Mabda'a: Filim dabiici ah ayaa lagu sameeyay dusha naxaasta ee guddiga wareegga, kaas oo si adag u ilaalinaya dusha naxaasta cusub, sidoo kale wuxuu ka hortagi karaa oksaydhka iyo wasakhowga heerkulka sare. Dhumucda filimka OSP waxaa guud ahaan lagu xakameynayaa 0.2-0.5 microns.

1. Socodka geedi socodka: hoos u dhigista → biyaha dhaqida → micro-esion → biyaha dhaqida → dhaqida aashitada → biyo saafi ah → OSP → biyo saafi ah → qallajin.

2. Noocyada qalabka OSP: Rosin, Resin Firfircoon iyo Azole. Alaabta OSP ee ay isticmaasho Shenzhen United Circuits ayaa hadda si weyn loo isticmaalaa azole OSPs.

Waa maxay habka daaweynta dusha OSP ee guddiga PCB?

3. Features: flatness wanaagsan, ma IMC waxaa la sameeyay inta u dhaxaysa filimka OSP iyo naxaasta guddiga wareegga wareegga, jidaynayey si toos ah alxanka alxanka iyo naxaasta guddiga wareegga inta lagu guda jiro alxanka (wettability wanaagsan), technology processing heerkulka hooseeyo, kharash yar (qiimaha jaban) Waayo, HASL), tamar yar waxaa loo isticmaalaa inta lagu guda jiro processing, iwm Waxaa loo isticmaali karaa labada loox-farsamo wareegga hoose iyo chips cufnaanta sare. PCB Proofing Yoko board waxay kicisaa cilladaha: ① Kormeerka muuqaalka waa adag yahay, kuma habboona alxanka dib u qulqulka badan (guud ahaan waxay u baahan tahay saddex jeer); ② Dusha filimka OSP way fududahay in la xoqo; ③ Shuruudaha deegaanka kaydinta ayaa sarreeya; ④ wakhtiga kaydinta waa gaaban yahay.

4. Habka kaydinta iyo wakhtiga: 6 bilood oo baakad vacuum ah (heerkulka 15-35 ℃, huurka RH≤60%).

5. Shuruudaha goobta SMT: ① guddiga wareegga OSP waa in lagu hayaa heerkul hoose iyo qoyaan hoose (heerkulka 15-35°C, qoyaan RH ≤60%) lagana fogaado soo-gaadhista deegaanka uu ka buuxo gaaska acid, kulankuna wuxuu bilaabmaa 48 saacadood gudahood ka dib marka la furo xirmada OSP; ② Waxaa lagu talinayaa in la isticmaalo 48 saacadood gudahood ka dib markii gabal hal dhinac ah la dhammeeyo, waxaana lagu talinayaa in lagu badbaadiyo armaajo heerkul hoose halkii baakadaha vacuum;