Wore Bonding nuburyo bwo guhuza ibyuma biganisha kuri padi, ni ukuvuga tekinike yo guhuza ibyuma byimbere ninyuma.

Mu buryo bwubaka, icyuma kiyobora gikora nkikiraro hagati ya chip ya chip (guhuza ibanze) hamwe nuwitwara (guhuza kabiri). Mubihe byambere, ama firime yayoboye yakoreshwaga nkibintu bitwara ibintu, ariko hamwe niterambere ryihuse ryikoranabuhanga, PCBS ubu ikoreshwa cyane nka substrate. Guhuza insinga ihuza amakarito abiri yigenga, ibikoresho biyobora, imiterere yo guhuza, umwanya uhuza (usibye guhuza chip na substrate, ariko kandi ugahuza na chip ebyiri, cyangwa substrate ebyiri) ziratandukanye cyane.

1.Gufata insinga: Thermo-Compression / Ultrasonic / Thermosonic
Hariho uburyo butatu bwo guhuza ibyuma biganisha kuri padi:

MethodUburyo bwa compression-compression, padi yo gusudira hamwe na capillary splitter (bisa nigikoresho kimeze nka capillary yo kwimura ibyuma) ukoresheje uburyo bwo gushyushya no kwikuramo;
MethodUburyo bwa ultrasonic, budashyushye, ultrasonic wave ikoreshwa kuri capillary splitter kugirango ihuze.
HerTermosonic nuburyo bukomatanyije bukoresha ubushyuhe na ultrasound.
Iya mbere ni uburyo bushyushye bwo guhuza uburyo, bushyushya ubushyuhe bwa chip padi kugeza kuri 200 ° C mbere, hanyuma bikiyongera ubushyuhe bwumutwe wa capillary splicer kugirango ubigire umupira, hanyuma ushyire igitutu kuri padi ukoresheje capillary splicer, kugirango uhuze icyuma kiganisha kuri padi.
Uburyo bwa kabiri Ultrasonic ni ugukoresha ultrasonic waves kuri Wedge (bisa na capillary Wedge, nigikoresho cyo kwimura ibyuma biyobora, ariko ntibikora umupira) kugirango ugere kumurongo wibyuma biganisha kuri padi. Ibyiza byubu buryo ni inzira nke nigiciro cyibikoresho; Ariko, kubera ko uburyo bwa ultrasonic busimbuza uburyo bwo gushyushya no gukanda hamwe na ultrasonic ikora byoroshye, imbaraga zingana zingana (ubushobozi bwo gukurura no gukurura insinga nyuma yo guhuza) ni ntege nke.
2.Ibikoresho byo guhuza ibyuma biganisha: Zahabu (Au) / Aluminium (Al) / Umuringa (Cu)
Ibikoresho by'icyuma kiyobora bigenwa ukurikije uburyo bunoze bwo gusuzuma ibipimo bitandukanye byo gusudira hamwe no guhuza uburyo bukwiye. Ibikoresho bisanzwe biyobora ni zahabu (Au), aluminium (Al) n'umuringa (Cu).
Gold Wire ifite amashanyarazi meza, itajegajega imiti kandi irwanya ruswa. Nyamara, imbogamizi nini yo gukoresha hakiri kare insinga ya aluminium biroroshye kubora. Kandi ubukana bwumugozi wa zahabu burakomeye, kuburyo bushobora gukora umupira neza kumurongo wambere, kandi burashobora gukora igice cyizengurutse cyizunguruka Loop (ishusho yakozwe kuva kumurongo wambere kugeza kumurongo wa kabiri) neza muburyo bwa kabiri.
Aluminium Wire nini muri diameter kuruta insinga za zahabu, kandi ikibanza kinini. Kubwibyo, niyo insinga ya zahabu ifite isuku nini ikoreshwa mugukora impeta yambere, ntabwo izavunika, ariko insinga ya aluminiyumu yoroshye iroroshye kumeneka, bityo izavangwa na silicon cyangwa magnesium hamwe nandi mavuta. Umugozi wa aluminium ukoreshwa cyane mubipfunyika ubushyuhe bwo hejuru (nka Hermetike) cyangwa uburyo bwa ultrasonic aho insinga ya zahabu idashobora gukoreshwa.
Umuringa Wumuringa uhendutse, ariko birakomeye. Niba gukomera ari hejuru cyane, ntabwo byoroshye gukora umupira, kandi hariho imbogamizi nyinshi mugihe ukora impeta. Byongeye kandi, igitutu kigomba gukoreshwa kuri chip padi mugihe cyo guhuza umupira, kandi niba ubukana buri hejuru cyane, firime hepfo ya padi izacika. Mubyongeyeho, hashobora kubaho "Peeling" ya padiri ihujwe neza.

Ariko, kubera ko insinga z'icyuma za chip zikozwe mu muringa, hari imyumvire yo gukoresha insinga z'umuringa. Kugirango tuneshe intege z'insinga z'umuringa, ubusanzwe zivangwa n'ikindi gikoresho gito kugirango zibe umusemburo.