I-HDI: Ukuminyana okuphezulu kwesifinyezo, ukuxhumana okuphezulu kokuminyana, ukubhola okungeyona imishini, indandatho yembobo engaboni kahle ku-6 mil noma ngaphansi, ngaphakathi nangaphandle kobubanzi bentambo ye-interlayer ububanzi / igebe lomugqa ku-4 mil noma ngaphansi, iphedi ububanzi obungekho ngaphezu kuka-0.35mm ukukhiqizwa kwebhodi lezingqimba eziningi kubizwa ngebhodi le-HDI.
Impumputhe nge: ifushane nge-Blind nge, ibona ukuxhumana phakathi kwezendlalelo zangaphakathi nezingaphandle.
Ingcwatshwe ngokuthi: kufushane kokuthi Ukungcwatshwa nge, ibona ukuxhumana phakathi kwesendlalelo sangaphakathi nesendlalelo sangaphakathi.
I-blind via ngokuvamile iyimbobo encane enobubanzi obungu-0.05mm~0.15mm, egqitshwe nge-laser, i-plasma etching ne-photoluminescence, futhi ngokuvamile yakhiwa nge-laser, ehlukaniswe yaba yi-CO2 ne-YAG ultraviolet laser (UV).
Izinto zebhodi le-HDI
1.HDI plate material RCC, LDPE, FR4
I-RCC: ifushanisa i-Resin coated copper, i-resin coated copper foil, i-RCC yenziwe nge-copper foil ne-resin okungaphezulu kwayo kuqinile, ukumelana nokushisa, ukumelana ne-oxidation, njll., futhi ukwakheka kwayo kukhonjisiwe esithombeni esingezansi: (isetshenzisiwe lapho ubukhulu bungaphezu kuka-4mil)
Ungqimba lwe-resin lwe-RCC lunokucutshungulwa okufanayo njengamashidi ahlanganisiwe we-FR-1/4 (Prepreg).Ngokungeziwe ukuhlangabezana nezidingo zokusebenza ezifanele zebhodi lezendlalelo eziningi zendlela yokuqoqa, njenge:
(1) Ukwethenjelwa okuphezulu kwe-insulation kanye nokuthembeka kwembobo encane yokuqhuba;
(2) Izinga lokushisa eliphezulu lengilazi (Tg);
(3) Ukumuncwa okuphansi kwe-dielectric kanye namanzi aphansi;
(4) Ukunamathela okuphezulu namandla ku-foil yethusi;
(5) Ugqinsi olulinganayo lwesendlalelo sokufakelwa ngemva kokuphulukiswa.
Ngesikhathi esifanayo, ngenxa yokuthi i-RCC iwuhlobo olusha lomkhiqizo ngaphandle kwe-fiber yengilazi, ilungele ukuqopha ukwelashwa kwembobo nge-laser ne-plasma, okulungele isisindo esilula kanye nokunciphisa ibhodi le-multilayer.Ngaphezu kwalokho, ucwecwe lwethusi oluhlanganiswe ne-resin lunama-foil ethusi amancane afana no-12pm, 18pm, njll., okulula ukuwenza.
Okwesithathu, ithini i-PCB yohlelo lokuqala, lwesibili?
Le-oda lokuqala, i-oda lesibili libhekisela enanini lezimbobo ze-laser, i-PCB core board pressure izikhathi eziningana, idlala izimbobo eziningi ze-laser!Ingabe ama-oda ambalwa.Njengoba kuboniswe ngezansi
1,.Ukucindezela kanye ngemva kokubhoboza izimbobo == "ngaphandle komshini kuphinda kucwecwe ithusi == "bese ubhoboza izimbobo nge-laser
Lesi yisigaba sokuqala, njengoba kukhonjisiwe esithombeni esingezansi
2, ngemva kokucindezela kanye nezimbobo zokumba == "ingaphandle lenye icwecwe lethusi == "bese kuba ngelaser, izimbobo zokumba == "ungqimba lwangaphandle lwenye ifoyili yethusi == "bese kuba nezimbobo zokumba nge-laser
Lolu wuhlelo lwesibili.Ikakhulukazi indaba nje yokuthi uyisebenzisa kangaki i-laser, lokho yizinyathelo ezingaki.
I-oda lesibili libe selihlukaniswa libe izimbobo ezinqwabelene kanye nezimbobo ezihlukanisiwe.
Isithombe esilandelayo siyizendlalelo eziyisishiyagalombili zezimbobo ezistakiwe zohlelo lwesibili, ziyizendlalelo ezingu-3-6 kuqala ukulingana kokucindezela, ngaphandle kwezingqimba ezingu-2, 7 zicindezelwe phezulu, futhi zishaye izimbobo ze-laser kanye.Bese izingqimba ezingu-1,8 zicindezelwa phezulu bese zishaywa ngezimbobo ze-laser futhi.Lokhu kwenzelwa ukwenza izimbobo ezimbili ze-laser.Lolu hlobo lwembobo ngoba luhlanganisiwe, ubunzima benqubo buyoba phezulu kancane, izindleko ziphakeme kancane.
Isibalo esingezansi sikhombisa izingqimba eziyisishiyagalombili ze-second-order cross blind holes, le ndlela yokucubungula iyafana nezingqimba ezingenhla eziyisishiyagalombili zezimbobo ezibekwe ngohlelo lwesibili, nazo zidinga ukushaya izimbobo ze-laser kabili.Kodwa izimbobo ze-laser azihlanganisiwe ndawonye, ubunzima bokucubungula buncane kakhulu.
I-oda lesithathu, i-oda lesine njalonjalo.