HDI: e phahameng Density interconnection ea khutsufatso, high-density interconnection, non-mechanical cheka, micro-blind lesoba reng ka 6 mil kapa ka tlaase ho moo, ka hare le ka ntle interlayer wiring mola bophara / lekhalo mola ka 4 mil kapa ka tlaase ho moo, pad. bophara ba tlhahiso e sa feteng 0.35mm ea multilayer board e bitsoa HDI board.
Blind via: short for Blind via, e hlokomela khokahanyo lipakeng tsa likarolo tse kahare le kantle.
E patoa ka: e khuts'oane bakeng sa Ho patoa ka tsela, ho lemoha kamano pakeng tsa lera le ka hare le lera le ka hare.
Bofofu hangata ke lesoba le lenyenyane le bophara ba 0.05mm ~ 0.15mm, le patiloeng ka tsela e entsoeng ka laser, plasma etching le photoluminescence, 'me hangata e thehoa ka laser, e arotsoeng ka CO2 le YAG ultraviolet laser (UV).
Lisebelisoa tsa boto ea HDI
1.HDI plate material RCC, LDPE, FR4
RCC: e khuts'oane bakeng sa koporo e koahetsoeng ka resin, foil ea koporo e koahetsoeng ka resin, RCC e entsoe ka foil ea koporo le resin eo bokaholimo ba eona bo thatafalitsoeng, bo manganga mocheso, bo sa chese oxidation, joalo-joalo, 'me sebopeho sa eona se bonts'itsoe setšoantšong se ka tlase: (e sebelisitsoeng ha botenya bo feta 4mil)
Sekhahla sa resin sa RCC se na le ts'ebetso e ts'oanang le ea FR-1 / 4 maqephe a kopantsoeng (Prepreg).Ntle le ho fihlela litlhoko tse nepahetseng tsa ts'ebetso ea boto ea multilayer ea mokhoa oa ho bokella, joalo ka:
(1) Tšepahala e phahameng ea ho kenya letsoho le ho tšepahala ha lesoba la micro-conducting;
(2) Mocheso o phahameng oa phetoho ea khalase (Tg);
(3) Monyetla o tlase oa dielectric kamehla le metsi a tlase;
(4) Ho khomarela holimo le matla ho foil ea koporo;
(5) Botenya bo lekanang ba lera la insuela ka mor'a ho phekola.
Ka nako e ts'oanang, hobane RCC ke mofuta o mocha oa sehlahisoa ntle le fiber ea khalase, e ntle bakeng sa phekolo ea sekoti ka laser le plasma, e leng molemo bakeng sa boima bo bobebe le ho fokotsa boto ea multilayer.Ntle le moo, foil ea koporo e koahetsoeng ka resin e na le lifolakha tse tšesaane tsa koporo joalo ka 12pm, 18pm, joalo-joalo, tseo ho leng bonolo ho li sebetsa.
Ea boraro, PCB ea pele, ea bobeli ke efe?
Taelo ena ea pele, ea bobeli e bua ka palo ea likoti tsa laser, khatello ea boto ea mantlha ea PCB ka makhetlo a 'maloa, ho bapala masoba a mangata a laser!Ke litaelo tse 'maloa.Joalokaha ho bontšitsoe ka tlase
1,.Ho tobetsa hang ka mor'a ho phunya masoba == "kantle ho mochine oa khatiso hang hape foil ea koporo == "ebe o phunya masoba ka laser
Ena ke mohato oa pele, joalokaha ho bontšitsoe setšoantšong se ka tlase
2, ka mor'a ho tobetsa hang le masoba a ho phunya == "ka ntle ho foil e 'ngoe ea koporo == "'me joale laser, masoba a cheka == "karolo e ka ntle ea foil e 'ngoe ea koporo == "ebe joale likoti tsa ho phunya ka laser
Ena ke taelo ea bobeli.Haholo ke taba feela ea hore na u e laser ka makhetlo a makae, ke hore na mehato e kae.
Ka mor'a moo, taelo ea bobeli e arotsoe ka likoti tse koetsoeng le masoba a arohaneng.
Setšoantšo se latelang ke mekhahlelo e robeli ea likoti tse phuthetsoeng ka tatellano ea bobeli, ke mekhahlelo e 3-6 ea pele ea khatiso e lekanang, bokantle ba 2, 7 layers e hateletsoe, ebe e otla masoba a laser hang.Ebe lihlopha tse 1,8 li hatelloa holimo ebe li phunyeletsoa ka masoba a laser hape.Sena ke ho etsa masoba a mabeli a laser.Sekoti sa mofuta ona hobane se phuthetsoe, bothata ba ts'ebetso bo tla ba bo phahameng hanyane, litšenyehelo li phahame hanyane.
Palo e ka tlase e bonts'a mekhahlelo e robeli ea likoti tse foufetseng tsa bobeli, mokhoa ona oa ho sebetsa o tšoana le likarolo tse robeli tse ka holimo tsa likoti tse phuthetsoeng ka taelo ea bobeli, hape li hloka ho otla likoti tsa laser habeli.Empa likoti tsa laser ha li kopane, bothata ba ho sebetsa bo fokola haholo.
Taelo ea boraro, taelo ea bone joalo-joalo.