HDI: yakakwira Density yekubatanidza kwechidimbu, yakakwirira-density yekubatanidza, isiri-mechanicha kuchera, micro-mapofu gomba mhete mu6 miriyoni kana pasi, mukati nekunze kweiyo interlayer wiring line hupamhi / mutsara gap mu4 mil kana zvishoma, pad. dhayamita isingapfuure 0.35mm multilayer board kugadzirwa inonzi HDI board.
Bofu kuburikidza ne: pfupi yeBofu kuburikidza, inoona mabatiro ekubatanidza pakati pemukati nekunze zvidimbu.
Kuvigwa kuburikidza ne: pfupi Kuvigwa kuburikidza, nekuziva kubatana pakati peiyo yemukati layer uye yemukati layer.
Bofu via kazhinji igomba diki rine dhayamita ye0.05mm ~ 0.15mm, yakavigwa kuburikidza inoumbwa nelaser, plasma etching uye photoluminescence, uye inowanzo umbwa nelaser, iyo yakakamurwa kuita CO2 uye YAG ultraviolet laser (UV).
HDI bhodhi zvinhu
1.HDI ndiro zvinhu RCC, LDPE, FR4
RCC: ipfupi yeResin yakavharwa mhangura, resin yakavharwa foil yemhangura, RCC inoumbwa nefoiri yemhangura uye resin iyo nzvimbo yakaomeswa, inodzivirira kupisa, inodzivirira oxidation, nezvimwewo, uye chimiro chayo chinoratidzwa mumufananidzo uri pazasi: (yakashandiswa apo ukobvu hunopfuura 4mil)
Iyo resin layer yeRCC ine yakafanana processability seFR-1/4 bonded sheets (Prepreg).Pamusoro pekusangana nezvinodiwa mashandiro eiyo multilayer board yenzira yekuunganidza, senge:
(1) High insulation kuvimbika uye micro-conducting gomba kuvimbika;
(2) High girazi shanduko tembiricha (Tg);
(3) Yakaderera dielectric nguva dzose uye yakaderera mvura kutorwa;
(4) Kunamatira kwakanyanya uye simba kune foil yemhangura;
(5) Uniform ukobvu hwe insulation layer mushure mekurapa.
Panguva imwecheteyo, nekuti RCC rudzi rutsva rwechigadzirwa chisina girazi fiber, yakanakira etching gomba kurapwa nelaser uye plasma, iyo yakanaka kune huremu huremu uye kutetepa kwemultilayer board.Pamusoro pezvo, iyo resin yakavharwa nemhangura foil ine yakatetepa yemhangura foil senge 12pm, 18pm, nezvimwewo, zviri nyore kugadzirisa.
Chechitatu, chii chekutanga-odha, yechipiri-odha PCB?
Iyi yekutanga-odha, yechipiri-kurongeka inoreva huwandu hwemalaser maburi, PCB core board pressure kakawanda, kutamba akati wandei laser maburi!Imaodha mashoma.Sezvinoratidzwa pasi apa
1,.Kudzvanya kamwe mushure mekuchera makomba == "kunze kwemushini kamwe zvakare foil yemhangura == "uyezve laser drill maburi
Iyi ndiyo nhanho yekutanga, sezvakaratidzwa mumufananidzo uri pasi apa
2, mushure mekudzvanya kamwe chete nekuchera makomba == "kunze kweimwe foil yemhangura == "uyezve laser, maburi ekuchera == "yekunze kweimwe foil yemhangura == "uyezve laser yekuchera maburi
Iyi ndiyo hurongwa hwechipiri.Inonyanya kungova nyaya yekuti kangani iwe paunoisa laser, ndiwo matanho mangani.
Kurongeka kwechipiri kunozokamurwa kuita makomba akaturikidzana uye makomba akatsemuka.
Mufananidzo unotevera ndiwo masere akaturikidzana echipiri-akarongedzerwa maburi, ari 3-6 akaturikidzana ekutanga kudzvanya kukwana, kunze kwe2, 7 akatsikirirwa kumusoro, uye kurova laser maburi kamwe.Ipapo iwo 1,8 akaturikidzana anotsikirirwa kumusoro uye nekuroverwa nemaburi e laser zvakare.Izvi ndezvekugadzira maviri laser maburi.Iri rudzi rwegomba nekuti rakaturikidzana, kuomerwa kwemaitiro kuchave kwakakwira zvishoma, mutengo wakakwira zvishoma.
Mufananidzo uri pazasi unoratidza masere akaturikidzana echipiri-yekuchinjika mapofu maburi, iyi nzira yekugadzirisa yakafanana nepamusoro sere maseru emakomba akaturikidzana echipiri, anodawo kurova maburi e laser kaviri.Asi maburi e-laser haana kusungirirwa pamwechete, kuoma kwekugadzirisa kunenge kushoma.
Kurongeka kwechitatu, kurongeka kwechina zvichingodaro.