Unoziva here musiyano pakati pezvinhu zvakasiyana zvePCB board?

-Kubva kuPCB nyika,

Kupisa kwezvinhu, kunozivikanwawo sekudzoreredza moto, kuzvidzima, kuramba murazvo, kuramba moto, kuramba moto, kupisa uye kumwe kupisa, ndeye kuongorora kugona kwechinhu kuramba kupisa.

Muenzaniso wezvinhu zvinopisa unobatidzwa nemurazvo unoenderana nezvinodiwa, uye murazvo unobviswa mushure menguva yakatarwa.Chiyero chekupisa chinoongororwa maererano nehuwandu hwekupisa kwemuenzaniso.Pane nhanho nhatu.Iyo yakachinjika bvunzo nzira yemuenzaniso yakakamurwa kuita FH1, FH2, FH3 nhanho yetatu, yakatwasuka nzira yekuyedza yakakamurwa kuita FV0, FV1, VF2.

Iyo yakasimba PCB board yakakamurwa kuita HB board uye V0 board.

HB sheet rine low flame retardancy uye rinonyanya kushandiswa kune rimwe divi-mabhodhi.

VO bhodhi ine murazvo wakanyanya kudzoreredza uye inonyanya kushandiswa mumabhodhi ane mativi maviri uye akawanda-layer board.

Iyi mhando yePCB board inosangana neV-1 moto rating zvinodiwa inova FR-4 board.

V-0, V-1, uye V-2 mamakisi asingapinde mumoto.

Bhodhi redunhu rinofanirwa kunge risingachinji murazvo, harigone kupisa pane imwe tembiricha, asi rinogona kupfaviswa chete.Iyo tembiricha yenzvimbo panguva ino inonzi tembiricha yegirazi (Tg point), uye kukosha uku kune hukama nekudzikama kweiyo PCB board.

Chii chepamusoro Tg PCB redunhu bhodhi uye zvakanakira kushandisa yakakwira Tg PCB?

Apo kutonhora kwepamusoro Tg yakadhindwa bhodhi inokwira kune imwe nzvimbo, iyo substrate ichachinja kubva ku "girazi mamiriro" kusvika ku "rubber state".Tembiricha panguva ino inonzi tembiricha yegirazi (Tg) yebhodhi.Mune mamwe mazwi, Tg ndiyo tembiricha yepamusoro apo iyo substrate inochengetedza kuomarara.

Ndeapi marudzi chaiwo ePCB board?

Yakakamurwa negiredhi nhanho kubva pasi kusvika kumusoro sezvinotevera:

94HB - 94VO - 22F - CEM-1 - CEM-3 - FR-4

Mashoko acho ndeaya:

94HB: yakajairika makadhibhodi, kwete fireproof (yakaderera giredhi zvinhu, kufa punching, haigone kushandiswa semagetsi emagetsi bhodhi)

94V0: Flame Retardant Cardboard (Die Punching)

22F: Single-sided half glass fiber board (kufa kubaya)

CEM-1: Single-sided fiberglass board (kuchera komputa kunodiwa, kwete kufa kubaya)

CEM-3: Kaviri-kumativi hafu yegirazi fiber board (kunze kwekaviri-mativi makadhibhokisi, ndiyo yakaderera yekupedzisira zvinhu zvepaviri-mativi bhodhi, nyore

Nyaya iyi inogona kushandiswa pamapanera maviri, inova 5 ~ 10 yuan/square mita yakachipa pane FR-4)

FR-4: Kaviri-sided fiberglass board

Chii chakakwira Tg PCB redunhu bhodhi uye zvakanakira kushandisa yakakwira Tg PCB.Kana kutonhora kuchikwira kune imwe nzvimbo, iyo substrate ichachinja kubva ku "girazi mamiriro" kuenda ku "rubber state".

Tembiricha panguva iyoyo inonzi tembiricha yegirazi (Tg) yendiro.Mune mamwe mazwi, Tg ndiyo tembiricha yepamusoro (° C) apo iyo substrate inochengetedza kuomarara.Kureva kuti, zvakajairwa PCB substrate zvinhu hazvingoburitse kupfava, deformation, kunyunguduka uye zvimwe zviitiko pakupisa kwakanyanya, asi zvakare zvinoratidza kudzikira kwakanyanya mumakanika uye magetsi maitiro (ndinofunga haudi kuona kurongeka kwePCB mabhodhi. uye ona mamiriro aya mune zvigadzirwa zvako. ).

Iyo general Tg ndiro inodarika 130 madhigirii, iyo yakakwira Tg inowanzopfuura 170 madhigirii, uye yepakati Tg inodarika 150 madhigirii.

Kazhinji PCB yakadhindwa mapuranga ane Tg ≥ 170 ° C inonzi yakakwirira Tg yakadhindwa mabhodhi.

Sezvo Tg ye substrate inowedzera, kupisa kwekushisa, kupikisa kwehunyoro, kupikisa kwemakemikari, kugadzikana uye mamwe maitiro ebhodhi rakadhindwa zvichavandudzwa uye kuvandudzwa.Iyo yakakwira iyo TG kukosha, zviri nani kupikisa tembiricha yebhodhi, kunyanya mukutungamira-isina maitiro, uko yakakwirira Tg maapplication akajairika.

