1.li-high-density interconnect (hdi) liboto tsa potoloho tse hatisitsoeng (pcbs) li emela tsoelo-pele e kholo ea theknoloji ea liphutheloana tsa elektroniki, e nolofalletsang sekhahla se phahameng sa likarolo le ts'ebetso e ntlafetseng ea motlakase ha e bapisoa le li-pcbs tse tloaelehileng. Theknoloji ea hdi e sebelisa li-microvias, li-vias tse foufetseng, le li-vias tse patiloeng tse nang le bophara bo ka tlase ho li-microns tse 150, tse lumellang hore ho be le li-multilayer stacking le ho fokotsa palo ea lera. moaho ona o fokotsa bolelele ba mats'oao a mats'oao, o ntlafatsa ts'epo ea mats'oao ka mokhoa o laoloang oa ho sitisa, 'me o ts'ehetsa lits'ebetso tsa maqhubu a holimo ho fihla ho millimeter-wave e fetang 100 ghz. e fokolitsoeng ka bolelele ba li-stub ho meralo ea hdi e boetse e fokotsa lipontšo tsa matšoao, e leng ea bohlokoa bakeng sa likhokahano tsa dijithale tse potlakileng joalo ka pcie 5.0 le ddr5.

2.lits'ebetso tsa bohlokoa tsa tlhahiso li kenyelletsa ho cheka ka laser ka UV kapa co2 lasers bakeng sa sebopeho sa microvia, ho fihlela likarolo tse fihlang ho 1: 1, le lipotoloho tse latellanang tsa lamination tse nang le likhatello tse tlase ho thibela tlala ea resin. Mekhoa e tsoetseng pele ea ho roala e kang ho tlatsoa ka koporo ea electroplating e netefatsa hore ha e na letho ka ho tlatsa, ha mekhoa ea semi-additive (sap) e nolofalletsa ho latela bophara ba li-microns tse 25. lisebelisoa tse sebelisoang hangata li na le tahlehelo e tlase ea dielectric tse kang epoxy e fetotsoeng, polyphenylene ether (ppe), kapa liquid crystal polymer (lcp), e nang le dielectric constants (dk) ka tlase ho 3.5 ho 10 ghz le lintlha tsa dissipation (df) tlas'a 0.005. tsamaiso ea mocheso e rarolloa ka li-vias tse tletseng koporo tse nang le mocheso oa mocheso ho fihla ho 400 w/mk, le li-substrates tse tsamaisang mocheso tse kenyelletsang aluminium nitride kapa li-filler tsa boron nitride, ho netefatsa hore mocheso oa mateano o lula o le ka tlase ho 125 ° c lits'ebetsong tsa likoloi.

3.li-pcbs tsa hdi li bonts'a litšoaneleho tse phahameng tsa ts'ebeliso ea motlakase (emc) ka lebaka la merero e ntlafalitsoeng ea motheo, joalo ka tlhophiso ea via-in-pad le likarolo tse kentsoeng tsa capacitance, ho fokotsa mahlaseli a sitiso ea motlakase (emi) ka 15-20 db bapisoa le meralo e thehiloeng ho fr4. menahano ea moralo e laela taolo e thata ea impedance, hangata 50 ohms ± 5% bakeng sa lipara tse fapaneng ho li-interface tsa 25-56 gbps, le melaoana e nepahetseng ea bophara / sebaka se ka tlase ho li-micron tse 50/50 bakeng sa lipotoloho tsa rf. Khatello ea lipuisano e fihlelleha ka li-waveguide tsa coplanar tse thehiloeng fatše le ho thekesela ka litlhophiso, ho fokotsa ho kopana ho isa tlase ho -40 db.

4.automated optical inspection (aoi) e nang le 5-micron resolution, x-ray tomography bakeng sa tlhahlobo ea lefeela ea 3d, le time-domain reflectometry (tdr) e nang le linako tsa ho phahama ha 10-ps ke mehato ea bohlokoa ea ho netefatsa boleng. mekhoa ena e lemoha mefokolo ea microvia joalo ka plating e sa fellang kapa ho ngolisoa hampe ka tlase ho 20 microns. lisebelisoa li na le 5g mimo antenna arrays tse hlokang 20-layer hdi stacks, lisebelisoa tsa bongaka tse kentsoeng tse nang le biocompatible soldermask, li-module tsa lidar tsa likoloi tse nang le 0.2-mm pitch bgas, le meputso ea sathelaete e kopanang le litekanyetso tsa mil-prf-31032 tsa sehlopha sa 3.

5.ntšetso-pele ea kamoso e shebane le likarolo tse ka tlase ho 0.3 mm, tse hlokang tlhophiso ea laser e otlolohileng (dls) bakeng sa litlhaloso tsa mela ea 15-micron, le kopanyo ea tlhahiso bakeng sa ho kengoa ka tsela e fapaneng ha si photonics kapa gan dies. Ho lumellana le tikoloho ho khanna lipatlisiso ka thepa e se nang halogen e nang le mocheso oa likhalase (tg) o fetang 180 ° c, 'me sebaka se se nang lead se fella joalo ka electroless nickel electroless palladium immersion gold (enepig), e tsamaellanang le litaelo tsa rohs 3. Indasteri 4.0 kopanyo e thusa ho beha leihlo ts'ebetso ea nako ea 'nete ka libate tsa plating tse nolofalitsoeng ke iot, ha li-algorithms tsa ho ithuta ka mochini tse koetlisitsoeng ka litšoantšo tse 10,000+ tsa microvia li fihlella ho nepahala ha 99.3% ea bofokoli. theknoloji ea hdi e ntse e tsoela pele ho thusa ho fokotsa boholo ba 30-50% ho lisebelisoa tsa elektronike tse nkehang ha li ntse li boloka lihlahisoa tsa tlhahiso ka holimo ho 98.5% ka ho laola matla a laser a feto-fetohang le lifilimi tsa nano-coated tokollo tse fokotsang drill smear.