1.nnukwu njupụta interconnect (hdi) mbadamba sekit (pcbs) na-anọchi anya ọganihu dị ịrịba ama na nkà na ụzụ nkwakọ ngwaahịa eletrọnịkị, na-eme ka njupụta akụrụngwa dị elu na ịrụ ọrụ eletrik ka mma tụnyere pcbs omenala. Teknụzụ hdi na-eji microvias, kpuru ìsì, na vias e liri nwere dayameta na-adịkarị n'okpuru microns 150, na-enye ohere stacking multilayer na belata ọnụ ọgụgụ oyi akwa. Ihe owuwu a na-ebelata ogologo ụzọ mgbaama, na-eme ka iguzosi ike n'ezi ihe mgbaàmà site na ntugharị impedance a na-achịkwa, ma na-akwado ngwa ugboro ugboro ruo milimita-efegharị efegharị gafere 100 ghz. Mbelata site na ogologo stub na hdi chepụtara na-ebelata ntụgharị mgbama, dị oke mkpa maka ihu igwe dijitalụ dị elu dị ka pcie 5.0 na ddr5.

2.Usoro nrụpụta isi gụnyere mgbapu laser na uv ma ọ bụ co2 lasers maka nhazi microvia, nweta oke akụkụ ruo 1: 1, yana usoro lamination usoro nke nwere obere nrụgide iji gbochie agụụ resin. Usoro plating dị elu dị ka nke jupụtara site na electroplating ọla kọpa na-ahụ na enweghị ohere site na ndochi, ebe usoro mgbakwunye ọkara (sap) na-eme ka obosara obosara dị warara dị ka microns 25. Ihe ndị a na-ejikarị arụ ọrụ na-agụnye dielectrics dị ala dị ka epoxy gbanwetụrụ, polyphenylene ether (ppe), ma ọ bụ polymer kristal mmiri (lcp), na dielectric constants (dk) n'okpuru 3.5 na 10 ghz na dissipation factor (df) n'okpuru 0.005. A na-edozi njikwa thermal site na ọla kọpa jupụtara na vias nwere conductivity thermal ruo 400 w/mk, yana ihe ndị na-eme ka ọkụ na-ejikọta aluminom nitride ma ọ bụ boron nitride fillers, na-ahụ na okpomọkụ nke junction na-anọ n'okpuru 125 ° C na ngwa ụgbọ ala.

3.hdi pcbs na-egosipụta njirimara ndakọrịta elektrọnik dị elu (emc) n'ihi atụmatụ nhazi ala kachasị mma, dị ka nhazi site na-in-pad na akwa akwa agbakwunyere, na-ebelata nnyonye anya electromagnetic (emi) radieshon site na 15-20 db ma e jiri ya tụnyere fr4. Nleba anya imewe na-enye iwu njikwa mgbochi siri ike, nke na-abụkarị 50 ohms ± 5% maka ụzọ abụọ dị iche iche na oghere 25-56 gbps, yana iwu obosara / oghere ziri ezi n'okpuru 50/50 microns maka sekit rf. A na-enweta nkwụsị okwu mkparịta ụka site na ntụzịaka ikuku coplanar gbanyere mkpọrọgwụ ma na-amagharị site na nhazi, na-ebelata njikọ na ihe na-erughị -40 db.

4.Nyocha anya na-akpaghị aka (aoi) nwere mkpebi 5-micron, x-ray tomography maka nyocha 3d efu, na oge-ngalaba reflectometry (tdr) nke nwere oge ịrị elu 10-ps bụ usoro mmesi obi ike dị oke egwu. Usoro ndị a na-achọpụta ntụpọ microvia dị ka efere ezughị ezu ma ọ bụ ndebanye aha n'okpuru 20 microns. Ngwa dị n'usoro 5g nnukwu mimo antennas chọrọ 20-layer hdi stacks, ngwaọrụ ahụike nwere ike ịgbanye ya na soldermask dakọtara, modul lidar modul nwere 0.2-mm pitch bgas, yana satịlaịtị na-akwụ ụgwọ na-ezute ụkpụrụ ntụkwasị obi mil-prf-31032 klas 3.

5.Mmepe n'ọdịnihu na-elekwasị anya na ihe ndị dị mma dị n'okpuru 0.3 mm, na-achọ nhazi laser kpọmkwem (dls) maka nkọwa ahịrị 15-micron, yana mgbakwunye mmepụta ihe maka ntinye dị iche iche nke si photonics ma ọ bụ gan nwụrụ. nnabata gburugburu ebe obibi na-eme nyocha n'ime ihe na-enweghị halogen na okpomọkụ mgbanwe iko (tg) karịrị 180 Celsius, na elu na-enweghị isi na-emecha dị ka ọla edo na-enweghị nickel electroless palladium immersion gold (enepig), kwekọrọ na ntuziaka rohs 3. Mwekota ụlọ ọrụ 4.0 na-enyere aka nyochaa usoro oge site na iot-enyere aka ịsa ahụ, ebe igwe mmụta algọridim zụrụ azụ na onyonyo 10,000+ microvia na-enweta amụma amụma ntụpọ 99.3%. Teknụzụ hdi na-aga n'ihu na-eme ka mbelata nha 30-50% na ngwa eletrọnịkị enwere ike ka ọ na-ejigide mmepụta ihe n'elu 98.5% site na njikwa ike laser na-agbanwe agbanwe yana ihe nkiri ntọhapụ nano nwere mkpuchi na-ebelata nha nha.