Nheyo: Imwe firimu yehupenyu inoumbwa pamusoro pemhangura yedare redunhu, iyo inodzivirira zvakasimba pamusoro pemhangura itsva, uye inogonawo kudzivirira oxidation uye kusvibiswa pakupisa kwakanyanya. OSP firimu ukobvu inowanzodzorwa pa 0.2-0.5 microns.

1. Kuyerera kwemaitiro: degreasing → kugeza mvura → micro-rosion → kugeza mvura → kugeza acid → kugeza mvura yakachena → OSP → kugeza mvura yakachena → kuomesa.

2. Mhando dzeOSP zvinhu: Rosin, Active Resin uye Azole. Zvishandiso zveOSP zvinoshandiswa neShenzhen United Circuits parizvino zvinoshandiswa zvakanyanya azole OSPs.

Chii chinonzi OSP pamusoro pekurapa maitiro ePCB board?

3. Zvimiro: yakanaka flatness, hapana IMC inoumbwa pakati peOSP firimu uye mhangura yedare redunhu padhi, zvichibvumira zvakananga soldering ye solder uye redunhu bhodhi mhangura panguva soldering (yakanaka wettability), yakaderera tembiricha yekugadzirisa tekinoroji, mutengo wakaderera (mutengo wakaderera) For HASL), simba shoma rinoshandiswa panguva yekugadzira, etc. Inogona kushandiswa pane ese ari pasi-tech dhigirii mabhodhi uye yakakwirira-denaging chip substrates. PCB Proofing Yoko board inokurudzira kukanganisa: ① kutarisisa kutaridzika kwakaoma, haina kukodzera kuwanda reflow soldering (kazhinji inoda katatu); ② OSP firimu pamusoro iri nyore kukwenya; ③ kuchengetedza nharaunda zvinodiwa zvakakwirira; ④ nguva yekuchengetedza ipfupi.

4. Nzira yekuchengetedza uye nguva: Mwedzi ye6 muvhavha yekuputira (kupisa 15-35 ℃, humidity RH≤60%).

5. SMT saiti zvinodiwa: ① Iyo OSP yedunhu bhodhi inofanirwa kuchengetedzwa pazasi tembiricha uye yakaderera humidity (tembiricha 15-35 ° C, humidity RH ≤60%) uye kudzivirira kuratidzwa kune zvakatipoteredza izere neasidhi gasi, uye gungano rinotanga mukati meawa 48 mushure mekuburitsa OSP package; ② Inokurudzirwa kuishandisa mukati meawa makumi mana nemasere mushure mekunge chidimbu chedivi rimwe chapera, uye zvinokurudzirwa kuti uichengetedze mune yakaderera-tembiricha kabhineti pane vacuum packaging;