Ƙa'ida: An samar da wani fim ɗin halitta akan saman jan ƙarfe na allon kewayawa, wanda ke ba da kariya ga saman jan ƙarfe mai kyau, kuma yana iya hana iskar oxygen da gurɓata yanayi a yanayin zafi mai yawa. Kaurin fim ɗin OSP gabaɗaya ana sarrafa shi a 0.2-0.5 microns.

1. Tsarin tsari: ragewa → wanke ruwa → micro-erosion → wanke ruwa → wanke acid → wanke ruwa mai tsabta → OSP → tsaftace ruwa mai tsabta → bushewa.

2. Nau'in kayan OSP: Rosin, Resin Active da Azole. Abubuwan OSP da Shenzhen United Circuits ke amfani da su a halin yanzu ana amfani da su azole OSPs.

Menene OSP surface jiyya tsari na PCB hukumar?

3. Features: mai kyau flatness, babu IMC da aka kafa tsakanin OSP fim da jan karfe na kewaye hukumar kushin, kyale kai tsaye soldering na solder da kewaye hukumar tagulla a lokacin soldering (mai kyau wettability), low zafin jiki aiki fasaha, low cost (low cost) Domin HASL), kasa da makamashi da ake amfani a lokacin aiki, da dai sauransu Ana iya amfani da a kan duka low-tech kewaye allon da high-yawa substrate guntu. PCB Proofing Yoko board tsokana da shortcomings: ① duba dubawa ne mai wuya, bai dace da mahara reflow soldering (gaba daya na bukatar sau uku); ② OSP fuskar fim yana da sauƙi don karce; ③ bukatun muhallin ajiya suna da yawa; ④ lokacin ajiya gajere ne.

4. Hanyar ajiya da lokaci: watanni 6 a cikin marufi (zazzabi 15-35 ℃, zafi RH≤60%).

5. SMT buƙatun buƙatun: ① Dole ne a kiyaye allon kewayawa na OSP a cikin ƙananan zafin jiki da ƙarancin zafi (zazzabi 15-35 ° C, zafi RH ≤60%) kuma kauce wa bayyanar da yanayin da ke cike da gas na acid, kuma taro ya fara a cikin sa'o'i 48 bayan cire kayan kunshin OSP; ② Ana ba da shawarar yin amfani da shi a cikin sa'o'i 48 bayan an gama yanki mai gefe guda, kuma ana bada shawara don ajiye shi a cikin ma'aunin zafi mai zafi maimakon marufi;