Musiyano uripo pakati peHDI board uye yakajairika PCB

Mukati mekuvaka kwemidziyo yemagetsi, PCB yakafanana neneural network yakaoma, inotakura chiratidzo chekufambisa uye kupa simba pakati pezvinhu zvemagetsi. Nekukurumidza kusimudzira kwehunyanzvi hwemagetsi kuenda kuminiaturization uye kuita kwepamusoro, mhando yepamusoro yePCB yabuda - HDI board. HDI bhodhi rakasiyana zvakanyanya kubva kune yakajairwa PCB mune zvakawanda zvinhu, izvo zvinokanganisa zvakanyanya mashandiro uye kusimudzira kutungamira kwemidziyo yemagetsi.


Tsanangudzo uye kusiyana kwemaitiro

Ordinary PCB ibhodhi rakadhindwa rinoumba chinongedzo-kune-chinongedzo uye chakadhindwa zvikamu pane inodzivirira substrate zvinoenderana neyakafanotemerwa dhizaini. Chimiro chayo chiri nyore. Iyo inowanzo gadzirwa nemhangura-akapfeka mabhodhi kuburikidza nekuchera, dunhu etching, electroplating uye mamwe maitiro. Kurongeka kwedunhu uye kuburikidza nezvirongwa zvakajairika, uye inokodzera zvigadzirwa zvemagetsi zvisingade nzvimbo yakakwirira uye kuita.

HDI mapuranga anosimbisa yakakwirira-density yekubatanidza. Inoshandisa micro-hole tekinoroji uye nzira dzepamberi senge laser drilling kuti uwane mamwe magetsi ekubatanidza munzvimbo diki. HDI mabhodhi anowanzo kuve akatetepa substrates uye akakwenenzverwa maseketi, uye nhamba yezvikamu zvakakura. Vanogona kubatanidza mamwe mabasa munzvimbo shoma, kuvandudza zvikuru kubatanidzwa kwezvigadzirwa zvemagetsi.


 Kuenzanisa nzira yekugadzira

Kuchera maitiro

Kuchera kwakajairika PCB kunowanzo tora nzira yekuchera, uye chibooreso chinotenderera pabhodhi yakavharwa yemhangura kuti iboore dhayamita inodiwa yegomba. Kunyangwe iyi nzira iri yakaderera-mutengo, iyo dhayamita yegomba yakakura, kazhinji pamusoro pe0.3mm, uye zviri nyore kuve nekutsauswa kwepamusoro-chaizvo kuchera kweakawanda-layer board.

HDI mabhodhi anoshandisa zvakanyanya laser drilling tekinoroji, achishandisa yakakwira-simba-density laser matanda kunyungudusa ipapo kana kunyungudutsa bhodhi kuti igadzire maburi madiki, uye dhayamita regomba rinogona kuita diki se0.1mm kana kunyange diki. Laser drilling ine yakanyanyisa kurongeka uye inokwanisa kuona akakosha makomba marudzi semabofu maburi (inongobatanidza rekunze layer uye yemukati layer) nemakomba akavigwa (kubatanidza yemukati layer uye yemukati layer), iyo inovandudza zvakanyanya kuchinjika uye density yekubatanidza mitsetse.


 Line etching process

Kana uchiisa mitsetse pamaPCB akajairwa, kutonga pamusoro pehupamhi hwemutsara uye kupatsanurwa kwemutsara kunogumira, uye hupamhi hwemutsara / mutsara mutsara unowanzo kutenderedza 0.2mm/0.2mm. Munguva ye etching process, matambudziko akadai seakakasharara mitsetse uye mitsetse isina kuenzana inowanzoitika, ichikanganisa kunaka kwekufambiswa kwechiratidzo.

Kugadzirwa kwemabhodhi eHDI kunoda yakanyanya kukwirisa etching etching. Yepamberi HDI bhodhi yekugadzira mitsetse inogona kuwana mitsetse yakafara / mitsara spacings yakaderera se 0.05mm/0.05mm kana kutopfuura. Nekushandisa yakawedzera kuomesesa midziyo yekuonesa uye etching maitiro, mitsetse yemitsara inovimbiswa kuve yakatsvinda uye upamhi hwemutsara hwakafanana, inosangana nezvinodiwa zvakaomesesa zvekumhanya-mhanya uye yakakwirira-frequency chiratidzo chekufambisa pamhando yemutsara.


Lamination process

Iyo lamination maitiro eakajairwa maPCB anonyanya kusanganisira kubatanidza akawanda akaturikidzana emhangura-akapfeka mabhodhi pamwe chete nekupisa kudzvanya, nekutarisa pakuona iyo yakakosha yekubatanidza kusimba pakati pematanho. Munguva yekugadzira lamination, zvinodiwa zve interlayer alignment yakarurama zvishoma.

Nekuda kwehuwandu hukuru hwematanho uye chimiro chakaoma cheHDI mabhodhi, iyo lamination process zvinodiwa zvakanyanya kuomarara. Haisi chete iyo mitsara inofanirwa kuiswa zvakasimba, asiwo yakakwirira-chaiyo interlayer alignment inofanirwa kuve nechokwadi kuti iwane chaiyo kubatana pakati pemakomba madiki nemasekete. Munguva yelamination process, maparamendi akadai setembiricha, kudzvanywa, uye nguva inoda kunyatsodzorwa kudzivirira kukanganisa senge interlayer offset uye mabubbles, uye kuve nechokwadi chekuita kwese kweHDI board.


