(1) Umgca
Ngokubanzi, ububanzi bomgca wesignali yi-0.3mm (12mil), ububanzi bomgca wamandla ngu-0.77mm (30mil) okanye 1.27mm (50mil);umgama phakathi komgca kunye nomgca kunye nephedi inkulu okanye ilingana ne-0.33mm (13mil) ).Kwizicelo ezibonakalayo, ukwandisa umgama xa iimeko zivuma;
Xa ubuninzi be-wiring buphezulu, imigca emibini inokuqwalaselwa (kodwa ayikhuthazwa) ukusebenzisa izikhonkwane ze-IC.Ububanzi bomgca yi-0.254mm (10mil), kwaye isithuba somgca singekho ngaphantsi kwe-0.254mm (10mil).Ngaphantsi kweemeko ezikhethekileyo, xa izikhonkwane zesixhobo zixinene kwaye ububanzi buncinci, ububanzi bomgca kunye nesithuba somgca sinokuncitshiswa ngokufanelekileyo.
(2) Iphedi (PAD)
Iimfuno ezisisiseko zeepads (PAD) kunye nemingxuma yenguqu (VIA) yile: ububanzi bediski bukhulu kunobubanzi bomngxuma ngo-0.6mm;umzekelo, i-resistors ye-pin-purpose-purpose, i-capacitors, kunye neesekethe ezidibeneyo, njl., sebenzisa i-disk / ubungakanani bomgodi we-1.6mm / 0.8 mm (63mil / 32mil), i-sockets, izikhonkwane kunye ne-diode 1N4007, njl., Yamkela i-1.8mm / 1.0mm (71mil/39mil).Kwizicelo ezichanekileyo, kufuneka zimiselwe ngokobukhulu becandelo langempela.Ukuba iimeko zivuma, ubungakanani bepadi bunokwandiswa ngokufanelekileyo;
Indawo yokungena eyilwe kwi-PCB kufuneka ibe malunga ne-0.2～0.4mm (8-16mil) ibe nkulu kunobona bukhulu bepini yecandelo.
(3) Nge-(VIA)
Ngokubanzi 1.27mm/0.7mm (50mil/28mil);
Xa ukuxinana kwee-wiring kuphezulu, ubukhulu be- via bungancitshiswa ngokufanelekileyo, kodwa akufanele bube buncinci kakhulu.Cinga ukusebenzisa i-1.0mm/0.6mm (40mil/24mil).

(4) Iimfuno zepitch yeepads, imigca, kunye ne-vias
I-PAD kunye ne-VIA: ≥ 0.3mm (12mil)
I-PAD kunye ne-PAD: ≥ 0.3mm (12mil)
I-PAD kunye ne-TRACK: ≥ 0.3mm (12mil)
TRACK kunye TRACK: ≥ 0.3mm (12mil)
Kuxinaniso oluphezulu:
I-PAD kunye ne-VIA: ≥ 0.254mm (10mil)
I-PAD kunye ne-PAD: ≥ 0.254mm (10mil)
I-PAD kunye ne-TRACK: ≥ 0.254mm (10mil)
TRACK kunye TRACK: ≥ 0.254mm (10mil)