya kuxutywa kunye ne-silicon okanye i-magnesium kunye nezinye i-alloys. Ucingo lwe-aluminium lusetyenziswa ikakhulu kwipakethe yobushushu obuphezulu (njengeHermetic) okanye iindlela ze-ultrasonic apho ucingo lwegolide lungenakusetyenziswa.
I-Copper Wire inexabiso eliphantsi, kodwa inzima kakhulu. Ukuba ubunzima buphezulu kakhulu, akulula ukwenza ibhola, kwaye kukho imida emininzi xa usenza i-ring lead. Ngaphezu koko, uxinzelelo kufuneka lusetyenziswe kwi-chip pad ngexesha lenkqubo yokudibanisa ibhola, kwaye ukuba ubunzima buphezulu kakhulu, ifilimu ephantsi kwepadi iya kuqhekeka. Ukongeza, kunokubakho "i-Peeling" yoluhlu olukhuselekileyo lwephedi.

Nangona kunjalo, ngenxa yokuba i-wiring yensimbi ye-chip yenziwe ngobhedu, kukho ukuthambekela okwandayo kokusebenzisa ucingo lobhedu. Ukuze unqobe ukusilela kocingo lobhedu, ngokuqhelekileyo luxutywe kunye nenani elincinci lezinye izinto zokwenza i-alloy.