Wore Bonding ke mokhoa oa ho hokahanya tšepe e lebisang ho pad, ke hore, mokhoa oa ho hokahanya li-chips tsa kahare le kantle.
Ka mokhoa o hlophisitsoeng, lisebelisoa tsa tšepe li sebetsa e le borokho pakeng tsa chip's pad (primary bonding) le carrier pad (secondary bonding). Mehleng ea pele, liforeimi tse etellang pele li ne li sebelisoa e le li-carrier substrates, empa ka tsoelo-pele e potlakileng ea theknoloji, PCBS e se e sebelisoa haholo e le li-substrates. Khokahano ea terata e kopanyang liphaephe tse peli tse ikemetseng, lisebelisoa tse etellang pele, maemo a tlamahano, boemo ba tlamahano (ho ekelletsa ho hokahanya chip le substrate, empa hape e hokahane le li-chips tse peli, kapa substrates tse peli) li fapane haholo.
1.Wire Bonding: Thermo-Compression/Ultrasonic/Thermosonic
Ho na le mekhoa e meraro ea ho hokela lead lead ho pad:
① Thermo-compression method, welding pad le capillary splitter (e ts'oanang le sesebelisoa se bōpehileng joaloka capillary ho tsamaisa lisebelisoa tsa tšepe) ka mokhoa oa ho futhumatsa le oa ho hatella;
②Mokhoa oa Ultrasonic, ntle le ho futhumatsa, leqhubu la ultrasonic le sebelisoa ho capillary splitter bakeng sa ho hokahanya.
③Thermosonic ke mokhoa o kopantsoeng o sebelisang mocheso le ultrasound.
Ea pele ke mokhoa o chesang oa ho kopanya o chesang, o futhumatsang mocheso oa chip pad ho hoo e ka bang 200 ° C esale pele, ebe o eketsa mocheso oa ntlha ea capillary splicer ho etsa hore e be bolo, 'me o beha khatello holim'a lesela ka capillary splicer, e le hore o hokahane le tšepe ea tšepe ho pad.
Mokhoa oa bobeli oa Ultrasonic ke ho sebelisa maqhubu a ultrasonic ho Wedge (e tšoanang le Capillary Wedge, e leng sesebelisoa sa ho tsamaisa lisebelisoa tsa tšepe, empa ha e thehe bolo) ho finyella ho hokahanya ha tšepe ho lebisa ho pad. Molemo oa mokhoa ona ke theko e tlaase le litšenyehelo tsa thepa; Leha ho le joalo, hobane mokhoa oa ultrasonic o nkela sebaka sa ho futhumatsa le khatello ea maikutlo ka maqhubu a ultrasonic a sebetsang habonolo, matla a ho tsitsa a kopantsoeng (bokhoni ba ho hula le ho hula terata ka mor'a hore o kopane) a batla a fokola.
2.Material of bonding metal lead: Khauta (Au)/Aluminium (Al)/Copper (Cu)
Thepa ea tšepe e etellang pele e ikemiselitsoe ho latela ho nahanoa ka botlalo ha mekhahlelo e fapaneng ea welding le ho kopanya mokhoa o nepahetseng ka ho fetisisa. Lisebelisoa tse tloaelehileng tsa tšepe tse etellang pele ke khauta (Au), aluminium (Al) le koporo (Cu).
Gold Wire e na le conductivity e ntle ea motlakase, botsitso ba lik'hemik'hale le khanyetso e matla ea kutu. Leha ho le joalo, phoso e kholo ka ho fetisisa ea tšebeliso ea pele ea terata ea aluminium e bonolo ho e senya. 'Me boima ba terata ea khauta bo matla, kahoo bo ka etsa bolo hantle ka har'a tlamo ea pele,' me e ka etsa semicircular lead Loop (sebopeho se entsoeng ho tloha tlamong ea pele ho ea ho ea bobeli) hantle feela tlamong ea bobeli.
Aluminium Wire e kholoanyane ka bophara ho feta terata ea khauta, 'me sekontiri se seholo. Ka hona, le haeba terata ea khauta e hloekileng e sebelisoa ho etsa selikalikoe sa moeta-pele, e ke ke ea robeha, empa mohala o hloekileng oa aluminium o bonolo ho robeha, kahoo o tla kopanngoa le silicon kapa magnesium le lisebelisoa tse ling. Mohala oa aluminium o sebelisoa haholo ho paka ka mocheso o phahameng (joalo ka Hermetic) kapa mekhoa ea ultrasonic moo terata ea khauta e ke keng ea sebelisoa.
Copper Wire e theko e tlase, empa e thata haholo. Haeba boima bo phahame haholo, ha ho bonolo ho theha bolo, 'me ho na le mefokolo e mengata ha ho etsoa lesale la pele. Ho feta moo, khatello e lokela ho sebelisoa ho chip pad nakong ea ts'ebetso ea bolo, 'me haeba boima bo le holimo haholo, filimi e ka tlaase ho pad e tla phatloha. Ho phaella moo, ho ka ba le "Peeling" ea lera le sireletsehileng la pad.
Leha ho le joalo, hobane mohala oa tšepe oa chip o entsoe ka koporo, ho na le tšekamelo e ntseng e eketseha ea ho sebelisa mohala oa koporo. E le ho hlōla mefokolo ea terata ea koporo, hangata e kopantsoe le lisebelisoa tse ling tse nyenyane ho etsa motsoako.