ʻO ka pulupulu ʻana i ka tin he ʻanuʻu a me ke kaʻina hana i ke kaʻina hana hōʻoia PCB.ʻO kaPapa PCBua hoʻokomo ʻia i loko o kahi punawai hoʻoheheʻe ʻia, i uhi ʻia nā ʻili keleawe a pau i ʻike ʻia me ka solder, a laila hoʻoneʻe ʻia ka solder keu ma ka papa e kahi mea ʻoki ea wela.wehe.ʻOi aku ka maikaʻi o ka ikaika wili a me ka hilinaʻi o ka papa kaapuni ma hope o ka pipi ʻana.Eia nō naʻe, ma muli o kāna mau hiʻohiʻona kaʻina, ʻaʻole maikaʻi ka palahalaha ʻili o ka lapaʻau tin spray, ʻoi aku hoʻi no nā ʻāpana uila liʻiliʻi e like me nā pūʻulu BGA, ma muli o ka liʻiliʻi liʻiliʻi wahi, inā ʻaʻole maikaʻi ka palahalaha, hiki ke pilikia e like me kaapuni pokole.

pono:

1. ʻOi aku ka maikaʻi o ka wettability o nā ʻāpana i ka wā o ke kaʻina kūʻai aku, a ʻoi aku ka maʻalahi o ka soldering.

2. Hiki iā ia ke pale i ka ʻili keleawe i hōʻike ʻia mai ka ʻino ʻana a i ʻole ka oxidized.

hemahema:

ʻAʻole kūpono ia no ka hoʻopaʻa ʻana i nā pine me nā āpau maikaʻi a me nā mea liʻiliʻi liʻiliʻi, no ka mea, ʻilihune ka palahalaha o ka papa i hoʻoheheʻe ʻia.He mea maʻalahi ka hana ʻana i nā pahu pahu i ka PCB hōʻoia ʻana, a he maʻalahi ke hana kaapuni pōkole no nā ʻāpana me nā pine āpau maikaʻi.Ke hoʻohana ʻia i ke kaʻina hana SMT ʻaoʻao ʻelua, no ka mea ua loaʻa ka lua o ka ʻaoʻao i ke kiʻekiʻe o ka wela reflow soldering, he mea maʻalahi loa ia e hoʻoheheʻe hou i ka ʻōpala tin a hana i nā pahu pahu a i ʻole nā ​​​​wai kulu wai like i hoʻopili ʻia e ka umekaumaha i loko o nā kiko spherical tin. hāʻule, ʻoi aku ka maikaʻi ʻole o ka ʻili.Hoʻopili ka palahalaha i nā pilikia wili.

I kēia manawa, hoʻohana kekahi PCB proofing i ke kaʻina OSP a me ke kaʻina gula immersion e pani i ke kaʻina hoʻoheheʻe tin;Ua hoʻomohala ʻia ka ʻenehana i kekahi mau hale hana i hoʻopaʻa ʻia i ke kaʻina hana immersion a me ke kaʻina kālā immersion, i hui pū ʻia me ke ʻano o ke alakaʻi ʻole i nā makahiki i hala iho nei, ua palena hou ʻia ka hoʻohana ʻana i ke kaʻina hana pā.