Isingeniso seNge-Pad:

Kuyaziwa ukuthi i-vias (VIA) ingahlukaniswa ibe plated ngokusebenzisa umgodi, imbobo eyimpumputhe futhi igqitshwe nge-vias hole, enemisebenzi ehlukene.

Ngokuthuthukiswa kwemikhiqizo ye-elekthronikhi, i-vias idlala indima ebalulekile ekuxhumaneni kwe-interlayer yamabhodi esekethe aphrintiwe.I-Via-in-Pad isetshenziswa kakhulu ku-PCB encane kanye ne-BGA (I-Ball Grid Array).Ngokuthuthuka okungenakugwemeka kokuminyana okuphezulu, i-BGA (i-Ball Grid Array) kanye ne-SMD chip miniaturization, ukusetshenziswa kobuchwepheshe be-Via-in-Pad kuya ngokuya kubaluleke kakhulu.

I-Vias in pads inezinzuzo eziningi ngaphezu kwe-vias eyimpumputhe nengcwatshwe:

.Ifanele iphimbo elihle le-BGA.

.Kuyinto elula ukuklama i-PCB ephakeme kakhulu futhi wonge isikhala sezintambo.

.Ukuphathwa okungcono kwe-thermal.

.I-Anti-low inductance kanye neminye idizayini enesivinini esikhulu.

.Inikeza indawo eyisicaba yezingxenye.

.Yehlisa indawo ye-PCB futhi uthuthukise izintambo.

Ngenxa yalezi zinzuzo, i-via-in-pad isetshenziswa kakhulu kuma-PCB amancane, ikakhulukazi kumiklamo ye-PCB lapho ukudluliswa kokushisa nesivinini esikhulu kudingekile ngephimbo le-BGA elilinganiselwe.Nakuba i-vias eyimpumputhe nengcwatshiwe isiza ukwandisa ukuminyana futhi yonge isikhala kuma-PCB, ama-vias kumaphedi aseyisinqumo esingcono kakhulu sokuphatha okushisayo kanye nezingxenye zokuklama ezinesivinini esikhulu.

Ngenqubo ethembekile ye-filling/plating capping process, ubuchwepheshe be-via-in-pad bungasetshenziswa ukukhiqiza ama-PCB anomthamo omkhulu ngaphandle kokusebenzisa izindlu zamakhemikhali nokugwema amaphutha okuthengisa.Ngaphezu kwalokho, lokhu kunganikeza izintambo ezengeziwe zokuxhuma zemiklamo ye-BGA.

Kunezinto ezahlukahlukene zokugcwalisa imbobo epuletini, ukunamathisela kwesiliva kanye nokunamathisela kwethusi kuvame ukusetshenziselwa izinto zokuqhuba, futhi i-resin ivame ukusetshenziselwa izinto ezingahlanganisi.