High Tg inoreva kupisa kwakanyanya.Nekukurumidza kukurumidza kweindasitiri yemagetsi, kunyanya zvigadzirwa zvemagetsi zvinomiririrwa nemakomputa, kusimudzira kwekushanda kwepamusoro uye yakakwirira multilayers kunoda kupisa kwakanyanya kwePCB substrate zvinhu sevimbiso yakakosha.Kubuda nekusimudzirwa kwehunyanzvi hwekusimudzira tekinoroji inomiririrwa neSMT neCMT yakaita kuti maPCB awedzere kuparadzaniswa kubva pakutsigirwa kwekupisa kwakanyanya kwema substrates maererano nekuvhura kudiki, wiring yakanaka, uye kutetepa.

Naizvozvo, musiyano pakati peyakajairwa FR-4 uye yakakwira Tg FR-4: iri munzvimbo inopisa, kunyanya mushure mekutora unyoro.

Pasi pekupisa, kune misiyano musimba remagetsi, kugadzikana kwedimensional, kunamatira, kunyura kwemvura, kuparara kwemafuta, uye kuwedzera kwekupisa kwezvinhu.High Tg zvigadzirwa zviri pachena zviri nani pane zvakajairwa PCB substrate zvinhu.

Mumakore achangopfuura, nhamba yevatengi inoda kugadzirwa kwepamusoro Tg mabhodhi akadhindwa yakawedzera gore negore.

Nekuvandudzwa uye kuenderera mberi kwehunyanzvi hwemagetsi, zvinodiwa zvitsva zvinogara zvichiiswa mberi kune zvakadhindwa redunhu bhodhi substrate zvinhu, nekudaro zvichisimudzira kuenderera mberi kwemhangura yakapfeka laminate zviyero.Parizvino, iwo makuru zviyero zve substrate zvinhu ndeaya anotevera.

① Zviyero zveNyika Parizvino, nyika yangu miyero yekumisikidzwa kwezvinhu zvePCB zve substrates zvinosanganisira GB/

T4721-47221992 uye GB4723-4725-1992, iyo copper clad laminate zviyero muTaiwan, China ndiyo CNS zviyero, izvo zvinoenderana neJapan JIs standard uye yakapihwa muna 1983.

②Mimwe mitemo yenyika inosanganisira: Japanese JIS standards, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN neVDE standards, French NFC neUTE standards, uye Canadian CSA Standards, Australia's AS standard, yekare. Soviet Union's FOCT standard, iyo yepasi rose IEC standard, nezvimwe.

Vatengesi vepakutanga PCB dhizaini zvinhu zvakajairika uye zvinowanzo shandiswa: Shengyi \ Jiantao \ International, nezvimwe.

● Gamuchira zvinyorwa: protel autocad powerpcb orcad gerber kana chaiyo bhodhi kopi bhodhi, nezvimwewo.

● Mapepa emhando: CEM-1, CEM-3 FR4, yakakwirira TG zvinhu;

● Maximum bhodhi saizi: 600mm * 700mm (24000mil * 27500mil)

● Kugadzira bhodhi ukobvu: 0.4mm-4.0mm (15.75mil-157.5mil)

● Nhamba yepamusoro yezvikamu zvekugadzirisa: 16Layers

● Copper foil layer ukobvu: 0.5-4.0(oz)

● Akapedza bhodhi ukobvu kushivirira: +/-0.1mm(4mil)

● Kugadzira saizi yekushivirira: kugaya komputa: 0.15mm (6mil) kufa punching ndiro: 0.10mm (4mil)

● Mutsara wakaderera wehupamhi / nzvimbo: 0.1mm (4mil) Mutsetse wehupamhi hwekutonga kugona: <+-20%

● Iyo shoma yegomba dhayamita yechigadzirwa chakapedzwa: 0.25mm (10mil)

Iyo shoma yekubaya gomba dhayamita yechigadzirwa chakapedzwa: 0.9mm (35mil)

Yakapedzwa gomba kushivirira: PTH: + -0.075mm (3mil)

NPTH: +-0.05mm(2mil)

● Yakapera gomba madziro mhangura ukobvu: 18-25um (0.71-0.99mil)

● Minimum SMT chigamba spacing: 0.15mm (6mil)

● Kuputira pamusoro: kemikari kunyudza goridhe, tin spray, nickel-plated goridhe (mvura/goridhe rakapfava), sirika sikirini yeblue glue, nezvimwe.

● Ukobvu hwemasolder mask pabhodhi: 10-30μm (0.4-1.2mil)

● Kusvuura simba: 1.5N/mm (59N/mil)

● Kuoma kwemask solder: > 5H

● Solder mask plug gole kugona: 0.3-0.8mm (12mil-30mil)

● Dielectric nguva dzose: ε = 2.1-10.0

● Insulation resistance: 10KΩ-20MΩ

● Hunhu impedance: 60 ohm±10%

● Thermal shock: 288℃, 10 sec

● Warpage yebhodhi rakapedzwa: <0.7%

● Chigadzirwa chekushandisa: midziyo yekukurukurirana, motokari yemagetsi, instrumentation, global positioning system, komputa, MP4, magetsi, midziyo yemumba, nezvimwewo.