I-HDI: Uqhagamshelo oluphezulu lweNgxinano yesifinyezo, uqhagamshelo loxinaniso oluphezulu, ukugrumba okungekho matshini, ikhonkco lomngxunya eli-micro-blind kwi-6 mil okanye ngaphantsi, ngaphakathi nangaphandle kwe-interlayer wiring line ububanzi / i-gap yomgca kwi-4 mil okanye ngaphantsi, iphedi I-diameter engekho ngaphezu kwe-0.35mm yemveliso yebhodi ye-multilayer ibizwa ngokuba yibhodi ye-HDI.
Ubumfama nge: mfutshane kwi-Blind nge, iqonda unxibelelwano lonxibelelwano phakathi kwamaleya angaphakathi nangaphandle.
Ungcwatywa nge: mfutshane kuNgcwaba nge, ukuqonda unxibelelwano phakathi koqweqwe lwangaphakathi kunye nomaleko wangaphakathi.
Ubumfama ngokudlula ubukhulu becala ngumngxuma omncinci onobubanzi obuyi-0.05mm ~ 0.15mm, ungcwatywa ngendlela eyenziwe ngelaser, iplasma etching kunye nephotoluminescence, kwaye iqhele ukwenziwa ngelaser, eyahlulwe yaba yiCO2 kunye neYAG ultraviolet laser (UV).
HDI izinto zebhodi
1.HDI ipleyiti imathiriyeli RCC, LDPE, FR4
I-RCC: imfutshane kwi-Resin coated copper, i-resin coated copper foil, i-RCC yenziwe nge-foil yobhedu kunye ne-resin enomphezulu owenziwe rhabaxa, ukumelana nobushushu, ukumelana ne-oxidation, njl., kwaye isakhiwo sayo siboniswe kumfanekiso ongezantsi: xa ubukhulu bungaphezu kwe-4mil)
I-resin layer ye-RCC ine-processability efanayo ne-FR-1/4 yamaphepha adibeneyo (Prepreg).Ukongeza kokuhlangabezana neemfuno zokusebenza ezifanelekileyo zebhodi ye-multilayer yendlela yokuqokelela, efana nale:
(1) Ukuthembeka okuphezulu kwe-insulation kunye nokuthembeka komngxuma wokuqhuba i-micro-conducting;
(2) Ubushushu obuphezulu beglasi (Tg);
(3) Ukufunxwa kwe-dielectric ephantsi kunye namanzi aphantsi;
(4) Ukubambelela okuphezulu kunye namandla kwi-foil yobhedu;
(5) Ubukhulu obufanayo bomaleko wokugquma emva kokunyanga.
Kwangaxeshanye, ngenxa yokuba i-RCC luhlobo olutsha lwemveliso ngaphandle kwefayibha yeglasi, ilungele ukucofa unyango lomngxuma ngelaser kunye neplasma, elungele ubunzima obulula kunye nokuncipha kwebhodi ye-multilayer.Ukongeza, i-resin copper copper foil ineefoyile ezibhityileyo zobhedu ezifana ne-12pm, 18pm, njl., ekulula ukuqhubekeka.
Okwesithathu, yintoni i-odolo yokuqala, i-PCB yodidi lwesibini?
Le-oda yokuqala, yesibini-odolo libhekisela kwinani imingxuma laser, PCB core ibhodi uxinzelelo izihlandlo eziliqela, ukudlala imingxunya laser eziliqela!Ngaba imiyalelo embalwa.Njengoko kubonisiwe ngezantsi
1,.Ukucofa kube kanye emva kokugrumba imingxunya == "umphandle wokushicilela kwakhona ifoyile yobhedu == "kwaye emva koko ubhobhoza imingxuma ngelaser
Eli linqanaba lokuqala, njengoko kuboniswe kumfanekiso ongezantsi
2, emva kokucinezela kanye kunye nokugrumba imingxuma == "ngaphandle kwenye ifoyile yobhedu == "kwaye emva koko i-laser, imingxuma yokomba == "umaleko ongaphandle wenye ifoyile yobhedu == "kwaye emva koko imingxuma yokomba laser
Olu lulandelelwano lwesibini.Ikakhulu ingumbandela wokuba ubeka kangaphi ngelaser, ngamanyathelo amangaphi.
Ulungelelwaniso lwesibini lukwahlulwa lube yimingxuma eqokelelweyo kunye nemingxuma ecandiweyo.
Lo mfanekiso ulandelayo unamaleko asibhozo emingxunya ebekwe ngolandelelwano lwesibini, yi-3-6 umaleko wokuqala wocinezela, umphandle we-2, i-7 umaleko ucinezelwe phezulu, kwaye ubethe imingxuma ye-laser kube kanye.Emva koko iileya eziyi-1,8 zicinezelwe phezulu kwaye zibethelwa ngemingxunya yelaser kwakhona.Oku kukwenza imingxuma yelaser emibini.Olu hlobo lomngxuma kuba lubekwe phezulu, ubunzima benkqubo buya kuba buphezulu kancinci, ixabiso liphezulu kancinci.
Lo mzobo ungezantsi ubonisa iileya ezisibhozo zemingxunya enqamlezileyo yesibini-odolo, le ndlela yokucubungula iyafana nemigangatho esibhozo yemingxuma ebekwe ecaleni kwesibini, nayo kufuneka ibethe imingxuma ye-laser kabini.Kodwa imingxunya ye-laser ayifakwanga kunye, ubunzima bokucubungula buncinci kakhulu.
Umyalelo wesithathu, umyalelo wesine njalo njalo.