Ukufafaza ngothayela kuyisinyathelo nenqubo kunqubo yokuhlola ye-PCB.IIbhodi le-PCBicwiliswa echibini le-solder elincibilikisiwe, ukuze zonke izindawo zethusi eziveziwe zimbozwe nge-solder, bese i-solder eyeqile ebhodini ikhishwa umsiki womoya oshisayo.susa.Amandla e-solder nokuthembeka kwebhodi lesifunda ngemva kokufafaza ithini kungcono.Kodwa-ke, ngenxa yezici zayo zenqubo, ukukhanya okungaphezulu kokwelashwa kwe-tin spray akukuhle, ikakhulukazi ezingxenyeni ezincane ze-elekthronikhi ezifana namaphakheji we-BGA, ngenxa yendawo encane yokushisela, uma ukuvuleka kungalungile, kungase kubangele izinkinga ezifana izifunda ezimfushane.

inzuzo:

1. Ukumanzisa kwezingxenye ngesikhathi senqubo ye-solder kungcono, futhi i-soldering kulula.

2. Ingavimbela indawo yethusi eveziwe ukuthi ingagqwali noma ifakwe i-oxidized.

ukushiyeka:

Ayifanelekeli izikhonkwane ze-soldering ezinezikhala ezinhle kanye nezingxenye ezincane kakhulu, ngoba ukukhanya okungaphezulu kwebhodi le-tin-sprayed akulungile.Kulula ukukhiqiza ubuhlalu bethayela ekuqinisekiseni i-PCB, futhi kulula ukubangela ukujikeleza okufushane kwezingxenye ezinamaphini we-gap amahle.Uma isetshenziselwa inqubo ye-SMT enezinhlangothi ezimbili, ngenxa yokuthi uhlangothi lwesibili luye lwathola ukushisa okuphezulu kwe-reflow soldering, kulula kakhulu ukuphinda uncibilikise isifutho sikathayela futhi ukhiqize ubuhlalu obuthayela noma amaconsi amanzi afanayo athintwa amandla adonsela phansi abe yiziyingi ze-tin amaphuzu. ukwehla, okwenza indawo engaphezulu ingabukeki nakakhulu.Ukucaba nakho kuthinta izinkinga zokushisela.

Okwamanje, okunye ukuhlola kwe-PCB kusebenzisa inqubo ye-OSP kanye nenqubo yokucwiliswa kwegolide ukuze kuthathelwe indawo inqubo yokufafaza ngamathini;ukuthuthukiswa kobuchwepheshe buye kwenza ezinye izimboni zamukela ithini lokucwiliswa kanye nenqubo yesiliva yokucwiliswa, kuhambisana nokuthambekela kokungabi nomthofu eminyakeni yamuva, ukusetshenziswa kwenqubo yokufafaza ngamathini kuye kwaba nomkhawulo owengeziwe.