Ihame: Filime kama ikorwa hejuru yumuringa hejuru yumuzunguruko, irinda byimazeyo ubuso bwumuringa mushya, kandi irashobora no gukumira okiside n’umwanda ku bushyuhe bwinshi. Ubunini bwa firime ya OSP bugenzurwa kuri micron 0.2-0.5.

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2. Ubwoko bwibikoresho bya OSP: Rosin, Resin ikora na Azole. Ibikoresho bya OSP bikoreshwa na Shenzhen United Circuits kuri ubu bikoreshwa cyane azole OSPs.

Nubuhe buryo bwo kuvura hejuru ya OSP yubuyobozi bwa PCB?

3. Ibiranga: uburinganire bwiza, nta IMC ikorwa hagati ya firime ya OSP n'umuringa wibibaho byumuzunguruko, byemerera kugurisha mu buryo butaziguye kugurisha n’umuringa w’umuzunguruko mu gihe cyo kugurisha (wettability nziza), tekinoroji yo gutunganya ubushyuhe buke, igiciro gito (giciro gito) Kuri HASL), ingufu nke zikoreshwa mugihe cyo gutunganya, nibindi. Ubuyobozi bwa PCB Proofing Yoko butanga ibitagenda neza: inspection kugenzura isura biragoye, ntibikwiriye kugurishwa byinshi (muri rusange bisaba inshuro eshatu); Surface Ubuso bwa firime ya OSP biroroshye gushushanya; Ibidukikije bibikwa ni byinshi; Time igihe cyo kubika ni gito.

4. Uburyo bwo kubika nigihe: amezi 6 mugupakira vacuum (ubushyuhe 15-35 ℃, ubuhehere RH≤60%).

5. Ibisabwa bya SMT: board Ikibaho cy’umuzunguruko wa OSP kigomba kubikwa ku bushyuhe buke n’ubushyuhe buke (ubushyuhe 15-35 ° C, ubuhehere RH ≤60%) kandi ukirinda guhura n’ibidukikije byuzuye gaze ya aside, kandi guterana bitangira mu masaha 48 nyuma yo gupakurura paki ya OSP; ② Birasabwa kuyikoresha mu masaha 48 nyuma yuko igice kimwe kirangiye, kandi birasabwa kuzigama mu kabari gafite ubushyuhe buke aho gupakira vacuum;