 Kusiyana kwemaitiro ekuita

Magetsi zvinhu

MaPCB akajairwa ane zvimwe zvipimo maererano nekumhanya kwemasaini uye frequency. Sezvo frequency yechiratidzo ichiwedzera, matambudziko akadai sechiratidzo attenuation uye crosstalk zvishoma nezvishoma anove akakurumbira. Izvi zvinodaro nekuti mitsetse yayo yakakora uye hombe vias inoburitsa yakakura kuramba, inductance uye capacitance, inokanganisa kuvimbika kwechiratidzo.

HDI mabhodhi anovimba nemitsetse yakanaka uye micro-gomba dhizaini kuti ideredze zvakanyanya mutsara kuramba, inductance uye capacitance, zvinobudirira kuderedza kurasikirwa uye kupindira panguva yekufambisa kwechiratidzo. Inoita zvakanaka mukumhanya-mhanya uye yakakwira-frequency chiratidzo chekufambisa, uye inokwanisa kusangana nemamiriro ekushandisa akadai se5G kutaurirana uye yakakwirira-yekumhanyisa data chengetedzo ine zvakanyanyisa zvinodiwa zvemhando yekutumira chiratidzo.


Mechanical properties

Iyo mechanic simba yeakajairwa maPCB anonyanya kuenderana nechinhu uye ukobvu hweiyo substrate, uye kune mamwe mabhodhoro mu miniaturization uye kuonda. Nekuda kwechimiro chayo chakareruka, inotarisana nezvinetso senge board deformation uye solder joint cracking kana yaiswa mukunetseka kwakaoma.

HDI mabhodhi anoshandisa akatetepa, akareruka uye akasimba ma substrates, uye panguva imwechete inonatsiridza iyo yese mechanic kugadzikana nekugadzirisa iyo yakawanda-layer chimiro dhizaini. Ichiri kuona kutetepa, inogona kumirisana nehumwe dhigirii remagetsi kushushikana senge vibration uye kukanganisa, uye inokodzera nharembozha midziyo yemagetsi uye mamwe minda ane zvakaomesesa zvinodiwa pavhoriyamu uye huremu.


Nzvimbo dzekushandisa dzakasiyana

MaPCB akajairwa anoshandiswa zvakanyanya mune zvimwe zvigadzirwa zvemagetsi izvo zvisina zvakakwirira zvinodiwa pakuita uye nzvimbo nekuda kwemutengo wakaderera uye zviri nyore kugadzira, senge zvakajairwa midziyo yemumba (senge terevhizheni, michina yekuwachisa), yakaderera-yekupedzisira zvigadzirwa zvemagetsi zvevatengi (senge maredhiyo akajairwa, ari nyore kudzora kure) uye asiri-musimboti mativi edunhu mune mamwe maindasitiri ekudzora michina.

 

HDI mabhodhi anonyanya kushandiswa mumidziyo yemagetsi yepamusoro-soro nekuda kwekuita kwavo kwakanaka uye kugona kwekubatanidza kwepamusoro. Semuenzaniso, mafoni anofanirwa kubatanidza nhamba huru yemabasa munzvimbo diki, uye HDI mabhodhi anogona kuzadzisa zvavanoda zvekumhanya-mhanya chiratidzo chekufambisa, miniaturization, uye kuonda; mundima yekombuta, server mamaboards, epamusoro-ekupedzisira makadhi emifananidzo uye zvimwe zvikamu zvine zvakanyanyisa kuita zvinodiwa zvinoshandisawo HDI mabhodhi muhuwandu hukuru kuve nechokwadi chepamusoro-kumhanyisa data kugadzirisa uye kutapurirana; uyezve, munzvimbo dzakakwirira-dzakajeka dzakadai seaerospace uye midziyo yezvokurapa, HDI mabhodhi anoitawo basa rinokosha, kupa rubatsiro rwekushanda kwakagadzikana kwemaitiro akaoma emagetsi.

 

Pane misiyano yakakura pakati peHDI mabhodhi uye akajairwa maPCB maererano nekutsanangurwa kwechimiro, maitiro ekugadzira, maitiro ekuita uye nzvimbo dzekushandisa. Nehunyanzvi hwayo hwepamusoro uye kuita kwakanakisa, mabhodhi eHDI anoita basa rakakosha mukusimudzira kuvandudzwa kwemidziyo yemagetsi yakanangana neminiaturization uye kuita kwepamusoro, nepo maPCB akajairwa achiramba achiratidza mabhenefiti emitengo pakati nepakati-yekupedzisira-yekupedzisira nzvimbo dzekushandisa. Kunzwisisa mutsauko uripo pakati pezviviri zvichabatsira vagadziri vemidziyo yemagetsi kusarudza yakakodzera dhizaini bhodhi mhinduro zvinoenderana nezvinodiwa zvechigadzirwa uye kukurudzira kuenderera mberi kweindasitiri yemagetsi.