Ngapha koko, i-PCB warping ikwabhekisa ekugobeni kwebhodi yesekethe, ebhekisa kwibhodi yesekethe yokuqala.Xa ibekwe kwi-desktop, iziphelo ezimbini okanye umbindi webhodi zivela kancinci phezulu.Le nto yaziwa ngokuba PCB warping kushishino.

Ifomula yokubala i-warpage yebhodi yesiphaluka kukubeka ibhodi yesekethe tyaba phezu kwetafile kunye neekona ezine zebhodi yesekethe emhlabeni kwaye ulinganise ukuphakama kwe-arch phakathi.Ifomula imi ngolu hlobo lulandelayo:

I-Warpage = ukuphakama kwe-arch / ubude becala elide le-PCB * 100%.

Umgangatho woshishino lwebhodi yesekethe yewarpage: Ngokwe-IPC — 6012(uhlelo luka-1996) "Inkcazo yokuchongwa kunye nokuSebenza kweeBhodi eziShicileleyo eziShicileleyo", ubuninzi bephepha lokulwa kunye nokuphazamiseka okuvunyelweyo ukuveliswa kweebhodi zeesekethe kuphakathi kwe-0.75% kunye ne-1.5%.Ngenxa yezakhono zenkqubo ezahlukeneyo zomzi-mveliso ngamnye, kukho iiyantlukwano ezithile kwiimfuno zolawulo lwephepha lempi le-PCB.Kuba 1.6 ibhodi eshinyeneyo eqhelekileyo iibhodi zesekethe multilayer, uninzi abenzi ibhodi yesekethe ukulawula warpage PCB phakathi 0.70-0.75%, ezininzi SMT, iibhodi BGA, iimfuno phakathi kuluhlu 0.5%, ezinye iifektri ibhodi yesekethe kunye nomthamo inkqubo eyomeleleyo unokuphakamisa umgangatho wephepha le-PCB ukuya kwi-0.3%.

Indlela yokuphepha ukulwa nebhodi yesekethe ngexesha lokuvelisa?

(1)Ulungelelwaniso lwe-semi-curred phakathi komaleko ngamnye kufuneka lulingane, umlinganiselo weebhodi zesekethe ezinemigangatho emithandathu, ubukhulu phakathi kwe-1-2 kunye ne-5-6 umaleko kunye nenani leeqhekeza ezinyangekileyo kufuneka zihambelane;

(2)Ibhodi engundoqo ye-PCB enemigangatho emininzi kunye neshiti lokunyanga kufuneka lisebenzise iimveliso zomthengisi ofanayo;

3

Indlela yokuthintela ukulwa nebhodi yesekethe?

1.Uyilo lobunjineli: i-interlayer semi-curing sheet sheet kufuneka ifaneleke;Ibhodi engundoqo ye-Multilayer kunye ne-semi-cured sheet iya kwenziwa kumboneleli ofanayo;Indawo yomzobo wendiza yeC/S yangaphandle isondele kangangoko, kwaye igridi ezimeleyo ingasetyenziswa.

I-2.Drying plate ngaphambi kokuvala: ngokubanzi i-150 degrees 6-10 iiyure, ingabandakanyi umphunga wamanzi kwi-plate, yenza ngakumbi ukuba i-resin iphilise ngokupheleleyo, isuse uxinzelelo kwi-plate;Iphepha lokubhaka ngaphambi kokuvula, zombini umaleko wangaphakathi kunye necala eliphindwe kabini lifuna!

3.Ngaphambi kokuba laminates, ingqalelo kufuneka ihlawulwe kwi ulwahlulo kunye ulwalathiso weft of ipleyiti eqinileyo: i-warp kunye ne-weft shrinkage ratio ayifani, kwaye ingqalelo kufuneka ihlawulwe ukwahlula ulwalathiso lwe-warp kunye ne-weft phambi kokuba i-laminating semi-solidified sheet;I-core plate kufuneka ihlawule ingqalelo kwisalathiso se-warp kunye ne-weft;Ulwalathiso oluqhelekileyo lwephepha lokunyanga ipleyiti lulwalathiso lwemeridian;Ulwalathiso olude lwecwecwe lobhedu luyi-meridional;Iileya ezili-10 ze-4OZ zamandla ishidi lobhedu

4.ubukhulu be-lamination ukuphelisa uxinzelelo emva kokucinezela okubandayo, ukunciphisa umda okrwada;

I-5.Baking plate ngaphambi kokugaya: i-150 degrees kwiiyure ze-4;

6.Kungcono ukuba ungahambi ngebrashi yokugaya ngomatshini, ukucocwa kweekhemikhali kuyacetyiswa;Isixhobo esikhethekileyo sisetyenziselwa ukukhusela ipleyiti ekugobeni nasekusongeni

7.Emva kokutshiza itoti kwibhastile elisicaba okanye ipleyiti yentsimbi ukupholisa ngokwendalo kubushushu begumbi okanye ukupholisa ibhedi edadayo emva kokucoca;