Ib qho, HDI yog dab tsi?

HDI: High Density interconnection ntawm cov ntawv luv, high-density interconnection, non-mechanical drilling, micro-dig muag qhov nplhaib hauv 6 mil lossis tsawg dua, sab hauv thiab sab nraud interlayer thaiv kab dav / kab sib txawv hauv 4 mil lossis tsawg dua, ncoo txoj kab uas hla tsis tshaj 0.35mm multilayer board ntau lawm yog hu ua HDI board.

Qhov muag tsis pom ntawm: luv luv rau qhov muag tsis pom ntawm, paub txog kev sib txuas ntawm cov txheej sab hauv thiab sab nrauv.

faus ntawm: luv rau Buried ntawm, paub txog kev sib txuas ntawm cov txheej sab hauv thiab txheej sab hauv.

Qhov muag tsis pom ntawm feem ntau yog qhov me me nrog txoj kab uas hla ntawm 0.05mm ~ 0.15mm, faus ntawm yog tsim los ntawm laser, plasma etching thiab photoluminescence, thiab feem ntau yog tsim los ntawm laser, uas tau muab faib ua CO2 thiab YAG ultraviolet laser (UV).

HDI board khoom

1.HDI phaj khoom RCC, LDPE, FR4

RCC: luv rau Resin coated tooj liab, resin coated tooj liab ntawv ci, RCC yog tsim los ntawm cov ntawv ci tooj liab thiab resin uas nws nto tau roughened, kub-resistant, oxidation-resistant, thiab lwm yam, thiab nws cov qauv yog qhia nyob rau hauv daim duab hauv qab no: (siv thaum lub thickness yog ntau tshaj 4mil)

Cov txheej txheej ntawm RCC muaj qhov ua tau zoo ib yam li FR-1/4 daim ntawv sib koom ua ke (Prepreg).Ntxiv rau qhov ua tau raws li qhov yuav tsum tau ua ntawm cov txheej txheem multilayer ntawm cov txheej txheem sib sau, xws li:

(1) High rwb thaiv tsev kev ntseeg tau thiab micro-conducting qhov kev ntseeg tau;

(2) Kev hloov pauv ntawm iav siab (Tg);

(3) Tsawg dielectric tsis tu ncua thiab nqus dej tsawg;

(4) High adhesion thiab lub zog rau tooj liab ntawv ci;

(5) Uniform thickness ntawm rwb thaiv tsev txheej tom qab kho.

Nyob rau tib lub sijhawm, vim tias RCC yog ib yam khoom tshiab uas tsis muaj iav fiber ntau, nws yog qhov zoo rau kev kho qhov etching los ntawm laser thiab ntshav, uas yog qhov zoo rau lub teeb yuag thiab thinning ntawm multilayer board.Tsis tas li ntawd, cov resin coated tooj liab ntawv ci muaj nyias tooj liab foils xws li 12 teev tsaus ntuj, 18 teev tsaus ntuj, thiab lwm yam, uas yooj yim rau txheej txheem.

Qhov thib peb, qhov kev txiav txim thawj zaug, qhov thib ob xaj PCB yog dab tsi?

Qhov kev txiav txim thawj zaug, qhov thib ob yog hais txog tus lej ntawm lub qhov laser, PCB core board siab ob peb zaug, ua si ntau lub qhov laser!Yog ob peb xaj.Raws li qhia hauv qab no

1 ib,.Nias ib zaug tom qab drilling qhov ==" sab nraud ntawm cov xovxwm ib zaug ntxiv tooj liab ntawv ==" thiab tom qab ntawd laser laum qhov

Qhov no yog thawj theem, raws li qhia hauv daim duab hauv qab no

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2, tom qab nias ib zaug thiab drilling qhov ==" sab nraud ntawm lwm daim ntawv tooj liab ==" thiab tom qab ntawd laser, drilling qhov ==" txheej txheej ntawm lwm daim ntawv tooj liab ==" thiab tom qab ntawd laser drilling qhov

Qhov no yog qhov kev txiav txim thib ob.Nws yog feem ntau tsuas yog teeb meem ntawm pes tsawg zaus koj laser nws, uas yog pes tsawg kauj ruam.

Qhov kev txiav txim thib ob yog muab faib rau hauv qhov sib dhos thiab sib cais qhov.

Cov duab hauv qab no yog yim txheej ntawm qhov thib ob-txheej txheej, yog 3-6 txheej thawj nias haum, sab nraud ntawm 2, 7 txheej nias, thiab ntaus lub qhov laser ib zaug.Tom qab ntawd cov 1,8 txheej yog nias thiab xuas nrig ntaus nrog laser qhov ib zaug ntxiv.Qhov no yog ua kom ob lub qhov laser.Qhov zoo ntawm qhov no vim nws yog stacked, cov txheej txheem nyuaj yuav yog me ntsis siab dua, tus nqi yog me ntsis siab dua.

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Daim duab hauv qab no qhia txog yim txheej ntawm ob qhov kev txiav txim hla qhov muag tsis pom kev, txoj kev ua haujlwm no yog tib yam li saum yim txheej thib ob ntawm qhov kev txiav txim thib ob, kuj yuav tsum tau ntaus lub laser qhov ob zaug.Tab sis lub laser qhov tsis yog stacked ua ke, cov txheej txheem nyuaj yog ntau tsawg.

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Kev txiav txim thib peb, plaub qhov kev txiav txim thiab lwm yam.