(1) Mutsara
Kazhinji, upamhi hwemutsara wechiratidzo ndeye 0.3mm (12mil), upamhi hwemutsara wemagetsi ndeye 0.77mm (30mil) kana 1.27mm (50mil);chinhambwe chiri pakati pemutsara nemutsetse uye padhi yakakura kudarika kana yakaenzana ne0.33mm (13mil) ).Mukushandisa zvinoshanda, wedzera chinhambwe kana mamiriro achibvumidza;
Kana wiring density yakakwira, mitsetse miviri inogona kutariswa (asi isingakurudzirwe) kushandisa IC pini.Mutsara wakafara 0.254mm (10mil), uye mutsara wemutsara hausi pasi pe0.254mm (10mil).Mumamiriro ezvinhu akakosha, kana mapini emudziyo akakora uye hupamhi hwakatetepa, upamhi hwemutsara uye mutsara wemutsara unogona kudzikiswa zvakakodzera.
(2) Pedhi (PAD)
Izvo zvinodikanwa zvepads (PAD) uye maburi ekuchinja (VIA) ndeaya: dhayamita yedhisiki yakakura kupfuura dhayamita yegomba ne 0.6mm;semuenzaniso, general-purpose pin resistors, capacitor, uye integrated circuits, nezvimwewo, shandisa dhisiki/gomba saizi ye1.6mm/0.8 mm (63mil/32mil), masokisi, mapini uye diode 1N4007, zvichingodaro, tora 1.8mm/ 1.0mm (71mil/39mil).Mumashandisirwo chaiwo, inofanirwa kutariswa zvinoenderana nehukuru hwechikamu chaicho.Kana mamiriro akabvumidza, saizi yepadhi inogona kuwedzerwa zvakakodzera;
Chikamu chekuisa aperture chakagadzirwa paPCB chinofanira kunge chiri 0.2 ~ 0.4mm (8-16mil) yakakura kupfuura saizi chaiyo yepini yechikamu.
(3) Via (VIA)
Kazhinji 1.27mm/0.7mm (50mil/28mil);
Kana iyo wiring density yakakwira, iyo via size inogona kuderedzwa zvakafanira, asi haifanirwe kunge iri diki.Funga kushandisa 1.0mm/0.6mm (40mil/24mil).

(4) Pitch zvinodiwa pamapedhi, mitsetse, uye vias
PAD uye VIA: ≥ 0.3mm (12mil)
PAD uye PAD: ≥ 0.3mm (12mil)
PAD uye TRACK: ≥ 0.3mm (12mil)
TRACK uye TRACK: ≥ 0.3mm (12mil)
Pahigh density:
PAD uye VIA: ≥ 0.254mm (10mil)
PAD uye PAD: ≥ 0.254mm (10mil)
PAD uye TRACK: ≥ 0.254mm (10mil)
TRACK uye TRACK: ≥ 0.254mm (10mil)