1.i-high-density interconnect (i-hdi) iibhodi zesekethe eziprintiweyo (ii-pcbs) zimele ukuqhubela phambili okubonakalayo kwiteknoloji yokupakisha ye-elektroniki, eyenza ukuxinana kwecandelo eliphezulu kunye nokusebenza kombane okuphuculweyo xa kuthelekiswa neepcbs eziqhelekileyo. Itekhnoloji ye-hdi isebenzisa ii-microvias, ii-vias ezingaboniyo, kunye ne-vias engcwatyiweyo enobubanzi obungaphantsi kwe-150 ye-microns, ivumela ukupakishwa kwe-multilayer kunye nokubala okuncitshisiweyo. olu lwakhiwo lunciphisa ubude bendlela yomqondiso, luphucula imfezeko yomqondiso ngolawulo lwendlela ye-impedance, kwaye ixhasa usetyenziso lwe-frequency ephezulu ukuya kuthi ga kwimillimeter-wave kuluhlu olungaphezulu kwe-100 ghz. ukuncitshiswa ngobude be-stub kuyilo lwe-hdi ngakumbi ukuthomalalisa ukubonakaliswa komqondiso, okubaluleke kakhulu kujongano lwedijithali olunesantya esiphezulu esifana ne-pcie 5.0 kunye ne-ddr5.

2.iinkqubo eziphambili zokwenziwa zibandakanya ukugrumba i-laser nge-uv okanye i-co2 lasers yokwakheka kwe-microvia, ukufikelela kwi-aspect ratios ukuya kuthi ga kwi-1: 1, kunye nemijikelo yokulandelelana kwe-lamination kunye noxinzelelo oluphantsi loxinzelelo lokuthintela indlala ye-resin. ubuchule bokucwenga obuphezulu obufana nokuzaliswa nge-electroplating yobhedu iqinisekisa i-void-free ngokuzaliswa, ngelixa iinkqubo ze-semi-additive (incindi) yenza ukuba umkhondo wobubanzi bumxinwa njenge-25 microns. izinto ezisetyenziswa ngokuqhelekileyo ziquka ilahleko ephantsi ye-dielectrics efana ne-epoxy elungisiweyo, i-polyphenylene ether (i-ppe), okanye i-polymer ye-crystal engamanzi (lcp), ene-dielectric constants (dk) ngaphantsi kwe-3.5 kwi-10 ghz kunye nezinto zokulahla (df) phantsi kwe-0.005. Ulawulo lwe-thermal lulungiswa nge-vias ezaliswe lubhedu kunye ne-thermal conductivity ukuya kwi-400 w / mk, kunye ne-thermal conductive substrates ezibandakanya i-aluminiyam nitride okanye i-boron nitride fillers, ukuqinisekisa ukuba ukushisa kwe-junction kuhlala ngaphantsi kwe-125 ° c kwizicelo zemoto.

3.I-hdi pcbs ibonisa iimpawu eziphezulu zokuhambelana kombane we-electromagnetic (emc) ngenxa yezicwangciso ezisemgangathweni zokumisa, ezifana nokulungelelaniswa kwe-via-in-pad kunye neengqimba ze-capacitance edibeneyo, ukunciphisa ukuphazamiseka kwe-electromagnetic (emi) imitha nge-15-20 db xa kuthelekiswa noyilo olusekwe kwi-fr4. Iingqwalasela zoyilo zigunyazisa ulawulo olungqongqo lwe-impedance, ngokuqhelekileyo i-50 ohms ± 5% yezibini ezihlukeneyo kwi-interface ye-25-56 gbps, kunye nemithetho echanekileyo yobubanzi / isithuba esingaphantsi kwe-50/50 microns kwiisekethe ze-rf. Ucinezelo lwentetho enqamlezileyo luphunyezwa ngokusebenzisa amaza amaza e-coplanar asezantsi kwaye agxadazelwe ngamalungiselelo, ukunciphisa ukudibanisa ukuya ngaphantsi kwe -40 db.

4.Ukuhlolwa kwe-automated optical inspection (aoi) kunye nesisombululo se-5-micron, i-x-ray tomography ye-3d uhlalutyo lwe-void, kunye ne-time-domain reflectometry (tdr) kunye namaxesha okunyuka kwe-10-ps yimilinganiselo ebalulekileyo yokuqinisekisa umgangatho. obu buchule bokubona iziphene ze-microvia ezinje ngeplating engaphelelanga okanye ukubhaliswa kakubi ngaphantsi kwe-20 microns. izicelo span 5g ezinkulu mimo antenna arrays ezifuna 20-layer hdi stacks, izixhobo zonyango ezifakelweyo kunye biocompatible soldermask, iimodyuli zemoto lidar kunye 0.2-mm pitch bgas, kunye neentlawulo zesathelayithi intlanganiso mil-prf-31032 iklasi 3 imigangatho yokuthembeka.

5.Uphuhliso lwexesha elizayo lujolise kumacandelo epitch angaphantsi kwe-0.3 mm, efuna ulwakhiwo oluthe ngqo lwelaser (dls) kwiinkcazelo zomgca we-15-micron, kunye nokudibanisa ukuvelisa okongeziweyo kufakelo olwahlukileyo lwe-si photonics okanye i-gan dies. ukuthotyelwa kokusingqongileyo kuqhuba uphando kwizinto ezingenayo i-halogen kunye namaqondo okushisa eglasi (tg) angaphezu kwe-180 ° c, kunye ne-lead-free surface finishes njenge-electroless nickel electroless palladium immersion gold (enepig), ehambelana nezikhokelo ze-rohs 3. imboni ye-4.0 yokudibanisa yenza ukuba i-real-time monitoring monitoring ngokusebenzisa ii-iot-enabled plating baths, ngelixa i-algorithms yokufunda umatshini oqeqeshwe kwi-10,000 + imifanekiso ye-microvia ifezekisa i-99.3% yokuchaneka kwe-defect. iteknoloji ye-hdi iyaqhubeka nokwenza i-30-50% yokunciphisa ubungakanani kwi-electronics ephathekayo ngelixa igcina izivuno zokuvelisa ngaphezu kwe-98.5% ngokusebenzisa ulawulo lwamandla e-laser kunye ne-nano-coated release films ukunciphisa i-drill smear.